Improvement of the efficiency of triple junction n-i-p solar cells with hot-wire CVD proto- and microcrystalline silicon absorber layers

Hot-wire chemical vapour deposition (HWCVD) was applied for the deposition of intrinsic protocrystalline (proto-Si:H) and microcrystalline silicon (μc-Si:H) absorber layers in thin film solar cells. For a single junction μc-Si:H n-i-p cell on a Ag/ZnO textured back reflector (TBR) with a 2.0 μm i-layer, an 8.5% efficiency was obtained, which showed to be stable after 750 h of light-soaking. The short-circuit current density (J_sc) of this cell was 23.4 mA/cm², with a high open-circuit voltage (V_oc) and fill factor (FF) of 0.545 V and 0.67.Triple junction n-i-p cells were deposited using proto-Si:H, plasma-deposited proto-SiGe:H and μc-Si:H as top, middle and bottom cell absorber layers. With Ag/ZnO TBR's from our lab and United Solar Ovonic LLC, respective initial efficiencies of 10.45% (2.030 V, 7.8 mA/cm², 0.66) and 10.50% (2.113 V, 7.4 mA/cm², 0.67) were achieved.     

New developments in amorphous thin-film silicon solar cells

Thin-film silicon solar cells usually contain amorphous silicon layers made by plasma enhanced chemical vapor deposition (PECVD). This CVD method has the advantage that large-area devices can be manufactured at a low processing temperature, thus facilitating low-cost solar cells on glass, metal foil, or polymer foil. In order to obtain higher conversion efficiencies while keeping the manufacturing cost low, a new development is to introduce low bandgap materials in a multijunction device structure. A frequently used low bandgap material is amorphous silicon-germanium. Record initial efficiencies in excess of 15% have been reported for triple-junction solar cells comprising these alloys. In this paper, we present a novel manufacturing method for amorphous silicon based tandem cells suitable for roll-to-roll production     

Heterogeneous growth of microcrystalline silicon germanium

Microcrystalline silicon germanium films showing excellent opto-electronic properties have been prepared at a substrate temperature of 195°C by radio frequency plasma enhanced chemical vapor deposition at 13.56 MHz. A white light (AM 1.5) photoconductivity of 5×10⁻⁵/Ω cm and ambipolar diffusion length of 114 nm (from SSPG) established the device quality. Films are intrinsic (Fermi level near midgap; activation energy E_a (0.49 eV) is approximately half the band gap (1.01 eV)). Performance of preliminary n–i–p solar cells (with μc-SiGe:H i-layer) on stainless steel and molybdenum substrates justify their photosensitivities. A current density of 9.44 mA/cm² has been generated in an i-layer of only 150 nm thick without any back-reflector. A deposition rate of 0.75 Å/s for such a thin layer gives this material much advantage than a μc-Si cell, where a thickness of >2 μm is needed. A high V_oc of 0.43 eV has been achieved for such a low mobility gap cell (Ge fraction 60%).     

Mechanism of hydrogen interaction with the growing silicon film

The hydrogen reaction on a hydrogenated silicon film is in two phases. This is manifested in slowing down of the hydrogen loss at the growing film. The slow down occurs in phases and both the processes have exponential character. The first phase consists of hydrogen incorporation into the layer and this occurs within the first 50 s. The second phase is of etching. This is confirmed by the similarity between the rate of hydrogen loss in the second phase and the rate of production of silyl species.     

Thin-film transistors deposited by hot-wire chemical vapor deposition

In the past few years hot-wire chemical vapor deposition (HWCVD) has become a popular technique for the deposition of silicon-based thin-film transistors (TFTs). Several groups have been using hot-wire deposited amorphous and microcrystalline silicon as the active layers in TFTs. In such devices either thermal SiO₂ or plasma-deposited silicon nitride was the gate insulator. Recently ‘All-Hot-Wire TFTs’ have been realized, with also the silicon nitride deposited by HWCVD. This paper reviews the characteristics of hot-wire TFTs with amorphous and microcrystalline silicon using plasma- or hot-wire deposited silicon nitride as the gate insulator. It has been shown that hot-wire TFTs have a higher stability upon gate-bias stress as compared to their plasma-deposited counterparts. We present an overview of the stability of hot-wire TFTs deposited at a range of substrate temperatures. The higher stability of hot-wire TFTs that have been deposited at temperatures of 400–500 °C is ascribed to an enhanced structural order, i.e. a higher degree of medium-range order of the silicon network.     

3D‐printed external light trap for solar cells

We present a universally applicable 3D‐printed external light trap for enhanced absorption in solar cells. The macroscopic external light trap is placed at the sun‐facing surface of the solar cell and retro‐reflects the light that would otherwise escape. The light trap consists of a reflective parabolic concentrator placed on top of a reflective cage. Upon placement of the light trap, an improvement of 15% of both the photocurrent and the power conversion efficiency in a thin‐film nanocrystalline silicon (nc‐Si:H) solar cell is measured. The trapped light traverses the solar cell several times within the reflective cage thereby increasing the total absorption in the cell. Consequently, the trap reduces optical losses and enhances the absorption over the entire spectrum. The components of the light trap are 3D printed and made of smoothened, silver‐coated thermoplastic. In contrast to conventional light trapping methods, external light trapping leaves the material quality and the electrical properties of the solar cell unaffected. To explain the theoretical operation of the external light trap, we introduce a model that predicts the absorption enhancement in the solar cell by the external light trap. The corresponding calculated path length enhancement shows good agreement with the empirically derived value from the opto‐electrical data of the solar cell. Moreover, we analyze the influence of the angle of incidence on the parasitic absorptance to obtain full understanding of the trap performance. © 2015 The Authors. Progress in Photovoltaics: Research and Applications published by John Wiley & Sons, Ltd.     

