首页 | 本学科首页   官方微博 | 高级检索  
文章检索
  按 检索   检索词:      
出版年份:   被引次数:   他引次数: 提示:输入*表示无穷大
  收费全文   152115篇
  免费   1892篇
  国内免费   656篇
电工技术   3122篇
综合类   188篇
化学工业   24120篇
金属工艺   5785篇
机械仪表   4948篇
建筑科学   4439篇
矿业工程   378篇
能源动力   3933篇
轻工业   17324篇
水利工程   1140篇
石油天然气   620篇
武器工业   5篇
无线电   20514篇
一般工业技术   28900篇
冶金工业   23811篇
原子能技术   2341篇
自动化技术   13095篇
  2019年   840篇
  2018年   1085篇
  2017年   1133篇
  2016年   1270篇
  2015年   1068篇
  2014年   1805篇
  2013年   6586篇
  2012年   3196篇
  2011年   4617篇
  2010年   3604篇
  2009年   4160篇
  2008年   4655篇
  2007年   4918篇
  2006年   4355篇
  2005年   4112篇
  2004年   4008篇
  2003年   3908篇
  2002年   3936篇
  2001年   3990篇
  2000年   3742篇
  1999年   3696篇
  1998年   6649篇
  1997年   5240篇
  1996年   4467篇
  1995年   3717篇
  1994年   3363篇
  1993年   3191篇
  1992年   2784篇
  1991年   2690篇
  1990年   2634篇
  1989年   2617篇
  1988年   2461篇
  1987年   2167篇
  1986年   2120篇
  1985年   2560篇
  1984年   2319篇
  1983年   2198篇
  1982年   2069篇
  1981年   1995篇
  1980年   1862篇
  1979年   1875篇
  1978年   1773篇
  1977年   2086篇
  1976年   2567篇
  1975年   1584篇
  1974年   1431篇
  1973年   1454篇
  1972年   1197篇
  1971年   1118篇
  1970年   948篇
排序方式: 共有10000条查询结果,搜索用时 15 毫秒
951.
The effect of current stressing on the reliability of 63Sn37Pb solder joints with Cu pads was investigated at temperatures of −5 °C and 125 °C up to 600 h. The samples were stressed with 3 A current (6.0 × 102 A/cm2 in the solder joint with diameter of 800 μm and 1.7 × 104 A/cm2 in the Cu trace with cross section area of 35 × 500 μm). The temperatures of the samples and interfacial reaction within the solder joints were examined. The microstructural change of the solder joints aged at 125 °C without current flow was also evaluated for comparison. It was confirmed that the current flow could cause the temperature of solder joints to rise rapidly and remarkably due to accumulation of massive Joule heat generated by the Cu trace. The solder joints stressed at 125 °C with 3 A current had an extensive growth of Cu6Sn5 and Cu3Sn intermetallic compounds (IMC) at both top and bottom solder-to-pad interfaces. It was a direct result of accelerated aging rather than an electromigration or thermomigration effect in this experiment. The kinetic is believed to be bulk diffusion controlled solid-state reaction, irrespective of the electron flow direction. When stressed at −5 °C with 3 A current, no significant change in microstructure and composition of the solder joints had occurred due to a very low diffusivity of the atoms as most Joule heat was eliminated at low temperature. The IMC evolution of the solder joints aged at 125 °C exhibited a subparabolic growth behavior, which is presumed to be a combined mechanism of grain boundary diffusion and bulk diffusion. This is mainly ascribed to the retardant effect against the diffusion course by the sufficiently thick IMC layer that was initially formed during the reflow soldering.  相似文献   
952.
Parylene is an emerging material for MEMS. It is an organic material that is grown by using the chemical vapor deposition method at room temperature. The deposition thickness is commonly controlled by the amount of solid-phase dimer loaded in a sublimation chamber. In a conventional deposition machine, the end point of the process is designated by the moment the dimer is exhausted. However, this end-of-process criterion does not offer precise, repeatable control of film thickness. We present the results of the development of an in situ end-point detector for a Parylene chemical vapor deposition process. The detector is based on the thermal transfer principle and can be implemented on commercial parylene deposition systems with minimal system modification. Such a sensor enables a user to stop the deposition when a targeted thickness is reached. The end point detector is very simple to implement on existing parylene deposition systems. A series of such sensors with different target deposition thickness would allow extraction of the actual deposition rate within a deposition run.  相似文献   
953.
