Optical gain of strained wurtzite GaN quantum-well lasers

A theory for the electronic band structure and the free-carrier optical gain of wurtzite-strained quantum-well lasers is presented. We take into account the strain-induced band-edge shifts and the realistic band structures of the GaN wurtzite crystals. The effective-mass Hamiltonian, the basis functions, the valence band structures, the interband momentum matrix elements, and the optical gain are presented with analytical expressions and numerical results for GaN-AlGaN strained quantum-well lasers. This theoretical model provides a foundation for investigating the electronic and optical properties of wurtzite-strained quantum-well lasers.     

Delay-constrained survivable multicast routing problem in WDM networks with shared segment-based protection

For a delay-constrained multicast transmission request, the goal of delay-constrained survivable multicast routing problem is to provide the primary multicast tree and the tree protecting sparse resources. The shared segment-based protection (SSBP) method is used in this article to protect the delay-constrained multicast transmission. Two heuristic methods are proposed to find the delay-constrained primary tree and the backup segments with delay constraint. Experiments are conducted to evaluate the performance of the proposed methods, and the performance to be evaluated includes wavelength efficiency ratio (WER), blocking ratio (BR), and executing time. Simulations show that the SSBP method can get better BR and WER than the previous results demonstrated Din and Jiang (Comput Commun 35(10):1172–1184, 2012).     

P110钢在含Cl-介质中的冲刷与腐蚀行为研究

采用旋转圆盘装置并辅以电化学工作站测试P110钢在含Cl-溶液中的冲刷腐蚀行为。研究不同流速、不同含砂量对P110钢冲刷腐蚀质量损失速率和腐蚀电化学行为的影响规律,利用扫描电子显微镜(SEM)对冲刷腐蚀后试样表面进行分析表征。结果表明:P110钢在含Cl-溶液中的冲刷腐蚀形貌为典型的颗粒切削痕迹,并伴有少量腐蚀坑,冲刷腐蚀机理为机械和腐蚀相互协同作用;冲刷腐蚀过程存在一临界流速,当流速较低时主要体现为腐蚀作用,当流速超过4 m/s时材料冲刷腐蚀质量损失速率的增加主要来自于机械作用;含砂量对P110钢冲刷腐蚀起着重要影响,随含砂量增大,砂粒的机械冲刷作用增加导致冲刷腐蚀过程加剧,但过多的砂含量会形成"屏蔽作用"降低冲刷腐蚀。     

Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads

The intermetallic compounds formed during the reflow and aging of Sn-20In-2.8Ag ball-grid-array (BGA) packages are investigated. After reflow, a large number of cubic-shaped AuIn₂ intermetallics accompanied by Ag₂In precipitates appear in the solder matrix, while a Ni(Sn_0.72Ni_0.28)₂ intermetallic layer is formed at the solder/pad interface. With further aging at 100°C, many voids can be observed in the solder matrix and at the solder/pad interface. The continuous distribution of voids at the interface of specimens after prolonged aging at 100°C causes their bonding strength to decrease from 5.03 N (as reflowed) to about 3.50 N. Aging at 150°C induces many column-shaped (Cu_0.74Ni_0.26)₆(Sn_0.92In_0.08)₅ intermetallic compounds to grow rapidly and expand from the solder/pad interface into the solder matrix. The high microhardness of these intermetallic columns causes the bonding strength of the Sn-20In-2.8Ag BGA solder joints to increase to 5.68 N after aging at 150°C for 500 h.     

Low Hysteresis Hydrogel Induced by Spatial Confinement

Stress concentration and hysteresis often occur in polymer hydrogels under large deformation, affecting their mechanical properties, and durability. Here, a new spatial confinement gelation strategy is proposed for fabrication of hysteresis-free polymer hydrogels, and stress concentration is avoided. Experimental results and theoretical calculations confirm that the hydratability difference between salts and polymer chains leads to spatial confinement of the polymer chains by control over the ratio of bound to free water. Spatial confinement acts in place of physical cross-linking of polymer chains, which slide to dissipate energy and effectively avoid stress concentration and hysteresis, resulting in ultra-tough hydrogels with fatigue resistance. This is also a universal strategy for preparing polymer hydrogels with different monomers and salts. Taking the prepared PAM-CaCl₂ hydrogel, it displays a hysteresis of only 0.13% during load-unload cycles, even under 1000% strain. This is the lowest value among hydrogels reported to date. Along with excellent fatigue resistance, water retention, antifreeze, and water-assisted healing ability, this hydrogel shows good performance in fatigue resistant capacitive strain sensors. Moreover, a fishtail-shaped PAM-CaCl₂ hydrogel operates as a bionic muscle to drive a bionic fish at a forward speed of 16.3 cm s⁻¹, when a voltage of 0.1 V is applied.     