Multi‐crystalline Si solar cells with very fast deposited (180 nm/min) passivating hot‐wire CVD silicon nitride as antireflection coating

Hot‐wire chemical vapor deposition (HWCVD) is a promising technique for very fast deposition of high quality thin films. We developed processing conditions for device‐ quality silicon nitride (a‐SiN_x:H) anti‐reflection coating (ARC) at high deposition rates of 3 nm/s. The HWCVD SiN_x layers were deposited on multicrystalline silicon (mc‐Si) solar cells provided by IMEC and ECN Solar Energy. Reference cells were provided with optimized parallel plate PECVD SiN_x and microwave PECVD SiN_x respectively. The application of HWCVD SiN_x on IMEC mc‐Si solar cells led to effective passivation, evidenced by a V_oc of 606 mV and consistent IQE curves. For further optimization, series were made with HW SiN_x (with different x) on mc‐Si solar cells from ECN Solar Energy. The best cell efficiencies were obtained for samples with a N/Si ratio of 1·2 and a high mass density of >2·9 g/cm³. The best solar cells reached an efficiency of 15·7%, which is similar to the best reference cell, made from neighboring wafers, with microwave PECVD SiN_x. The IQE measurements and high V_oc values for these cells with HW SiN_x demonstrate good bulk passivation. PC1D simulations confirm the excellent bulk‐ and surface‐passivation for HW SiN_x coatings. Interesting is the significantly higher blue response for the cells with HWCVD SiN_x when compared to the PECVD SiN_x reference cells. This difference in blue response is caused by lower light absorption of the HWCVD layers (compared to microwave CVD; ECN) and better surface passivation (compared to parallel plate PECVD; IMEC). The application of HW SiN_x as a passivating antireflection layer on mc‐Si solar cells leads to efficiencies comparable to those with optimized PECVD SiN_x coatings, although HWCVD is performed at a much higher deposition rate. Copyright © 2007 John Wiley & Sons, Ltd.     

The effect of composition on the bond structure and refractive index of silicon nitride deposited by HWCVD and PECVD

Silicon nitride (SiN_x) is a material with many applications and can be deposited with various deposition techniques. Series of SiN_x films were deposited with HWCVD, RF PECVD, MW PECVD and LF PECVD. The atomic densities are quantified using RBS and ERD. The influence of the atomic densities on the Si-N and Si-Si bond structure is studied. The density of N-N bonds is found to be negligible. New Si-N FTIR proportionality factors are determined which increase with increasing N/Si ratio from 1.2 · 10¹⁹ cm^− 1 for Si rich films (N/Si = 0.2) to 2.4 · 10¹⁹ cm^− 1 for N rich films (N/Si = 1.5). The peak position of the Si-H stretching mode in the FTIR spectrum is discussed using the chemical induction model. It is shown that especially for Si-rich films the hydrogen content affects the Si-H peak position. The influence of the composition on the refractive index of the films is discussed on the basis of the Lorentz-Lorenz equation and the Kramers-Kronig relation. The decreasing refractive index with increasing N/Si ratio is primarily caused by an increase of the band gap.     

Identifying parasitic current pathways in CIGS solar cells by modelling dark J–V response

The non‐uniform presence of shunting defects is a significant cause of poor reproducibility across large‐area solar cells, or from batch‐to‐batch for small area cells, but the most commonly used value for shunt parameterisation (the shunt resistance) fails to identify the cause for shunting. Here, the use of equivalent circuit models to describe dark current–voltage characteristics of ZnO:Al/i‐ZnO/CdS/CIGS/Mo devices in order to understand shunting behaviour is evaluated. Simple models, with a single shunt pathway, were tested but failed to fit experimental data, whereas a more sophisticated model developed here, which includes three shunting pathways, yielded excellent agreement throughout the temperature range of 183–323 K. The temperature dependence of fitting parameters is consistent with known physical models. Activation energies and contact barriers are determined from the model, and extracted diode factors are unique across the voltage range. A case study is presented whereby the model is used to diagnose poor reproducibility for CIGS devices (efficiency ~3–14% across a 100 cm² plate). It's shown that lower efficiencies correlated with greater prevalence of Ohmic and non‐Ohmic shunt currents, which may form due to pinholes in absorber and buffer layers respectively, whereas the quality of the main junction was constant for all cells (diode factor ~1.5–2). Electron microscopy confirmed the presence of ZnO:Al/i‐ZnO/Mo and ZnO:Al/CIGS/Mo regions, supporting the multi‐shunt pathway scheme disclosed by modelling. While the model is tested with CIGS cells here, this general model is a powerful diagnostic tool for process development for any type of thin‐film device. Copyright © 2015 John Wiley & Sons, Ltd.