Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

TEM Studies of High Temperature Corrosion Behaviour of TiAl Intermetallics with Surface Modifications

The oxidation/sulphidation behaviour of a Ti‐46.7Al‐1.9W‐0.5Si alloy with a TiAl₃ diffusion coating was studied in an environment of H₂/H₂S/H₂O at 850^oC. The kinetic results demonstrate that the TiAl₃ coating significantly increased the high temperature corrosion resistance of Ti‐46.7Al‐1.9W‐0.5Si. The SEM, EDX, XRD and TEM analysis reveals that the formation of an Al₂O₃ scale on the surface of the TiAl₃‐coated sample was responsible for the enhancement of the corroison resistance. The Ti‐46.7Al‐1.9W‐0.5Si alloy was also modified by Nb ion implantation. The Nb ion implanted and as received sampels were subjected to cyclic oxidation in an open air at 800^oC. The Nb ion implantation not only increased the oxidation resistance but also substantially improved the adhesion of scale to the substrate.     

FIRE: fractal indexing with robust extensions for image databases

As already documented in the literature, fractal image encoding is a family of techniques that achieves a good compromise between compression and perceived quality by exploiting the self-similarities present in an image. Furthermore, because of its compactness and stability, the fractal approach can be used to produce a unique signature, thus obtaining a practical image indexing system. Since fractal-based indexing systems are able to deal with the images in compressed form, they are suitable for use with large databases. We propose a system called FIRE, which is then proven to be invariant under three classes of pixel intensity transformations and under geometrical isometries such as rotations by multiples of /spl pi//2 and reflections. This property makes the system robust with respect to a large class of image transformations that can happen in practical applications: the images can be retrieved even in the presence of illumination and/or color alterations. Additionally, the experimental results show the effectiveness of FIRE in terms of both compression and retrieval accuracy.     

Small–Capacity Modular Units. Experience in Startup and Management

A series of small–capacity units has recently been constructed in regions of oil field development and crude oil and gas condensate production to satisfy the requirements for such petroleum products as naphtha, diesel fuel, kerosene, and boiler fuel and to reduce costs for delivery of these products. There are almost no data in the technical literature, particularly in periodicals, on the construction and operation of small–capacity units. We attempt to generalize the experience of Orgeneftekhimzavody Trust in this area. We hope that this experience will be useful to specialists in the development and management of small–capacity plants.     

Application of convolutional error correcting codes in ultrawideband M-ary PPM signaling

The interference issues related to ultrawideband (UWB) radio pose tight restrictions on the maximum data rate of UWB radio telecommunication systems. A possible solution is to reduce the required signal to interference ratio (SIR) that gives satisfactory performance to the UWB system. In this letter, we propose coded M-ary UWB radio communication systems. Two classes of convolutional codes, namely, low-rate superorthogonal codes and high-rate punctured codes are considered for this purpose. Simulation results on the bit error rate of the proposed system indicates that the system is capable to work in lower SIR's and therefore supports higher data transmission rates in a real interference environment compared to the previously proposed UWB communication systems.     

Parameter Uncertainty and Policy Intensity: Some Extensions and Suggestions for Further Work

The effects of parameter uncertainty on optimal policy have been a matter of interest for academics, and even for some policymakers, for a long time. Two lines of literature have developed analytical results on this matter. The first line uses static models and the second dynamic models. In this dynamic line most of the results are confined to models with a single state and a single control variable. In this paper we want to encourage the analysis of more general dynamic cases. To do so, the results in the dynamic line are extended from one-state and one-control finite horizon models to models with a pair of control variables. We then discuss some of the hurdles which must be surmounted for the results to be made more general and suggests some lines for further research. JEL classification: C61; E61     

X-ray or UV adjustment of MOS threshold voltage: Analytical and numerical modeling

A model is formulated that describes how radiation-induced charge accumulates in the gate oxide of a MOS structure and how it decays through tunneling and thermal emission. The model is used in a numerical analysis of the x-ray or UV adjustment of threshold voltage in MOS-circuit manufacture. The limits of this process technique are evaluated.     

Nondegenerate Phase-Locking of a Semiconductor Laser by Sideband Injection

A semiconductor laser rate equation theory is presented that describes sideband injection locking under both weak optical injection and current modulation. By simultaneous optical injection and current modulation, control of both the phase and the frequency of a semiconductor laser is demonstrated. The phase-locked semiconductor laser operates at a different frequency to the optical injection source, with a frequency-difference given by the current modulation frequency. This method can be used to produce broadband sources, such as those producing ultrashort pulses and those required for coherent control, or to create high-frequency electronic oscillator sources with phase control by interference beating     

Second harmonic generation from a ferroelectric film

We derive an expression for transmittivity (T_SHG) of second harmonic generation (SHG) signals from a ferroelectric (FE) film. Intensities of up and down fields in the medium are investigated in relation to T_SHG. The derivations are made based on undepletion of input fields and nonlinear wave equation derived from the Maxwell equations. We present two cases: film without mirrors and with partial mirrors. Expressions for the newly derived nonlinear susceptibility coefficients of SHG for real crystal symmetry [J. Opt. Soc. Am. B 19 (2002) 2007] are used to get more realistic results. Variations in T_SHG with respect to film thickness are illustrated.