gpsOne定位技术研究

移动通信最显著的特点就是移动,因而自然会衍生一些和位置相关的服务需求.在不远的将来,电子邮件和定位服务将成为移动通信的两大支柱增值产业. 鉴于传统GPS及基于无线网络本身的定位技术在定位精度或定位灵敏度或系统建设或终端方面存在的重大缺陷,目前,世界上较流行的移动定位技术是无线网络辅助GPS技术及混合型定位技术.由于自身技术优势,gpsOne已无可争议的成为移动定位业界的首选技术.     

基于天线阵列的一种预处理LCLSCM多用户检测算法

给出了一种天线阵列信号的预处理方法,并将线性受限条件和判决反馈用于最小二乘,提出了一种基于天线阵列的预处理线性受限判决反馈最小二乘恒模多用户检测算法,称为PLC-DFB-LSCMA算法,并与判决反馈最小二乘恒模算法(DFB-LSCMA)及传统的最小二乘恒模算法(LSCMA)进行了仿真比较,仿真结果表明,PLC-DFB-LSCMA算法的信干比性能及误码性能仍优于后二者。     

基于空间域实现视频压缩传输方法的研究

针对不同用户对视频信号分辨率要求的不同,人们提出了许多降低分辨率的算法,其目的都是为了解决视频信号的传输对带宽的占用问题.因此,提高信噪比和降低带宽占用成为焦点.本文在分析了传统降低分辨率算法的基础上,提出了一种新的基于空间域的降低分辨率的改进算法.实验结果表明,本文方法不仅提高了信噪比,降低了带宽的占用,而且恢复之后的图像具有较好的视觉效果.     

内嵌金属导热通道环氧模塑料导热性能与模拟

设计了垂直与水平两种导热结构,用高导热金属铜为填料在环氧模塑料（EMC）中进行填充,通过热模压法制备了样品。采用双热流计稳态法对样品导热系数进行了测试,采用ANSYS软件对EMC的热传导规律进行了模拟,并与实验结果进行比较分析。研究发现,随着铜填充量的增加,EMC的导热系数随之提高,填充量仅为25vol％时垂直导热结构试样导热系数高达104．62W／m·K。相同填充量下,垂直导热结构样品的导热系数远高于水平导热结构样品,垂直导热结构样品随着铜填充量的增加导热系数增加速度也明显快于水平导热结构样品,并出现明显的渗逾效应。模拟结果与实验结果符合较好。     

微功耗数据采集系统的开发应用

对于以电池供电的数据采集系统,降低系统的功耗是保证系统长时间工作的关键.介绍了一套基于微功耗单片机和CF卡数据采集系统的开发与应用,该系统能够实时处理4通道信号的采集及存储,在水下稳定工作时间长达7小时.     

一种基于绝热电路的集成电路低功耗设计

能量通过电路损失后就会产生功耗,如能重新利用这种能量,就可以降低大部分功耗,这种技术称为能量恢复技术,其中绝热电路是一种常用的能量恢复技术,经常被用在大规模集成电路设计中,本文详细分析绝热电路的设计,以及在集成电路设计中的应用.     

基于LabVIEW8.2的多用虚拟电压表设计

为了满足不同测量的要求传统的电压表分别做成独立的仪表,包括峰值电压表、平均值电压表和有效值电压表.在此,提出采用虚拟仪器同时实现三种示值电压表的方案;介绍了虚拟仪器软件平台LabVIEW的特点.对虚拟数字电压表的设计和实现进行了详细描述,包括基于LabVIEW 8.2的虚拟信号发生器的实现过程,它能产生正弦、方波、三角波及由输入数学公式确定的复杂自编辑波形.最后,对设计的虚拟电压表运行结果进行分析,验证了虚拟电压表设计方法的正确性.     

Status and prospects for phosphor-based white LED packaging

The status and prospects for high-power, phosphor-based white light-emitting diode (LED) pack-aging have been presented. A system view for packaging design is proposed to address packaging issues. Four aspects of packaging are reviewed: optical control, thermal management, reliability and cost. Phosphor materials play the most important role in light extraction and color control. The conformal coating method improves the spatial color distribution (SCD) of LEDs. High refractive index (RI) encapsulants with high transmittance and modified surface morphology can enhance light extraction. Multi-phosphor-based packaging can realize the control of correlated color temperature (CCT) with high color rendering index (CRI). Effective thermal management can dissipate heat rapidly and reduce thermal stress caused by the mismatch of the coefficient of thermal expansion (CTE). Chip-on-board (COB) technology with a multi-layer ceramic substrate is the most promising method for high-power LED packaging. Low junction temperature will improve the reliability and provide longer life. Advanced processes, precise fabrication and careful operation are essential for high reliability LEDs. Cost is one of the biggest obstacles for the penetration of white LEDs into the market for general illumination products. Mass production in terms of CoB, system in packaging (SIP), 3D packaging and wafer level packaging (WLP) can reduce the cost significantly, especially when chip cost is lowered by using a large wafer size.     

Performance analysis of ARQ schemes with code combining over Nakagami-m fading channel

This article investigates the performance of hybrid automatic repeat request (HARQ) with code combining over the ideally interleaved Nakagami-m fading channel. Two retransmission protocols with coherent equal gain code combining are adopted, where the entire frame and several selected portions of the frame are repeated in protocols Ⅰ and Ⅱ, respectively. Protocol Ⅱ could be viewed as a generalization of the recently proposed reliability-based HARQ. To facilitate performance analysis, an approximation of the product of two independent Nakagami-m distributed random variables is first developed. Then the approximate analysis is utilized to obtain exact frame error probability (FEP) for protocol Ⅰ, and the upper bound of the FEP for protocol Ⅱ. Furthermore, the throughput performance of both two protocols is presented. Simulation results show the reliability of the theoretical analysis, where protocol Ⅱ outperforms protocol Ⅰ in the throughput performance due to the reduced amount of transmitted information.     

结构缺陷对电子设备屏蔽效果影响分析

在电子设备的屏蔽箱上开有各种用途的小孔或缝隙,外界的电磁干扰通过孔、缝进入到电子设备的内部,对内部电路造成干扰。从电磁干扰的传播途径出发,对在不同情况下结构缺陷对屏蔽效果的影响进行了分析,并提出了相应的改进措施,对电子设备的工程设计具有一定的指导意义。