基于极化敏感阵列的导航抗干扰方法

对于全球卫星导航系统的接收终端,抗干扰处理能够提高其干扰容量,是一项非常重要的工作。提出了一种改进的基于双极化天线阵列的联合极化-空域自适应处理方法进行干扰抑制。仿真实验表明,此方法能够有效降低干扰性,并且不需要知道干扰信号的先验信息,能够适用于卫星导航信号处理。     

Superparamagnetic Nanostructures for Off‐Resonance Magnetic Resonance Spectroscopic Imaging

This study proposes a new method to generate positive contrast in magnetic resonance imaging (MRI) using superparamagnetic contrast agents. Superparamagnetic nanostructures consisting of octahedron manganese ferrite nanoparticles embedded in spherical nanogels are fabricated using a bottom‐up approach. The composite nanoparticles are strongly magnetized in an external magnetic field and produce a unique NMR frequency shift in water protons, which can be demonstrated in MR spectroscopy and imaging to be different from the bulk pool. Moreover, the particles exhibit excellent colloidal stability in aqueous media and good cell biocompatibility. Hence, these particles are potentially useful as biomarkers by taking advantage of the positive contrast effects produced in MRI.     

离子减薄诱发的Zr65Al7.5Ni10Cu17.5块状非晶晶化相的相变

用透射电子显微镜研究了锆基块状非晶合金晶化行为，对分别经双喷电解减薄加离子减薄和单纯双喷电解减薄制备的电镜样品进行观察分析，发现离子减薄会导致该合金晶化亚稳相的转变。     

Phase identification and growth kinetics of the intermetallic compounds formed during in-49Sn/Cu soldering reactions

For the application of In-49Sn solder in bonding recycled-sputtering targets to Cu back plates, the intermetallic compounds formed at the In-49Sn/Cu interface are investigated. Scanning electron microscopy (SEM) observations show that the interfacial intermetallics consist of a planar layer preceded by an elongated scalloped structure. Electron-probe microanalyzer analyses indicate that the chemical compositions of the planar layer and the scalloped structure are Cu_74.8In_12.2Sn_13.0 and Cu_56.2In_20.1Sn_23.7, respectively, which correspond to the ε-Cu₃(In,Sn) and η-Cu₆(In,Sn)₅ phases. Kinetics analyses show that the growth of both intermetallic compounds is diffusion controlled. The activation energies for the growth of η- and ε-intermetallics are calculated to be 28.9 kJ/mol and 186.1 kJ/mol. Furthermore, the formation mechanism of intermetallic compounds during the In-49Sn/Cu soldering reaction is clarified by marking the original interface with a Ta-thin film. Wetting tests are also performed, which reveal that the contact angles of liquid In-49Sn drops on Cu substrates decline to an equilibrium value of 25°C.     

无线网络中谈判解的协作带宽分配策略

为了促使无线网络中的"自私"节点参与合作,提出了谈判解协作带宽分配(CBA)策略,解决了节点间采用交换带宽资源协作传输,彼此以多大带宽中继对方数据的问题.首先,将两个节点的协作带宽分配问题建模为合作博弈中的谈判过程;之后,采用拉格朗日乘数法得到两个用户的纳什谈判解(NBS)协作带宽分配;其次,提出了一种新的Kalai-Smorodinsky谈判解(KSBS)协作带宽分配策略;最后,对两种谈判解协作带宽分配策略的公平性进行了研究.仿真表明,KSBS协作带宽分配策略和NBS协作带宽分配策略对提升用户效用的作用基本相同,但KSBS策略比NBS策略更为公平.