A new polyimide film for VLSI and its electrical characterization

Multilevel structures consisting of alternating metal and dielectric layers are necessary to achieve interconnection in high density or VLSI (very large scale integration) circuits using either MOS or bipolar technology. Polyimide is one of the excellent high temperature heat-resistant polymers in organic materials and has good planarization capability and electrical insulating properties. In this work, following the synthesis of DAPDS (4,4'-bis (3-aminophenoxy)diphenyl sulfone), by nucleophilic aromatic substitution of 4,4'-dichlorodiphenyl sulfone with m-aminophenol, DAPDS/pyromellitic dianhydride based soluble and processable fully imidized polyimide was synthesized successfully by using solution imidization technique. Using this specific polyimide, a metal-polyimide-silicon MIS (metal polyimide silicon) structure was manufactured. Electrical properties of the MIS capacitance have been examined. The planarizing and patterning characteristics and electrical characteristics such as current vs. voltage, breakdown field strength, permittivity and capacitance vs. voltage for quasi-static and high frequency measurements are discussed. The results are compared with conventional dielectric films used in integrated circuit fabrication     

Preparation and thermal characterization of block copolymers by macroazonitriles having glycidyl azide and epichlorohydrin moieties

Poly(glycidyl azide) (PGA) an energetic polymer and polyepichlorohydrin (PECH) were condensed with 4,4′ azobis(4-cyanopentanoyl chloride) (ACPC) to prepare macro-azo-initiators. Block copolymers containing each of these polyethers as a block segment combined with polystyrene (PS) or poly(vinyl acetate) (PVAc) have been drived by the polymerization of monomers initiated with this macro-azo-initiators. Thermal properties of block copolymers were investigated with differential scanning calorimetry (DSC) and thermogravimetry. DSC traces showed single glass transition temperatures in between the related segments of copolymers. Dynamic thermogravimetric analysis revealed the individual degradation behaviors of block segments © 1996 John Wiley & Sons, Inc.