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21.
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提出了一种用于检测在役车辆车轴产生疲劳裂纹的超声波方法,设计了中心孔探头与斜角探头一起,完成了对车辆车轴的关键区域探伤。 相似文献
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将薄膜电容真空计的测量室接于被测密闭容器,静态真空室接于一个比较容器,即组成一台压差式漏率测试仪。首先使两容器压力平衡,真空计读数为零。当被测容器存在漏孔时,真空计薄膜两侧形成压差,真空计指示读数,继而计算出该容器的漏率。应用商品真空计在抽真空测试时,检测的最小可测漏率达10-4~10-5Pa·L/s;而在充压测试时,因受气体温度变化的影响,灵敏度会降低几个量级。该仪器有可能具备寻找漏孔位置和确定漏孔漏率的功能。 相似文献
25.
Carboxyl-terminated butadiene-acrylonitrile-rubber decreases modulus and yield stress of the studied epoxy but increases fracture toughness. The addition of glass bead compensates for the loss in modulus but has little effect on yield stress. However, it significantly contributes to the fracture toughness by providing additional mechanisms for toughening of both the unmodified and rubber-modified epoxy. For the toughened epoxies studied, fracture surfaces gave only limited information on fracture mechanisms since significant energy absorption also occurs in the material below the fracture surface. Suggestions for suitable material compositions for fiber composite matrices are given. 相似文献
26.
CA/PAN中空纤维血浆分离膜的结构与性能 总被引:4,自引:2,他引:2
本研究以CA及PAN的共混溶液,通过干-湿法纺丝制取中空纤维,利用共混高聚物各组分在凝固剂中相分离速度的差异,形成具有稳定结构的中空纤维孔膜,该膜用于分离血液中的血浆成分具有良好效果。讨论了成型条件及添加剂等对膜结构、性能的影响,用SEM及图相分析仪、MAP压汞仪及DSC等分析手段,对膜的微孔结构、形态、孔尺寸及中空纤维膜的血浆通量和水通量等进行了系统的考查。 相似文献
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Buttari D. Chini A. Meneghesso G. Zanoni E. Moran B. Heikman S. Zhang N.Q. Shen L. Coffie R. DenBaars S.P. Mishra U.K. 《Electron Device Letters, IEEE》2002,23(2):76-78
Pre-metal-deposition reactive ion etching (RIE) was performed on an Al0.3Ga0.7N/AlN/GaN heterostructure in order to improve the metal-to-semiconductor contact resistance. An optimum AlGaN thickness for minimizing contact resistance was determined. An initial decrease in contact resistance with etching time was explained in terms of removal of an oxide surface layer and/or by an increase in tunnelling current with the decrease of the AlGaN thickness. The presence of a dissimilar surface layer was confirmed by an initial nonuniform etch depth rate. An increase in contact resistance for deeper etches was experienced. The increase was related to depletion of the two-dimensional (2-D) electron gas (2-DEG) under the ohmics. Etch depths were measured by atomic force microscopy (AFM). The contact resistance decreased from about 0.45 Ωmm for unetched ohmics to a minimum of 0.27 Ωmm for 70 Å etched ohmics. The initial thickness of the AlGaN layer was 250 Å. The decrease in contact resistance, without excessive complications on device processing, supports RIE etching as a viable solution to improve ohmic contact resistance in AlGaN/GaN HEMTs 相似文献
29.
Interfacial segregation of Ti in the brazing of diamond grits onto a steel substrate using a Cu-Sn-Ti brazing alloy 总被引:1,自引:0,他引:1
Wen-Chung Li Shun-Tian Lin Cheng Liang 《Metallurgical and Materials Transactions A》2002,33(7):2163-2172
Diamond grits were brazed onto a steel substrate using a prealloyed Cu-10Sn-15Ti (wt pct) brazing alloy at 925 °C and 1050
°C. Due to the relatively high concentration of Ti in the brazing alloy, the braze matrix exhibited a composite structure,
composed of β-(Cu,Sn), a Cu-based solid solution, and various intermetallic compounds with different morphologies. The reaction of Ti with
diamond yielded a continuous TiC layer on the surfaces of the diamond grits. On top of the TiC growth front, an intermetallic
compound, composed of Sn and Ti, nucleated and grew into a randomly interwoven fine lacey structure. An interfacial structure
developed as the interwoven fine lacey phase was semicoherently bonded to the TiC layer, with the Cu-based braze matrix filling
its interstices. The thickness of such a composite layer was increased linearly with the square root of isothermal holding
time at 925 °C, complying with the law of a diffusion-controlled process. However, at 1050 °C, the segregation behavior of
Ti and Sn to the interfaces between the TiC layer and the braze matrix diminished, due to the increased solubility of Ti in
the Cu-based liquid phase. The enhanced dissolution of Ti in the Cu-based liquid phase at 1050 °C also caused the precipitation
of rod-like CuTi with an average diameter of about 0.2 μm during cooling. SnTi3 was the predominant intermetallic compound and existed in three different forms in the braze matrix. It existed as interconnected
grains of large size which either floated to the surface of the braze matrix or grew into faceted grains. It also exhibited
a nail-like structure with a mean diameter of about 1 μm for the rod section and a lamellar structure arising from a eutectic reaction during cooling. 相似文献
30.