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501.
Crosstalk noise voltage levels have been estimated at the far end of a victim line in capacitive coupled single‐walled carbon nanotube (SWCNT) bundle interconnects under the influence of interconnect dimensions. The reported work on crosstalk analysis in SWCNT bundle interconnects to date have assumed the value of coupling capacitance as equivalent to the coupling effect between metal interconnects of same dimensions. In this paper, we propose an improved model to extract inter‐bundle real‐life coupling capacitances to fill that gap. A similar analysis is performed for a copper‐based interconnect, and comparison is made with result obtained for CNT‐based interconnect at 22‐nm technology. SPICE simulation results reveal that the crosstalk noise voltage level at the far end of the victim line in CNT bundles is significantly lower than that in conventional metal (copper) conductors in three different cases, keeping the pitch fixed but varying the value of interconnect spacing and width. © 2014 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc.  相似文献   
502.
Macular telangiectasia Type 2 (MacTel) is a bilateral acquired retinal disease characterized by both vascular changes and atrophy of the retina. The purpose of this case series is to highlight the use of optical coherence tomography angiography (OCTA) as a non-invasive imaging modality to distinguish atypical MacTel from other macular conditions with similar presentations. We performed a retrospective review of patients referred to our academic retinal practice with unconfirmed or misdiagnosed MacTel between July 2017 and July 2021. Patients’ OCTA imaging findings were reviewed to guide the appropriate diagnosis and management of atypical MacTel. Fifteen eyes from eight patients were included in this study. Six patients were referred with previous diagnoses of either full-thickness macular hole, lamellar hole, vitreomacular traction (VMT), postoperative cystoid macular edema (CME), or diabetic macular edema (DME). Two patients were referred to us to confirm the diagnosis of MacTel. OCTA revealed telangiectatic vessels in the temporal parafovea of all 15 eyes. OCTA also highlighted previously undiagnosed subretinal neovascularization (SRNV) in seven eyes. OCTA imaging is a valuable imaging modality to distinguish MacTel from other macular conditions, whose treatment courses vary substantially. Due to its ease of use, it holds immense potential in the future as treatments for non-proliferative MacTel emerge.  相似文献   
503.
Type II diabetes mellitus (T2DM) is one of the most prevalent diseases in the world, associated with diabetic foot ulcers and impaired wound healing. There is an ongoing need for interventions effective in treating these two problems. Pre-clinical studies in this field rely on adequate animal models. However, producing such a model is near-impossible given the complex and multifactorial pathogenesis of T2DM. A leptin-deficient murine model was developed in 1959 and relies on either dysfunctional leptin (ob/ob) or a leptin receptor (db/db). Though monogenic, this model has been used in hundreds of studies, including diabetic wound healing research. In this study, we systematically summarize data from over one hundred studies, which described the mechanisms underlying wound healing impairment in this model. We briefly review the wound healing dynamics, growth factors’ dysregulation, angiogenesis, inflammation, the function of leptin and insulin, the role of advanced glycation end-products, extracellular matrix abnormalities, stem cells’ dysregulation, and the role of non-coding RNAs. Some studies investigated novel chronic diabetes wound models, based on a leptin-deficient murine model, which was also described. We also discussed the interventions studied in vivo, which passed into human clinical trials. It is our hope that this review will help plan future research.  相似文献   
504.
Singh  Sadhana  Chaudhary  Tarun  Khanna  Gargi 《SILICON》2022,14(11):5793-5800
Silicon - Wide bandgap (WBG) semiconductor materials have the capability of making power electronic components with a smaller size, faster switching speed, more reliability, and greater efficiency...  相似文献   
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