提高托盘利用效率的重要手段——电子信息化管理

托盘能否有效运用对物流的畅通与否关系重大,这已经引起了国内外专家和学者们的重视,并就此制定了托盘电子信息化管理系统,旨在更合理地使用托盘,推进托盘一体化和共用系统的建立。而RFID技术在托盘的电子信息化管理的应用更将大大提高物流的效率与准确性,托盘电子信息化管理将成为今后托盘管理的趋势。     

Adaptive agents and multiagent systems

New information systems and recent applications (grid computing, Web Services, and so on) are often distributed, large-scale, open, heterogeneous, and characterized by a dynamic environment. To model these complex systems, researchers have spent much effort during the last few years on multiagent systems. The aim is to model complex distributed systems as a set of (possibly organized) software agents that interact in a common environment. The decomposition of a system into a number of agents lets the system react and adapt better in a changing environment. Moreover, organized structures ("social" structures) can emerge from interactions between agents, which in turn constrain and coordinate the agents' behavior. A multiagent system takes its metaphors of interaction from social systems rather than using the metaphor of the isolated thinker that early artificial intelligence researchers preferred. An important issue when dealing with this increasing complexity is to build adaptive agents and multiagent systems. Agents and multiagent systems must be aware of their own capabilities and of changes to other agents and their environment. To remain effective, agents must be able to adapt their structures and knowledge while they execute.     

Evaluation and optimization of package processing and design through solder joint profile prediction

Solder joints are generated using a variety of methods to provide both mechanical and electrical connection for applications such as flip-chip, wafer level packaging, fine pitch, ball-grid array, and chip scale packages. Solder joint shape prediction has been incorporated as a key tool to aid in process development, wafer level and package level design and development, assembly, and reliability enhancement. This work demonstrates the application of an analytical model and the Surface Evolver software in analyzing a variety of solder processing methods and package types. Bump and joint shape prediction was conducted for the design of wafer level bumping, flip-chip assembly, and wafer level packaging. The results from the prediction methodologies are validated with experimentally measured geometries at each level of design.     

Analytic models for the latency and steady-state throughput of TCP Tahoe, Reno, and SACK

Continuing the process of improvements made to TCP through the addition of new algorithms in Tahoe and Reno, TCP SACK aims to provide robustness to TCP in the presence of multiple losses from the same window. In this paper we present analytic models to estimate the latency and steady-state throughput of TCP Tahoe, Reno, and SACK and validate our models using both simulations and TCP traces collected from the Internet. In addition to being the first models for the latency of finite Tahoe and SACK flows, our model for the latency of TCP Reno gives a more accurate estimation of the transfer times than existing models. The improved accuracy is partly due to a more accurate modeling of the timeouts, evolution of cwnd during slow start and the delayed ACK timer. Our models also show that, under the losses introduced by the droptail queues which dominate most routers in the Internet, current implementations of SACK can fail to provide adequate protection against timeouts and a loss of roughly more than half the packets in a round will lead to timeouts. We also show that with independent losses SACK performs better than Tahoe and Reno and, as losses become correlated, Tahoe can outperform both Reno and SACK.     

The First Template‐Free Growth of Crystalline Silicon Microtubes

A simple template‐free high‐temperature evaporation method was developed for the growth of crystalline Si microtubes for the first time. As‐grown Si microtubes were characterized using X‐ray diffraction, scanning electron microscopy, transmission electron microscopy, and room‐temperature photoluminescence. The lengths of the Si tubes can reach several hundreds of micrometers; some of them have lengths on the order of millimeters. Each tube has a uniform outer diameter along its entire length, and the typical outer diameter is ≈ 2–3 μm. Most of the tubes have a wall thickness of ≈ 400–500 nm, though a considerable number of them exhibit a very thin wall thickness of ≈ 50 nm. Room‐temperature photoluminescence measurement shows the as‐synthesized Si microtubes have two strong emission peaks centered at ≈ 589 nm and ≈ 617 nm and a weak emission peak centered at ≈ 455 nm. A possible mechanism for the formation of these Si tubes is proposed. We believe that the present discovery of the crystalline Si microtubes will promote further experimental studies on their physical properties and smart applications.     

Optimal pilot waveform assisted modulation for ultrawideband communications

Ultrawideband (UWB) transmissions induce pronounced frequency-selective fading effects in their multipath propagation. Multipath diversity gains can be collected to enhance performance, provided that the underlying channel can be estimated at the receiver. To this end, we develop a novel pilot waveform assisted modulation (PWAM) scheme that is tailored for UWB communications. We select our PWAM parameters by jointly optimizing channel estimation performance and information rate. The resulting transmitter design maximizes the average capacity, which is shown to be equivalent to minimizing the mean-square channel estimation error, and thereby achieves the Crame/spl acute/r-Rao lower bound. Application of PWAM to practical UWB systems is promising because it entails simple integrate-and-dump operations at the frame rate. Equally important, it offers a flexible UWB channel estimator, capable of striking desirable rate-performance tradeoffs depending on the channel coherence time.     

High-performance MIM capacitor using ALD high-k HfO/sub 2/-Al/sub 2/O/sub 3/ laminate dielectrics

For the first time, we successfully fabricated and demonstrated high performance metal-insulator-metal (MIM) capacitors with HfO/sub 2/-Al/sub 2/O/sub 3/ laminate dielectric using atomic layer deposition (ALD) technique. Our data indicates that the laminate MIM capacitor can provide high capacitance density of 12.8 fF//spl mu/m/sup 2/ from 10 kHz up to 20 GHz, very low leakage current of 3.2 /spl times/ 10/sup -8/ A/cm/sup 2/ at 3.3 V, small linear voltage coefficient of capacitance of 240 ppm/V together with quadratic one of 1830 ppm/V/sup 2/, temperature coefficient of capacitance of 182 ppm//spl deg/C, and high breakdown field of /spl sim/6 MV/cm as well as promising reliability. As a result, the HfO/sub 2/-Al/sub 2/O/sub 3/ laminate is a very promising candidate for next generation MIM capacitor for radio frequency and mixed signal integrated circuit applications.     

化学复合镀层激光处理研究

研究了激光处理对Ni-P -SiC化学复合镀层的影响。借助于扫描电镜、能谱仪、X射线衍射、显微硬度计等设备对激光处理后复合镀层的表面形貌、组织结构及性能进行了综合分析。结果表明 ,对复合镀层进行激光处理可以获得与炉内加热同样的镀层硬度 ,且当激光功率 4 0 0W ,扫描速度 1.5m /min时 ,镀层硬度高于炉内加热的硬度     

The effects of nonlocal impact ionization on the speed of avalanche photodiodes

The nonlocal enhancement in the velocities of charge carriers to ionization is shown to outweigh the opposing effects of dead space, increasing the avalanche speed of short avalanche photodiodes (APDs) over the predictions of a conventional local model which ignores both of these effects. The trends in the measured gain-bandwidth product of two short InAlAs APDs reported in the literature support this result. Relatively large speed benefits are predicted to result from further small reductions in the lengths of short multiplication regions.     

单元串联式多电平高压变频器的起源、现状和展望

本文对单元串联式多电平高压变频器的起源和现状进行了总结,同时从无速度传感器矢量控制、大容量化、冗余设计等方面对该技术未来的发展趋势进行了展望。