Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

On the convergence of the inverses of Toeplitz matrices and its applications

Many issues in signal processing involve the inverses of Toeplitz matrices. One widely used technique is to replace Toeplitz matrices with their associated circulant matrices, based on the well-known fact that Toeplitz matrices asymptotically converge to their associated circulant matrices in the weak sense. This often leads to considerable simplification. However, it is well known that such a weak convergence cannot be strengthened into strong convergence. It is this fact that severely limits the usefulness of the close relation between Toeplitz matrices and circulant matrices. Observing that communication receiver design often needs to seek optimality in regard to a data sequence transmitted within finite duration, we define the finite-term strong convergence regarding two families of matrices. We present a condition under which the inverses of a Toeplitz matrix converges in the strong sense to a circulant matrix for finite-term quadratic forms. This builds a critical link in the application of the convergence theorems for the inverses of Toeplitz matrices since the weak convergence generally finds its usefulness in issues associated with minimum mean squared error and the finite-term strong convergence is useful in issues associated with the maximum-likelihood or maximum a posteriori principles.     

从PZT体系看无铅压电陶瓷的可能应用

总结了主要以(Bi0.5Na0.5)TiO3和NaNbO3为基的无铅压电陶瓷的性能，以Pb(Ti，Zr)TiO3基二元系、三元系压电陶瓷的性能与应用为参考，分析了无铅压电陶瓷可能的器件应用。此外，还对拓宽无铅压电陶瓷应用需要改进的性能提出了建议。     

量子密码技术开辟通信安全新时代

量子密码技术被认为是绝对安全的加密技术。近年来,在美国、德国、日本和中国,相关研究都取得了明显进展。2004年6月,世界上第一个量子密码通信网络在美国马萨诸塞州剑桥城正式投入运行,标志着这一技术迈上了新台阶。据相关机构估算,量子保密通信系统一旦商用,将形成高达10亿美元的市场。     

Al、Mo含量对铸造钛合金力学性能的影响

运用正交实验 ,考察了Al、Mo含量对Ti Al Mo 1Zr系铸造钛合金力学性能的影响。试验结果表明 :随Al、Mo含量提高 ,铸造合金的强度增加 ,塑性和冲击韧性降低 ,但Al、Mo的交互作用却使合金塑性提高 ,强度和冲击韧性降低     

海底输油管道内智能引导装置研究

对海底输油管道内智能引导装置研究的必要性进行了分析;介绍了国内外在该领域的技术发展状况。针对智能引导装置的作业对象和环境,提出了技术要求和指标,对智能引导装置进行了总体设计,分析了其作业机理,建立了力学模型并进行了计算。对智能引导装置的控制系统进行了设计,提出了设计过程中应注意的问题。所研制的管内轮式智能引导装置具有质量轻、输出牵引力大、体积小、结构紧凑等特点,对较小管内空间类似系统的设计有一定参考价值。     

网络管理中事件关联检测机制的研究

网络事件的关联检测是网络管理需要解决的一个关键问题,本文根据分布式网络管理的特点,首次明确定义了网络事件的基本关联关系,在此基础上提出了一种基于Petri Net的事件关联检测机制,实现了基于事件内容的细粒度关联检测,并且在事件检测中充分考虑了时间因素,有效地提高了事件关联检测的准确性。     

The pharmacokinetics of pancuronium bromide in infants, children and adults

Laparoscopic retroperitoneal lymph node dissection is a new surgical procedure used to enhance staging in men with clinical stage I nonseminomatous germ cell tumors of the testis. The procedure has been performed in a limited number of patients at several centers with extensive laparoscopic experience. Laparoscopic retroperitoneal lymphadenectomy is a technically demanding procedure which can be successfully completed in the majority of patients. However, the risk of complications is greater than in patients who undergo standard open retroperitoneal lymph node dissection. The primary advantage of a laparoscopic approach is shortened hospitalization and rapid return to normal activity. The role of laparoscopy in the management of patients with testis malignancy has not been defined. The use of this staging procedure may help minimize the need for surveillance studies following surgery and may be best utilized in men with a lower likelihood of nodal metastases. Ultimately, prospective study in large groups of patients will be necessary to determine the role of laparoscopic retroperitoneal lymph node dissection in patients with testis cancer.     

一种多晶硅高温压力传感器

制作压力传感器时，在二氧化硅层上淀积多晶硅膜，既可利用优良的机械特性，又可保证压敏电阻与衬底间具有良好的绝缘性，由此可大大提高器件的温度特性。介绍了一种多晶硅压力传感器的原理和设计。实验结果表明，这类传感器具有灵敏度好，精度高等特点，电路工作范围为０－２５０℃，且具有良好的温度稳定性。     

以网格曲线为连续条件的光滑曲面

本文提出一种以网格边界曲线定义曲面的方法。曲面的计算式唯一地由网格的四条边界线的参数而定，各网格间连接的光滑度完全由网格间的边界线的光滑度来决定。当网格间的边界线具有Ｃ~１连续以上的光滑度时，网络曲面间将自动保证是Ｃ~１连续的，否则将是Ｃ~０连续。利用这个方法，可以方便地从线框模型（ｗｉｒｅ－ｆｒａｍｅｍｏｄｅｌ）建立面模型（ｓｕｒｆａｃｅｍｏｄｅｌ）。