This paper deals with a robust stability problem for uncertain Lur’e systems with time-varying delays and sector-bounded nonlinearities. An improved delay-dependent robust stability criterion is proposed via a modified Lyapunov-Krasovskii functional (LKF) approach. Firstly, a modified LKF consisting of delay-dependent matrices and double-integral items under two delay subintervals is constructed, thereby making full use of the delay and its derivative information. Secondly, the stability criteria can be expressed as convex linear matrix inequality (LMI) via the properties of quadratic function application. Thirdly, to further reduce the conservatism of stability criteria, the quadratic generalized free-weighting matrix inequality (QGFMI) is used. Finally, some numerical examples, including the Lur’e system and the general linear time-delayed system, are presented to show the improvement of the proposed approach.
BN-SiO2-SiAlON composite ceramics were successfully prepared by the means of hot pressed sintering. Xe plasma flow generated by Hall Thruster was used for sputtering the surface of the samples in order to evaluate the plasma erosion resistance. XRD, TEM, SEM, and LSCM were used to characterize the phase composition and morphologies of as-made composite ceramics before and after Xe plasma erosion. The ceramics were composed of h-BN, fused silica, and SiAlON, which maintained structural stability during the process of Xe plasma sputtering. In conclusion, comparing with BN-SiO2 composite ceramics, the plasma erosion rate of BN-SiO2-SiAlON composite ceramics decreases significantly at first then rises with the increase of AlN addition. Erosion pits can be observed by using SEM on the surface after plasma sputtering, which demonstrates that the BN grains have dropped off the surface. In addition, mechanical denudation by high-speed Xe ions is recognized as the injury mechanism for the BN-matrix composite materials. 相似文献
The serious warpage issues of ultrathin chip-on-flex (UTCOF) assembly induced by mismatched thermal stresses have greatly affected the mechanical stability and reliability of emerging ultrathin chip packaging technology. Currently, a theoretical prediction as a convenient and straightforward approach is still lacked for describing effectively the thermal-mechanical behavior of UTCOF during the adhesive curing and cooling process. In consideration of the adhesive thickness approximating to ultrathin chip and flexible substrate thickness, we develop a layerwise-model of ultrathin chip-adhesive-flex structure under plain strain condition, where the behavior of thick adhesive bonding can be described precisely through increasing the subdivided mathematical plies. Further, the analytical results show that the concave and convex forms of ultrathin chip warpage yield at the end of the curing and cooling process respectively. Meanwhile, the effects of its structure dimensions and material properties are also revealed for discussing a way to relieve the extent of ultrathin chip warpage. Additionally, in order to verify the validity of the theoretical prediction, we also introduce the corresponding numerical technique and experimental method. These results suggest that a kind of rigid and ultrathin flexible substrate such as metal foil should be adopted for small warpage of ultrathin assembly. 相似文献
In order to consider the viscous effect,the introduction of a parametric dissipation and new results are realized by applying the new formulation combining and dynamic conditions over the free-surface with viscous terms. The dispersion equation is then modified by assuming an additional term in the boundary condition at the free-surface and wave-number becomes complex number with a small imaginary part which ensures the decay of wave amplitudes. The comparisons of numerical results and model test measurement on wave elevation at the moon-pool center is obtained both for the peak period and for the amplitude at resonance by choosing an appropriated dissipation coefficient. The results show that the introduce dissipation is not only effective but also reliable to provide realistic predictions. 相似文献
The compound (4-fluorophenyl)(phenyl) phosphine oxide (4-FPO) was designed, synthesized, and used in the modification of epoxy resin (EP). The 4-FPO-modified EP was prepared by curing the reaction mixture of diglycidyl ether of bisphenol A (DGEBA) and 4-FPO in the presence of 4,4′-diaminodiphenylsulfone (DDS). Compared with the unmodified EP, the limiting oxygen index value of the EP/4-FPO-0.6 (4-FPO-modified EP with 0.6 wt% of phosphorus) increased to 31.6%, and the sample achieved UL-94 V-0 rating. The peak of the heat release rate, average of the heat release rate, and total heat release of EP/4-FPO-0.6 were reduced by 39, 24, and 19%, respectively. Mechanism study showed that the quenching effect in the gas and barrier effect in the condensed phase were responsible for the enhanced flame-retardant properties of the 4-FPO-modified EP. The results showed that hydrophobicity and dielectric properties of the modified EP were clearly improved. 相似文献