94.
Reliable joints of Ti
3SiC
2 ceramic and TC11 alloy were diffusion bonded with a 50 μm thick Cu interlayer. The typical interfacial structure of the diffusion boned joint, which was dependent on the interdiffusion and chemical reactions between Al, Si and Ti atoms from the base materials and Cu interlayer, was TC11/α-Ti + β-Ti + Ti
2Cu + TiCu/Ti
5Si
4 + TiSiCu/Cu(s, s)/Ti
3SiC
2. The influence of bonding temperature and time on the interfacial structure and mechanical properties of Ti
3SiC
2/Cu/TC11 joint was analyzed. With the increase of bonding temperature and time, the joint shear strength was gradually increased due to enhanced atomic diffusion. However, the thickness of Ti
5Si
4 and TiSiCu layers with high microhardness increased for a long holding time, resulting in the reduction of bonding strength. The maximum shear strength of 251 ± 6 MPa was obtained for the joint diffusion bonded at 850 °C for 60 min, and fracture primarily occurred at the diffusion layer adjacent to the Ti
3SiC
2 substrate. This work provided an economical and convenient solution for broadening the engineering application of Ti
3SiC
2 ceramic.
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