Interplay between Coumarin Accumulation,Iron Deficiency and Plant Resistance to Dickeya spp.

Coumarins belong to a group of secondary metabolites well known for their high biological activities including antibacterial and antifungal properties. Recently, an important role of coumarins in plant resistance to pathogens and their release into the rhizosphere upon pathogen infection was discovered. It is also well documented that coumarins play a crucial role in the Arabidopsis thaliana growth under Fe-limited conditions. However, the mechanisms underlying interplay between plant resistance, accumulation of coumarins and Fe status, remain largely unknown. In this work, we investigated the effect of both mentioned factors on the disease severity using the model system of Arabidopsis/Dickeya spp. molecular interactions. We evaluated the disease symptoms in Arabidopsis plants, wild-type Col-0 and its mutants defective in coumarin accumulation, grown in hydroponic cultures with contrasting Fe regimes and in soil mixes. Under all tested conditions, Arabidopsis plants inoculated with Dickeya solani IFB0099 strain developed more severe disease symptoms compared to lines inoculated with Dickeya dadantii 3937. We also showed that the expression of genes encoding plant stress markers were strongly affected by D. solani IFB0099 infection. Interestingly, the response of plants to D. dadantii 3937 infection was genotype-dependent in Fe-deficient hydroponic solution.     

Microstructure and Mechanical Properties of the Ductile Al–Ti–Mo–Nb–V Refractory High Entropy Alloys

Metallurgical and Materials Transactions A - A number of non-equimolar refractory high entropy alloys (RF HEAs) from the Al–Ti–Mo–Nb–V system are synthesized, with the...     

An approach to reduce energy consumption and performance losses on heterogeneous servers using power capping

Journal of Scheduling - Rapid growth of demand for remote computational power, along with high energy costs and infrastructure limits, has led to treating power usage as a primary constraint in...     

Charge trapping in bilayers of conducting polymers under open circuit conditions: a protection of conducting polymer films from spontaneous charging/discharging

Spontaneous charging/discharging processes of polymers: polypyrrole and poly(N-methylpyrrole), doped with perchlorate (anion exchanging PPy and PMPy, respectively) and poly(4-styrenesulphonate) ions (cation exchanging PPy(PSS) and PMPy(PSS)) occurring in aqueous electrolyte solutions were studied using different electrochemical techniques. These reactions (oxidation of the polymer by dissolved oxygen and discharge of the polymer redox capacitance) are usually undesired processes leading to alteration of the charge accumulated in the polymer films. This paper points out that these processes can be significantly limited in polymer bilayers due to effect of charge trapping.     

Pb-Free solders: Part 1. Wettability testing of Sn−Ag−Cu alloys with Bi additions

Maximum bubble pressure, dilatometric, and meniscographic methods were used in the investigations of the surface tension, density, wetting time, wetting force, contact angle, and interfacial tension of liquid alloys of Sn−Ag−Cu eutectic composition with various additions of Bi. Density and surface tension measurements were conducted in the temperature range 250–900 °C. Surface tensions at 250 °C measured under a protective atmosphere of Ar−H₂ were combined with data from meniscographic studies done under air or with a protective flux. The meniscographic data with a nonwetted teflon substrate provided data on interfacial tension (solder-flux), surface tension in air, and meniscographic data with a Cu substrate allowed determinations of wetting time, wetting force, and calculation of contact angle. The calculated wetting angles from meniscographic studies for binary Sn−Ag eutectic and two ternary Sn−Ag−Cu alloys were verified by separate measurements by the sessile drop method under a protective atmosphere with a Cu substrate. Additions of Bi to both ternary alloys improve the wettability and move the parameters somewhat closer to those of traditional Sn−Pb solders.     

Pb-Free solders: Part II. Application of ADAMIS database in modeling of Sn−Ag−Cu alloys with Bi additions

The ADAMIS database was used for calculation of the surface tension of the quaternary Sn−Ag−Cu−Bi liquid alloys by Butler's model. The resultant data were compared with those from the maximum bubble pressure measurements from Part I. The same thermodynamic database was next applied for the calculation of various phase equilibria. It was established that the Bi addition to the ternary Sn−Ag−Cu alloys (Sn-2.6Ag-0.46Cu and Sn-3.13Ag-0.74Cu in at.%; Sn-2.56Ag-0.26 Cu and Sn-2.86Ag-O.40Cu in mass%) causes lowering of the melting temperature and the surface tension to make the tested alloys closer to, traditional Sn−Pb solders. The simulation of the solidification by Scheil's model showed that the alloys with the higher Bi concentration are characterized by the lifting-off failure due to the segregation of Bi at the solder/substrate boundary. Thus, in modeling of new Pb-free solders, a compromise among various properties should be taken into consideration.