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21.
Timely Effective Handover Mechanism in Heterogeneous Wireless Networks   总被引:1,自引:1,他引:1  
Next-generation wireless networks should be able to coordinate and integrate different communication systems. It has been a challenging problem to support a seamless handover in these diverse wireless network environments. Link level triggers can provide information about events which can help handover decision and layer 3 entities better streamline their handover related activities. In most conventional layer 2 triggering approaches, a pre-defined threshold for a specific perspective such as the received signal strength is used. This may cause too late or too early handover executions. In this paper we propose a new predictive handover framework that uses the neighbor network information to generate timely the link triggers so that the required handover procedures can appropriately finish before the current link goes down. First we estimate a required handover time for the given neighbor network conditions, then using a predictive link triggering mechanism the handover start time is dynamically determined to minimize handover costs. The handover costs are analyzed in terms of the total required handover time and the service disruption time. The numerical analysis and simulation results show that the proposed method significantly enhances the handover performance in heterogeneous wireless networks.  相似文献   
22.
This paper presents a behavioral model that can be used to improve the manufacturability of systems based on MEMS convective sensors. This model permits to handle faults related to process scattering, taking into account not only the electrical and lateral geometrical parameters but also the influence of the cavity depth. Moreover correlations between conductive and convective phenomena are included. The model is validated with respect to FEM simulations and a very good agreement is obtained between the behavioral model and FEM results. The proposed model can then be used in system-level simulations, for instance to evaluate the impact of process scattering on the performances of the sensing part and/or to investigate different design and calibration strategies with respect to the system robustness.  相似文献   
23.
Imaging intramyocardial vascular flows in real-time could strongly help to achieve better diagnostic of cardiovascular diseases. To date, no standard imaging modality allows describing accurately myocardial blood flow dynamics with good spatial and temporal resolution. We recently introduced a novel ultrasonic Doppler imaging technique based on compounded plane waves transmissions at ultrafast frame rate. The high sensitivity of this ultrafast Doppler technique permits to image the intramyocardial blood flow and its dynamics. A dedicated demodulation-filtering process is implemented to compensate for the large tissue velocity of the myocardium during the cardiac cycle. A signed power Doppler processing provides the discrimination between arterial and venous flows. Experiments were performed in vivo in a large animal open chest model ( N = 5 sheep) using a conventional ultrasonic probe placed at the surface of the heart. Results show the capability of the technique to image intramyocardial vascular flows in normal physiological conditions with good spatial (200 μm) and temporal resolution (10 ms). Flow dynamics over the cardiac cycle were investigated and the imaging method demonstrated a phase opposition of flow waveforms between arterial and venous flows. Finally, ultrafast Doppler combined with tissue motion compensation was found able to reveal vascular flow disruption in ischemic regions during occlusion of the main diagonal coronary artery.  相似文献   
24.
In a previous paper, a surface impedance formalism was given. Its application to interfaces modelling between homogeneous and frequency dependent media, was of great interest in the finite difference timedomain (fdtd) codes. In this paper, an extension of the method to dispersive media is presented. Applying this formalism to lossless Debye medium, the analytical expressions of the time- domain surface impedances are given. The implementation in a fdtd code permits then a numerical verification of the results in relation to the Fresnel method.  相似文献   
25.
Bousquet  Alain  Cremer  Helmuth  Ivaldi  Marc  Wolkowicz  Michel 《电信纪事》1995,50(2):297-305
Annals of Telecommunications - Le partage du risque est une des raisons les plus souvent avancées pour expliquer les clauses financières des contrats de licence. Pour autant, aucune...  相似文献   
26.
Adhesion studies of CVD copper metallization   总被引:2,自引:0,他引:2  
The adhesion of chemical vapor deposition (CVD) Cu thin films to various barriers was observed to improve with a post-deposition anneal or a physical vapor deposition (PVD) Cu flash layer on the barrier before depositing CVD Cu. The ambient exposure of the barrier before the deposition of CVD Cu has been observed to lead to degradation of adhesion in both CVD Cu seed and CVD/PVD Cu high vacuum integrated metallization schemes. The integrated CVD and PVD Cu deposition scheme exhibits better adhesion due to the inherent annealing provided during the PVD deposition which is carried out at temperatures between 300 and 400°C. We have evaluated both qualitative and quantitative tests — tape test, Stud pull test and 4-point bend test — in understanding adhesion and observed that each of these tests give different details of interface breakdown.  相似文献   
27.
