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991.
992.
In this paper, we derive the impulse response of a fractional second order filter of the form (s2+as+b)−γ, where a,b?0 and γ>0. The asymptotic properties of the impulse responses are obtained. Moreover, based on the derived analytical impulse response, we show how to perform the discretization of the above fractional second order filter. Finally, a number of illustrated examples in time and frequency domains are provided as proofs of concepts. 相似文献
993.
采用Altera公司的Cyclone系列EP1C3T144C8作为控制芯片,QuartusⅡ为软件平台,用硬件描述语言设计了一个具有变频采样时钟和16路采样通道,基于VGA显示的逻辑分析仪.该设计方案利用FPGA内部的M4K块作为移位寄存器不断地进行读进数据的方式,提高了工作速度、性能稳定性以及分析的范围和质量.该逻辑... 相似文献
994.
995.
分析Multisim8和Protel99SE电子设计自动化(EDA)软件各自优势。提出一种将这两种软件相结合的电子电路设计方法。通过典型实例给出从Muhisim8电路仿真设计到Protel99SE印制电路板设计的基本流程.并验证该设计方法的有效性和实用性。 相似文献
996.
997.
Unique Features of Mobile Commerce 总被引:1,自引:0,他引:1
While the market potentials and impacts of web-based e-commerce are still in the ascendant, the advances in wireless technologies and mobile networks have brought about a new business opportunity and research attention, what is termed mobile commerce. Commonly, mobile commerce is considered to be another new application of existing web-based e-commerce onto wireless networks, but as an independent business area, mobile commerce has its own advantages and challenges as opposed to traditional e-commerce applications. This paper focuses on exploring the unique features of mobile commerce as compared with traditional e-commerce. Also, there are still some limitations arisen in m-commerce in contrast to web-based e-commerce. Finally, current state of mobile commerce in Japan is presented in brief, with an introduction of several cases involving mobile commerce applications in today's marketplace. 相似文献
998.
999.
Chip on glass (COG) technology is widely used in liquid crystal display (LCD) modules for connecting driver ICs to the displays especially for middle and small size panels. The most common COG technology currently used in display applications is based on anisotropic conductive films (ACF). As the increasing demand in higher resolution and cost reduction, the bump pitch of the driver ICs becomes finer and finer. With the reduction of bump pitch, the current ACF based COG technology is confronted with two issues: one is the increase of the chances of open circuit; the other is the increase of the chances of forming shorts. A new approach for ultra-fine pitch chip on glass (COG) bonding, named ”Particle on Bump (POB)”, is proposed in this paper. In this technique, conductive particles are planted on the top surface of bumps of a driver IC through Au–Sn intermetallic connection. The driver IC is then assembled on the glass substrate of a LCD panel with an insulated adhesive by thermal press. The new method ensures that electrical connections are established only between bumps and corresponding pads. The Au–Sn reflow process for particle planting and corresponding COG bonding process were investigated in detail. The results showed that reliable connections were formed between particles and bumps through an Au–Sn intermetallic layer and final COG interconnections thus formed performed well in reliability tests. It is concluded that the POB technique overcomes the shortcomings of current ACF technique and has good potential to provide a viable ultra-fine pitch flip chip on glass solution for display applications. 相似文献
1000.
本文探索了一种团队导师制下地方高校计算机专业程序设计实践创新能力培养模式,并结合相关课程建立了程序设计实践创新学习网站和辅导交流平台。实践教学结果表明,本文提出的培养模式能有效提高学生程序设计编程创新能力以及分析、解决实际工程项目的技能,增强了地方高校计算机专业学生核心竞争力。 相似文献