Magnetic Ordering of Dy3+ Ions in RbDy(WO4)2 Single Crystal

The specific heat C(T) of the monoclinic RbDy(WO ₄ ) ₂ crystal has been studied at very low temperatures 0.2T1.9 K and in magnetic fields 0H0.38 T. The Neel temperature was shown to be equal to T_N = 0.818 ± 0.005 K. The experimental value of the effective exchange parameter was obtained to be equal to J/k = – 0.798 K. The C T) dependence below Neel temperature 0.5T_N0.99T_N ) is well described by 2D Ising model, whereas in the temperature region close above T_N (1.01 T_N2T_N) it can be described by neither 2D, nor 3D Ising model. The experimental and theoretical H-T_N diagrams for field H a are in a reasonable agreement for simple quadratic lattice.     

The Gaussian scale-space paradigm and the multiscale local jet

A representation of local image structure is proposed which takes into account both the image's spatial structure at a given location, as well as its deep structure, that is, its local behaviour as a function of scale or resolution (scale-space). This is of interest for several low-level image tasks. The proposed basis of scale-space, for example, enables a precise local study of interactions of neighbouring image intensities in the course of the blurring process. It also provides an extrapolation scheme for local image data, obtained at a given spatial location and resolution, to a finite scale-space neighbourhood. This is especially useful for the determination of sampling rates and for interpolation algorithms in a multilocal context. Another, particularly straightforward application is image enhancement or deblurring, which is an instance of data extrapolation in the high-resolution direction.A potentially interesting feature of the proposed local image parametrisation is that it captures a trade-off between spatial and scale extrapolations from a given interior point that do not exceed a given tolerance. This (rade-off suggests the possibility of a fairly coarse scale sampling at the expense of a dense spatial sampling large relative spatial overlap of scale-space kernels).The central concept developed in this paper is an equivalence class called the multiscale local jet, which is a hierarchical, local characterisation of the image in a full scale-space neighbourhood. For this local jet, a basis of fundamental polynomials is constructed that captures the scale-space paradigm at the local level up to any given order.     

Comparing notions of randomness

It is an open problem in the area of effective (algorithmic) randomness whether Kolmogorov-Loveland randomness coincides with Martin-Löf randomness. Joe Miller and André Nies suggested some variations of Kolmogorov-Loveland randomness to approach this problem and to provide a partial solution. We show that their proposed notion of injective randomness is still weaker than Martin-Löf randomness. Since in this proof some of the ideas we use are clearer, we also show the weaker theorem that permutation randomness is weaker than Martin-Löf randomness.     

Logic programming for combinatorial problems

Combinatorial problems appear in many areas in science, engineering, biomedicine, business, and operations research. This article presents a new intelligent computing approach for solving combinatorial problems, involving permutations and combinations, by incorporating logic programming. An overview of applied combinatorial problems in various domains is given. Such computationally hard and popular combinatorial problems as the traveling salesman problem are discussed to illustrate the usefulness of the logic programming approach. Detailed discussions of implementation of combinatorial problems with time complexity analyses are presented in Prolog, the standard language of logic programming. These programs can be easily integrated into other systems to implement logic programming in combinatorics.     

Worst case bounds on the point-wise discretization error in boundary element method for the elasticity problem

In this work, point-wise discretization error is bounded via interval approach for the elasticity problem using interval boundary element formulation. The formulation allows for computation of the worst case bounds on the boundary values for the elasticity problem. From these bounds the worst case bounds on the true solution at any point in the domain of the system can be computed. Examples are presented to demonstrate the effectiveness of the treatment of local discretization error in elasticity problem via interval methods.     

Is Evolution Algorithmic?

In Darwin’s Dangerous Idea, Daniel Dennett claims that evolution is algorithmic. On Dennett’s analysis, evolutionary processes are trivially algorithmic because he assumes that all natural processes are algorithmic. I will argue that there are more robust ways to understand algorithmic processes that make the claim that evolution is algorithmic empirical and not conceptual. While laws of nature can be seen as compression algorithms of information about the world, it does not follow logically that they are implemented as algorithms by physical processes. For that to be true, the processes have to be part of computational systems. The basic difference between mere simulation and real computing is having proper causal structure. I will show what kind of requirements this poses for natural evolutionary processes if they are to be computational.     

TSV constraints related to temperature excursion, pressure during molding, materials used and handling loads

The current paper focuses on several mechanical aspects of a waferlevel packaging approach using a direct face-to-face Chip-to-Wafer (C2W) bonding of a MEMS device on an ASIC substrate wafer. Requirements of minimized inherent stress from packaging and good decoupling from forces applied in manufacturing and application are discussed with particular attention to the presence of through-silicon vias (TSV) in the substrate wafer. The paper deals with FEM analysis of temperature excursion, pressure during molding, materials used and handling load influence on mechanical stress within the TSV system and on wafer level, which can be large enough to disintegrate the system.