Ecological momentary assessment (EMA) consists of assessing phenomena in real time in the natural environment. EMA allows for more fine-grained analyses of addictive behavior and minimizes threats to internal validity, such as recall biases and errors. However, because of the intensive monitoring involved in EMA, measurement reactivity is a concern. To test whether EMA with palmtop personal computers induces reactivity, the authors compared smoking-related outcomes between smokers using EMA and those not using EMA during a quit attempt. The use of no-EMA control groups has been rare in reactivity investigations to date. The EMA protocol included event-contingent assessments (smoking episodes, urge episodes) and random assessments. Outcomes included biologically confirmed abstinence and self-report measures of withdrawal, self-efficacy, motivation, affect, and temptations. Participants were smokers motivated to quit (N = 96). They were randomized to 1 of 3 groups: EMA for the week preceding a planned quit date, EMA for the week following the quit date, and no EMA. Abstinence rates did not differ between the groups at Day 7 or at Day 28 postcessation. For the 20 subscales assessed at each of 3 assessment times, there were significant differences between participants with and without EMA experience for 3 subscales at the 1st of 3 assessment times, and significant differences for 3 different subscales at the 3rd assessment time. These differences suggest some reactivity to EMA, although the inconsistent pattern across time indicates that further research is needed to definitively conclude that EMA induces reactivity. (PsycINFO Database Record (c) 2010 APA, all rights reserved)  相似文献   
954.
955.
Support for arbitrary topologies has become more popular for system-area networks but very little has been done in trying to characterize their behavior and performance. Traditional parameters like diameter and bisection width are not sufficient for characterizing the irregularities that abound in such networks and fail to give much insight into throughput performance. A clustering approach for partitioning a network into clusters of richly-connected regions is proposed as a means of defining two performance-correlated characterization metrics: intercluster bandwidth index and intercluster link-cost index. The two characterization metrics are shown to have a strong correlation to saturation throughput when link and load distribution of a network is imbalanced. Simulation results also show that the clustering algorithm can be applied to a variety of network configurations and traffic scenarios, particularly irregular ones. With the proposed characterization metrics that correlate more strongly with performance, it is possible to classify networks into categories having similar performance.  相似文献   
956.
The ageing quantification of ultracapacitors in cycle-life tests has been studied. Current profiles and the characteristics of the ultracapacitors used in hybrid and electric vehicle applications are specified and validated. With these profiles, significant self-heating occurs but without exceeding the manufacturers' limits. Thus, ultracapacitors are aged in a short time with the same degradation mechanisms observed in normal use. Ageing evaluation is based on the measurement of the electrical parameter changes. A particular phenomenon is performance recovery during rest periods when power-cycling is interrupted for electrical characterisation. Therefore, an online characterisation procedure was added for more accurate evaluation of the ultracapacitors' ageing. A number of devices from two manufacturers are cycled with different current profiles. The obtained results are presented and discussed.  相似文献   
957.
New generations of automobiles will include driver assistance systems requiring powerful, low-cost processors to handle video/camera applications and to enable fast, convenient application development. Shrinking feature sizes on processors already in development will bring substantial increases in system speed and functionality.  相似文献   
958.
Wireless security is different   总被引:1,自引:0,他引:1  
Arbaugh  W.A. 《Computer》2003,36(8):99-101
Wireless security requires slightly different thinking from wired security because it gives potential attackers easy transport medium access. This access significantly increases the threat that any security architecture must address. Wireless networking broadcast nature makes traditional link-layer attacks readily available to anyone. Wireless network security based on the IEEE 802.11 standard has received a lot of negative attention, since it is coupled with several design errors and security problems. IEEE 802.11 uses spread-spectrum signaling technology, which the military depends on for secure communications. Newer architectures are becoming available to dramatically increase the security of 802.11-based networks.  相似文献   
959.
A method to design a microstrip filter has been proposed. The multiple capacitively loaded coupled lines are adopted for the design of the microstrip filter. The filter shows different stopband behaviour with respect to even or odd total number of resonators. The transmission zeros may be located around the lower, higher or both regions of the passband's skirt. The coupling among the capacitively loaded lines can produce another transmission zero particularly in the higher stopband. A bandpass filter and a duplexer utilising these features are designed. The equivalent model is also proposed to illustrate the filter's coupling among these capacitively loaded coupled lines. The design has been verified by experimental results  相似文献   
960.
This article attempts to determine the mechanisms governing the grain growth process that occurs during lamination annealing of a cold-rolled, motor-lamination (CRML) steel. A new simulation approach linking a Monte Carlo model with electron backscatter diffraction (EBSD) scans used as input has been employed to incorporate the effects of crystallographic texture on the simulated grain growth process. The results from the texture analysis and the computer simulation of the grain growth process indicate that both stored energy driven grain growth and anisotropic grain boundary growth influence the overall grain growth occurring during lamination annealing.  相似文献   
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号