High density packaging technology ultra thin package & new tab package

As electronic devices become more highly integrated, the demand for small, high pin count packages has been increasing. We have developed two new types of IC packages in response to this demand. One is an ultra thin small outline package (TSOP) which has been reduced in size from the standard SOP and the other, which uses Tape Automated Bonding (TAB) technology, is a super thin, high pin count TAB in cap (T.I.C.) package. In this paper, we present these packages and their features along with the technologies used to improve package reliability and TAB. Thin packages are vulnerable to high humidity exposure, especially after heat shock.1 The following items were therefore investigated in order to improve humidity resistance: (1) The molding compound thermal stress, (2) Water absorption into the molding compound and its effect on package cracking during solder dipping, (3) Chip attach pad area and its affect on package cracking, (4) Adhesion between molding resin and chip attach pad and its affect on humidity resistance. With the improvements made as a result of these investigations, the reliability of the new thin packages is similar to that of the standard thicker plastic packages.     

Plasma polymerized membranes and gas permeability. II

Thin films were deposited onto porous substrates by plasma polymerization using three kinds of organosilicic compounds, tetramethylsilane (TMS), hexamethyldisiloxane (M₂), and octamethylcyclotetrasiloxane (D₄). Those composite membranes showed different characteristics of gas permeability. When D₄ was plasma-deposited onto a porous substrate, the composites membrane showed the highest oxygen permeability and the lowest oxygen-to-nitrogen permeability ratio. The composite membrane prepared from TMS showed the permeability characteristics opposite to the membrane obtained from D₄. Infrared spectrum of the polymer from D₄ resembles that of dimethylpolysiloxane. The plasma polymers from TMS and M₂ showed different profiles in Si? O absorption bands in the range 1100–1000 cm^-1 or in absorption bands of SiCH₃ groups in the range 850–750 cm^-1 from respective monomers. X-ray photoelectron spectroscopic observation indicated that all the plasma polymers contained more than two species of Si atom with different oxidation states. The greater part of Si atoms in plasma polymers took the same oxidation states in corresponding monomer. The gas permeability characteristics were closely related to the oxidation states of Si atom in the plasma polymers.     

POROSITY AND RESIDUAL EQUILIBRIUM SATURATION OF SINTERED SPHERES OF GLASS BEADS

Sintered spheres(made of glass beads) were simply produced with a definite diameter, with a precision of ±0·5 mm in diameter, for a wide range of sintered angles (0-27°). The experimental values of the porosity of the sintered spheres were consistent with the calculated results for the coordination number N ≠ 8. The residual equilibrium saturation, as one of the basic physical properties of sintered glass beads was investigated experimentally and theoretically, resulting in the presence of a distribution in the angle of pendular ring.     

Radiation grafting of α,β,β-trifluorostyrene onto poly(ethylene–tetrafluoroethylene) film by preirradiation method. I. Effects of preirradiation dose,monomer concentration,reaction temperature,and film thickness

Preirradiation grafting of α,β,β-trifluorostyrene onto poly(ethylene–tetrafluoroethylene) film was studied. The trapped radicals formed upon irradiation were able to induce graft polymerization under appropriate conditions. The influences of the grafting conditions were analyzed kinetically. The grafting rate dependency on the preirradiation dose was found to be of order 0.3, and the monomer concentrations, 1.0. The overall activation energies for this grafting were calculated to be 6.2 × 10⁴ and 9.3 × 10³ J/mol below and above 50°C. The grafting rate was found to be independent of the film thickness, which ranged from 25 to 100 μm.     

Development of a new design simulator for poly‐Si TFTs to optimize the lightly doped drain structure

A new design simulator to simulate the characteristics of poly‐Si TFTs taking into account its physical structure was developed. By using the simulator, we can optimize the length and the sheet resistance of the LDD region in order to obtain sufficient ON currents and to suppress OFF currents under both dark and illuminated conditions.     

Changes in capacitance and dielectric dissipation factor of water‐treed XLPE with applied voltage

The capacitance C and dielectric dissipation factor tan δ of a water‐treed XLPE sheet sample have been measured under the application of 100 V or 1 kV at 60 Hz. The values of C and tan δ at 1 kV are much larger than those at 100 V. The value of tan δ gradually decreases with the length of exposure to a voltage of 1 kV. On the other hand, C is almost constant versus the exposure time. The results have been discussed on the basis of a model in which filling of channels interconnecting voids by water is taken into account. It has been found that the increase of C and tan δ is caused by the growth of the water‐filled channel region on the application of voltage. The gradual decrease in tan δ with the exposure time is explained by the change in the conductivity of the water‐filled channel region, as a result of which the relaxation time shifts to higher frequencies. © 2003 Wiley Periodicals, Inc. Electr Eng Jpn, 144(1): 12–20, 2003; Published online in Wiley InterScience ( www.interscience.wiley.com ). DOI 10.1002/eej.10160     

Synthesis of docosahexaenoic acid-rich triglyceride with immobilizedChromobacterium viscosum lipase

Docosahexaenoic acid (DHA) in the free fatty acid (FFA) derived from enzymically hydrolyzed tuna oil was concentrated by partial titration and precipitation of other FFA as sodium salts with acetone. A triglyceride containing up to 46.2% DHA was synthesized from the DHA-rich glyceride mixture and FFA by use of an immobilizedChromobacterium viscosum lipase.     

Stiffness of human arterial wall assessed by intravascular ultrasound

Little is known about the elastic properties of human arteries. Intravascular ultrasound (IVUS) can measure the instantaneous circumference or diameter of the arteries during a cardiac cycle, and so investigate human arterial elasticity in vivo. We studied 36 patients aged from 35 to 72 years classified into the ischemic heart disease (IHD) group (21 patients aged 39 to 71 years) and the non-ischemic heart disease (NIHD) group (15 patients aged 35 to 76 years) who had no atherogenic factors. The stiffness and wall morphology of six portions from the thoracic descending aorta to common iliac artery were measured by 8F, 15 MHz IVUS. The stiffness parameter, beta, was calculated as 1n (Pmax/Pmin)/(Cmax/Cmin-1), where P is arterial pressure, and C is the circumference of the artery. The thickness of the intima-media complex echo (Th) was used as a substitute for the wall thickness, and Th/D was calculated as an index of relative wall thickness, where D is the minimum luminal diameter. The pulse wave velocity (PWV) was measured with a conventional method. beta increased after branching of the renal artery and increased much more toward the periphery in comparison with the thoracic descending aorta in both groups. At all portions except the abdominal aorta after branching of the renal artery and the common iliac artery, beta was significantly larger in the IHD than the NIHD group. Th/D increased as well as beta in both groups. At all portions except after branching of the renal artery, Th/D was significantly larger in the IHD than the NIHD group.(ABSTRACT TRUNCATED AT 250 WORDS)