Effect of stents coated with a combination of sirolimus and alpha-lipoic acid in a porcine coronary restenosis model

The aim of this study was to evaluate antiproliferative sirolimus- and antioxidative alpha-lipoic acid (ALA)-eluting stents using biodegradable polymer [poly-l-lactic acid (PLA)] in a porcine coronary overstretch restenosis model. Forty coronary arteries of 20 pigs were randomized into four groups in which the coronary arteries had a bare metal stent (BMS, n = 10), ALA-eluting stent with PLA (AES, n = 10), sirolimus-eluting stent with PLA (SES, n = 10), or sirolimus- and ALA-eluting stent with PLA (SAS, n = 10). A histopathological analysis was performed 28 days after the stenting. The ALA and sirolimus released slowly over 30 days. There were no significant differences between groups in the injury or inflammation score; however, there were significant differences in the percent area of stenosis (56.2 ± 11.78 % in BMS vs. 51.5 ± 12.20 % in AES vs. 34.7 ± 7.23 % in SES vs. 28.7 ± 7.30 % in SAS, P < 0.0001) and fibrin score [1.0 (range 1.0–1.0) in BMS vs. 1.0 (range 1.0–1.0) in AES vs. 2.0 (range 2.0–2.0) in SES vs. 2.0 (range 2.0–2.0) in SAS, P < 0.0001] between the four groups. The percent area of stenosis based on micro-computed tomography corresponded with the restenosis rates based on histopathological stenosis in different proportions in the four groups (54.8 ± 7.88 % in BMS vs. 50.4 ± 14.87 % in AES vs. 34.5 ± 7.22 % in SES vs. 28.9 ± 7.22 % in SAS, P < 0.05). SAS showed a better neointimal inhibitory effect than BMS, AES, and SES at 1 month after stenting in a porcine coronary restenosis model. Therefore, SAS with PLA can be a useful drug combination for coronary stent coating to suppress neointimal hyperplasia.     

Electromigration effect on Sn-58 % Bi solder joints with various substrate metallizations under current stress

The electromigration behavior of low-melting temperature Sn-58Bi (in wt%) solder joints was investigated with a high current density between 3 and 4.5 × 10³ A/cm² between 80 and 110 °C. In order to analyze the impact of various substrate metallizations on the electromigration performance of the Sn-58Bi joint, we used representative substrate metallizations including electroless nickel immersion gold (ENIG), electroless nickel electroless palladium immersion gold (ENEPIG), and organic solderability preservatives (OSP). As the applied current density increased, the time to failure (TTF) for electromigration decreased regardless of the temperature or substrate metallizations. In addition, the TTF slightly decreased with increasing temperature. The substrate metallization significantly affected the TTF for the electromigration behavior of the Sn-58Bi solder joints. The substrate metallizations for electromigration performance of the Sn-58Bi solder are ranked in the following order: OSP-Cu, ENEPIG, and ENIG. Due to the polarity effect, current stressing enhanced the fast growth of intermetallic compounds (IMCs) at the anode interface. Cracks occurred at the Ni₃Sn₄ + Ni₃P IMC/Cu interfaces on the cathode sides in the Sn-58Bi/ENIG joint and the Sn-58Bi/ENEPIG joint; this was caused by the complete consumption of the Ni(P) layer. Alternatively, failure occurred via deformation of the bulk solder in the Sn-58Bi/OSP-Cu joint. The experimental results confirmed that the electromigration reliability of the Sn-58Bi/OSP-Cu joint was superior to those of the Sn-58Bi/ENIG or Sn-58Bi/ENEPIG joints.     

静电纺丝制备SU-8光刻胶纳米纤维及图案阵列

利用静电纺丝和紫外光刻技术直接制备了不同结构的SU-8光刻胶纳米纤维薄膜及图案阵列。通过光学显微镜和扫描电子显微镜表征了纳米纤维的形貌、尺寸及结构。结果表明,通过改变SU-8光刻胶的黏度可形成不同直径和形貌的纤维结构,其中用SU-8 3010和SU-8 3050光刻胶制备的纳米纤维具有最优的形貌,其平均直径分别为470 nm和610nm。利用带有长方形缺口的铝箔和同轴电纺的方法分别制备了平行趋向和空心结构的纳米纤维。通过紫外光刻过程,可将SU-8纳米纤维加工成点阵、条状等不同形貌的图案阵列或结构,有望用作细胞培养研究的功能基底材料。     

基于古代宫殿建筑风格的空调外机部件设计

目的解决白色空调外机所带来的破坏市容、与城市古建筑群特征不和谐的问题。方法通过对古代宫殿建筑的造型、色彩等设计元素进行归纳和总结,结合人不同高度的视角分析,设计适合的空调外机部件,使其在发挥功能的同时更好地融入周围环境建筑特征中。结论无需改变现有结构,通过设计附加部件使现代空调外机与古建筑风格相统一,对城市旧建筑改造及新建筑的外立面设计提供借鉴。