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981.
Although lossy matching is not a standard antenna matching technique, well-designed losses can facilitate wide-band matching of otherwise unmatchable antennas. The lossy matching designs developed in this paper are based on the Pareto front. These Pareto front computations permit the circuit designer to graphically select optimal gain-reflection tradeoffs for lossy matching, readily incorporate other lossless matching bounds, and provide a general approach to difficult wide-band matching problems.  相似文献   
982.
Refraction of a microwave plane wave by a wedge with exact characterization of and is evaluated by a ray approach. Snell's Law is used for the lossless wedge, while exact formulations are used for the propagation constants and angle in the lossy wedge. The heavily lossy wedge produces negative refraction. Data are given on the loss factor that allows Snell refraction to be exactly reversed by lossy refraction, and the internal angle in the lossy wedge.  相似文献   
983.
984.
In this study, the authors investigated the extent to which factor and spatial structures of leisure interests (a) are similar to or distinct from the structure of vocational interests and (b) differ across 3 cohorts: college students (Mage = 19.6 years, SD = 1.23), working-age adults (Mage = 29.7, SD = 1.18), and retirees (Mage = 72.3 years, SD = 5.40). Factor analytic, multidimensional scaling, and covariance structure modeling strategies were used to assess the structure of leisure interests as measured with the Leisure Interest Questionnaire (J. C. Hansen, 1998). Only partial convergence was found for the structure of leisure interests with J. L. Holland's (1985) model of vocational interest structure, suggesting that researchers should be cautious about using vocational interests as markers for leisure interests. However, the similarity in structure of interests across the three samples was greater than hypothesized. Implications for research on leisure interests and for counseling practice are discussed. (PsycINFO Database Record (c) 2010 APA, all rights reserved)  相似文献   
985.
Recent observations of spawning lake trout Salvelinus namaycush near Drummond Island in northern Lake Huron indicate that lake trout use drumlins, landforms created in subglacial environments by the action of ice sheets, as a primary spawning habitat. From these observations, we generated a hypothesis that may in part explain locations chosen by lake trout for spawning. Most salmonines spawn in streams where they rely on streamflows to sort and clean sediments to create good spawning habitat. Flows sufficient to sort larger sediment sizes are generally lacking in lakes, but some glacial bedforms contain large pockets of sorted sediments that can provide the interstitial spaces necessary for lake trout egg incubation, particularly if these bedforms are situated such that lake currents can penetrate these sediments. We hypothesize that sediment inclusions from glacial scavenging and sediment sorting that occurred during the creation of bedforms such as drumlins, end moraines, and eskers create suitable conditions for lake trout egg incubation, particularly where these bedforms interact with lake currents to remove fine sediments. Further, these bedforms may provide high-quality lake trout spawning habitat at many locations in the Great Lakes and may be especially important along the southern edge of the range of the species. A better understanding of the role of glacially-derived bedforms in the creation of lake trout spawning habitat may help develop powerful predictors of lake trout spawning locations, provide insight into the evolution of unique spawning behaviors by lake trout, and aid in lake trout restoration in the Great Lakes.  相似文献   
986.
    
The small-molecule organic semiconductor 2,9-di-decyl-dinaphtho-[2,3-b:2′,3′-f]-thieno-[3,2-b]-thiophene (C10-DNTT) was used to fabricate bottom-gate, top-contact thin-film transistors (TFTs) in which the semiconductor layer was prepared either by vacuum deposition or by solution shearing. The maximum effective charge-carrier mobility of TFTs with vacuum-deposited C10-DNTT is 8.5 cm2/V s for a nominal semiconductor thickness of 10 nm and a substrate temperature during the semiconductor deposition of 80 °C. Scanning electron microscopy analysis reveals the growth of small, isolated islands that begin to coalesce into a flat conducting layer when the nominal thickness exceeds 4 nm. The morphology of the vacuum-deposited semiconductor layers is dominated by tall lamellae that are formed during the deposition, except at very high substrate temperatures. Atomic force microscopy and X-ray diffraction measurements indicate that the C10-DNTT molecules stand approximately upright with respect to the substrate surface, both in the flat conducting layer near the surface and within the lamellae. Using the transmission line method on TFTs with channel lengths ranging from 10 to 100 μm, a relatively small contact resistance of 0.33 kΩ cm was determined. TFTs with the C10-DNTT layer prepared by solution shearing exhibit a pronounced anisotropy of the electrical performance: TFTs with the channel oriented parallel to the shearing direction have an average carrier mobility of (2.8 ± 0.3) cm2/V s, while TFTs with the channel oriented perpendicular to the shearing direction have a somewhat smaller average mobility of (1.3 ± 0.1) cm2/V s.  相似文献   
987.
    
Flexible interconnects are one of the key elements in realizing next‐generation flexible electronics. While wire bonding interconnection materials are being deployed and discussed widely, adhesives to support flip‐chip and surface‐mount interconnections are less commonly used and reported. A polyurethane (PU)‐based electrically conductive adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10?5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU‐ECA enables various interconnection techniques in flexible and printed electronics: it can serve as a die‐attach material for flip‐chip, as vertical interconnect access (VIA)‐filling and polymer bump materials for 3D integration, and as a conductive paste for wearable radio‐frequency devices.  相似文献   
988.
    
Per Brinch Hansen 《Software》1994,24(5):467-483
This paper defines SuperPascal—a secure programming language for publication of parallel scientific algorithms. SuperPascal extends a subset of IEEE Standard Pascal with deterministic statements for parallel processes and synchronous message communication. A parallel statement denotes parallel execution of a fixed number of statements. A forall statement denotes parallel execution of the same statement by a dynamic number of processes. Recursive procedures may be combined with parallel and forall statements to define recursive parallel processes. Parallel processes communicate by sending typed messages through channels created dynamically. SuperPascal omits ambiguous and insecure features of Pascal. Restrictions on the use of variables enable a single-pass compiler to check that parallel processes are disjoint, even if the processes use procedures with global variables.  相似文献   
989.
    
Per Brinch Hansen 《Software》1995,25(1):109-109
The long division algorithm of Linger, Mills and Witt is discussed and found to be significantly slower than a recent algorithm developed by the author.  相似文献   
990.
European Food Research and Technology - Dünsschalige Kartoffeln der Sorten ?Bona” und ?Heida” wurden unmittelbar nach der Rodung in einer besonderen...  相似文献   
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