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81.
Shaofeng Wang Jianwei Xu Yuejin Tong Lin Wang Chaobin He 《Polymer International》2005,54(9):1268-1274
A novel cholesterol‐imprinted polymer (CMIP‐H) was prepared by a hybrid method of covalent imprinting and non‐covalent imprinting. This approach involves the copolymerization of a template‐containing monomer, cholesteryl 2‐hydroxyethyl methacrylate carbonate, and a cross‐linker, followed by hydrolysis to afford a flexible guest‐binding site accompanied with the easy and efficient removal of a ‘sacrificial spacer’. The effect of solvent on the binding capacity of CMIP‐H towards cholesterol was studied, indicating that a good binding capacity towards cholesterol could be achieved in a less‐polar solvent. The binding experiments of CMIP‐H towards a series of structural analogues of cholesterol, including cholesterol acetate, progesterone and stigmasterol, were carried out in hexane. The results showed that CMIP‐H almost did not bind cholesterol acetate at all because the hydrogen‐bonding site is blocked. It exhibited a similar binding towards both cholesterol and stigmasterol, but much higher binding towards progesterone. Copyright © 2005 Society of Chemical Industry 相似文献
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Colour Centres and Energy Transfer in BaF2-xClx:Eu2+ Phosphors 总被引:1,自引:1,他引:0
The optical absorption spectra of BaF2-xClx:Eu2 after ultraviolet (UV) light excitation were investigated.The differences between the absorption spectra after and before excitation (DAS) were observed.The DAS increase at both the high and the low energy side of F band in BaF2-xClx:Eu2 after 245 nm UV light excitation.The bleach effect of UV light and the absorption of electrons in the valence band may account for the former and the formation of Fa centres (association of F(Cl-) centres), whose absorption band matches the HeNe laser better, may explain the latter.In the write-in process, the transfer of electrons is via tunneling.In the readout process, the transfer of electrons captured in F(F-) and Fa centres is more likely via tunneling, and that of F(Cl-) centres is more likely via conduction band. 相似文献
84.
利用引进的制造技术和设备,制作出了 APT(STLRI)—1.78型系列化光纤连接器。 相似文献
85.
Ying Ding Chunqing Wang Yanhong Tian Binbin Zhang 《Metallurgical and Materials Transactions A》2006,37(12):1017-1025
in-situ transmission electron microscopy (TEM) tensile tests on as-cast and aged 63Sn37Pb solder alloys were conducted, and the fracture
behavior in nanometer scale ahead of the crack tip was inspected and discussed. Results show that the fracture was completed
by connecting the discontinuous cracks or voids. Dislocation behavior was concentrated along the grain boundaries for as-cast
samples, and displayed mainly as dislocation climb. The crack was intergranular dominated under the lower strain rate. While
remarkable mutual dislocation emission was detected in the aged solder. Transgranular cracks were dominant in the fractured
area, and they propagated by linking up with the nanometer scale cracks ahead of the crack tips under the effective promotion
of the inverse dislocation emission. At the same time, the partial interphase or intergranular cracks in the thinned area
were also found. Under this condition, a new critical stress intensity factor K
c
′ to define the mutual dislocation emission was proposed. 相似文献
86.
Wang Xuegang Yan Fengjie Yan Qian Li Xingeng 《Frontiers of Materials Science in China》2007,1(2):225-227
An iron-based amorphous foil (FeNiCrSiB) was used as an interlayer for the amorphous diffusion bonding of low carbon steel
pipes under argon flux. The microstructure and mechanical properties of the joint were analyzed using an electron probe micro-analyzer
(EPMA), tensile test, bending test and impact test. The results show that the joint microstructure resembles that of the base
metal and no precipitates form at the joint. Melting point depressants (B, Si) diffuse far away from the joint and the base
metal element is homogenous across the joint. The joint impact toughness is greater than the base metal toughness and the
mechanical properties of the joint are similar around the pipe. 相似文献
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