The pedagogical product presented below is a practical work intended to the electrical engineering students, fourth year, of the National Institut of Applied Sciences of Rennes. This work is a part of filter realisation programme either in microstrip technology or lumped element. The aim of this practical work is restricted to calculate by optimizing all the basic parameters of the filter realization. Thus, an optimization and simulation work is performed on computer, by using a Touchstone software product of the Electronic Engineering Software society, to obtain parameter values close to the wished ones. This practical work is performed by groups of two students during three hours.  相似文献   
28.
Group communications (real‐time and non‐real‐time) refer to one‐to‐many or many‐to‐many communications. On the one hand, multicast is considered as an appropriate solution for supporting group communication‐oriented applications (we distinguish IP network multicast from application layer multicast). On the other hand, peer‐to‐peer model tends to be a good candidate for supporting today Internet applications (e.g. P2P IPTV, P2P VoIP, etc.). In this context, P2P has attracted significant interest in the recent years. This is mainly due to its properties that also make P2P well adapted to today social networks. In this paper, we propose GPM (Generic P2P Multicast): a novel generic and scalable approach, that optimizes multicast tree depth in P2P networks (structured and unstructured), and contributes to control the network overlay latency. For multicast tree construction, the approach we propose is based on a distributed algorithm using a specific data structures (adjacency and forwarding matrixes). GPM model inherits from P2P attributes such as scalability, flexibility and fault tolerance, while taking into consideration the respective characteristics of one‐to‐many and many‐to‐many type of applications. We also give a performance evaluation for validation and comparison purposes while considering some main existing application layer multicast protocols. Copyright © 2011 John Wiley & Sons, Ltd.  相似文献   
29.
This article deals with thermal impedances of microelectronic components that are useful in Simulation Programs with Integrated Circuit Emphasis (SPICE). In devices like heterojunction bipolar transistors, the active regions thicknesses are often much smaller than the substrates thicknesses. The devices can then be thermally assimilated to heat densities located on top of solid media. In addition to that, when the other dimensions of the heat sources are also much smaller than the substrates dimensions, it is reasonable to consider that the substrate is semi-infinite. First, the expression of the thermal impedance Z of a circular shape heat source centered on top of a half space is presented. For this purpose, the integral transform technique has been used to solve the tri-dimensional heat conduction equation in the frequency domain. The original expression is explicit, exact and allows obtaining results very quickly. After that, the case of a circular heat source on top of a cylinder is treated. A complete analysis of the substrate dimensions influence on the thermal impedance is done. It is based on the impedance decomposition into the one-dimensional impedance and the spreading impedance. By comparing these impedances with that obtained for the heat source on top of the semi-infinite medium, the threshold pulsation at which the thermal impedance of the finite medium differs from the thermal impedance of the half space is extracted. Moreover the geometrical criteria resulting in an error of less than 2% between the spreading impedance of the finite medium and the semi-infinite one are extracted. When these criteria are observed the impedance can be calculated using two perfectly known impedances: the spreading impedance of the semi-infinite medium and the one-dimensional impedance. The results are plotted on the Nyquist diagram, providing a compact representation. Finally the assumption of a circular shape heat source to approximate the thermal impedance of a square shape heat source is validated by evaluating the associated error. The calculation times have been compared to confirm the interest of using this hypothesis.  相似文献   
30.
This paper analyzes the possibilities and limitations of defect detection using fault model oriented test sequences. The analysis is conducted through the example of a short defect considering the static voltage test technique. Firstly, the problem of defect excitation and effect propagation is studied. It is shown that the effect can be either a defective effect or a defect-free effect depending on the value of unpredictable parameters. The concept of Analog Detectability Interval (ADI) is used to represent the range of the unpredictable parameters creating a defective effect. It is demonstrated that the ADIs are pattern dependent. New concepts (Global ADI, Covered ADI) are then proposed to optimize the defect detection taking into account the unpredictable parameters. Finally, the ability of a fault oriented test sequence to detect defect is discussed. In particular, it is shown that the test sequence generated to target the stuck-at faults can reasonably guarantee short defect detection till a limit given by the Analog Detectability Intervals.  相似文献   
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