An integrated air-gap-capacitor pressure sensor and digital readoutwith sub-100 attofarad resolution

The fabrication and characterization of an integrated air-gap-capacitor pressure sensor are presented. The capacitor fabrication process uses standard IC processing to create NMOS circuits, and an added polysilicon layer to create poly-to-n⁺ capacitors with a 0.6-μm-thick dielectric using deposited oxide. Subsequent processing is used to produce deformable, parallel-plate, air-gap capacitors on the front side alongside MOS circuits. Sensor chips are fabricated using 100-μm×100-μm, 100-fF air-gap capacitors with on-chip circuitry. The sensor chip is a part of a capacitive measurement system that uses a charge-redistribution sense technique to achieve very high capacitance resolution. The behavior of the pressure sensor chips was studied as a function of applied pressure in the 0-240-kPa (0-35-psi) range. Measurements indicate a sensitivity of 0.93 mV/kPa (6.40 mV/psi) with a deflection of 10 nm/kPa (70 nm/psi) at 0-69 kPa (0-10 psi). Standard deviations indicate a static pressure resolution of 0.54 kPa (0.078 psi), which translates to 30 attofarads at a sampling frequency of 11 kHz     

Improving Thermal Stability of BaMgAl10O17:Eu Phosphor

Heterogeneous precipitation method was used to prepared surface coating on self-made BaMgAl10O17:Eu phosphor. Results illustrate that the coating film can be silicon dioxide in amorphous state with 50 nm in thickness. Photoluminescence results indicate that the coating layer presents an observable improved effect on the enhancement of thermal stability. When baked at 600 ℃ for 1 h, the luminance of coated BAM keeps at 92% higher than that of uncoated BAM by 23%. This protective effect can be attributed to the high compact degree and uniformity of this amorphous SiO2 coating film which is served as a diffusion block layer to inbreak oxygen atom, thus releases the oxidation extent of Eu2 effectively.     

Failure mechanism study of anisotropic conductive film (ACF) packages

Anisotropic conductive film (ACF) consists of an adhesive polymer matrix with dispersed conductive particles. In flip-chip technology, ACF has been used in place of solder and underfill for chip attachment to glass or organic substrates. The filler particles establish the electrical contacts between the interconnecting areas. ACF flip-chip bonding provides finer pitch, higher package density, reduced package size and improved lead-free compatibility. Nevertheless, the interconnection is different from traditional solder joints, the integrity and durability of the ACF interconnects have major concerns. Failures in anisotropic conductive film (ACF) parts have been reported after temperature cycling, moisture preconditioning and autoclave. The failures have not been well understood and have been attributed to a wide variety of causes. This paper investigates the failure mechanism of ACF using finite element simulation. From a failure-initiation point of view, the response of ACF packages to environmental (temperature and humidity) exposure is very different from standard underfilled packages. These differences cause the ACF package to fail in different ways from an underfilled package. Simulation results have shown that moisture-induced ACF swelling and delamination is the major cause of ACF failure. With moisture absorption, the loading condition at the interface is tensile-dominant, which corresponds to lower interface toughness (or fracture resistance). This condition is more prone to interface delamination. Therefore, the reliability of ACF packages is highly dependent on the ACF materials. The paper suggests a new approach toward material selection for reliable ACF packages. This approach has very good correlation with experimental results and reliability testing of various ACF materials.     

Error Concealment Based on Semantic Prioritization with Hardware‐Based Face Tracking

With video compression standards such as MPEG‐4, a transmission error happens in a video‐packet basis, rather than in a macroblock basis. In this context, we propose a semantic error prioritization method that determines the size of a video packet based on the importance of its contents. A video packet length is made to be short for an important area such as a facial area in order to reduce the possibility of error accumulation. To facilitate the semantic error prioritization, an efficient hardware algorithm for face tracking is proposed. The increase of hardware complexity is minimal because a motion estimation engine is efficiently re‐used for face tracking. Experimental results demonstrate that the facial area is well protected with the proposed scheme.     

直接探测测风激光雷达的性能分析

综述了激光雷达大气风场测量的方法，提出了采用直接探测到量三维风场分布的F-P干涉仪方法，简述了测量原理，分析了系统的性能和测量误差，比较了基于分子散射和气溶胶散射的系统测量精度，给出了基于瑞利散射的激光雷达系统方案。     

Structural properties of 0.65Pb(Mg1/3Nb2/3)O3–0.35PbTiO3 relaxor ferroelectric thin films on SrRuO3 conducting oxides

Coating of 0.65Pb(Mg_1/3Nb_2/3)O₃–0.35PbTiO₃ (PMN–PT) relaxor ferroelectrics by a sol–gel method is followed by growth of epitaxial SrRuO₃ (SRO) metallic oxide electrodes on SrTiO₃ (STO) single-crystal substrate by pulsed laser deposition. High-quality PMN–PT films on SRO with preferred growth orientation were successfully fabricated by controlling the operation parameters. Structural properties of relaxor ferroelectric PMN–PT thin films on SRO/STO substrates have been studied by X-ray diffraction (XRD), transmission electron microscopy (TEM) and atomic force microscopy (AFM). In-plane and out-of-plane alignments of the heterostructure are confirmed and the structural twinning of the materials are also revealed.     

悬浮床加氢裂化油溶性催化剂与沥青质的作用

在高压釜反应器中对添加了油溶性 Ni 催化剂(UPC-O)和水溶性 Ni 催化剂(UPC-W)的辽河稠油常压渣油(LHAR)进行了悬浮床加氢裂化实验。通过元素分析和傅里叶变换红外光谱(FTIR)分析对抑制反应生焦效果好的 UPC-O 与 LHAR 沥青质的作用进行了研究。元素分析结果显示,在 LHAR 中加入 UPC-O1000μg/g,沥青质和脱沥青质油中 Ni 含量分别出476μg/g和110μg/g 增加到7 559μg/g 和1 024μg/g,表明 UPC-O 在沥青质中有富集的趋势。FTIR 表征结果显示,UPC-O 和沥青质发生了相互作用。UPC-O 可在沥青质原位硫化为活性组分,对沥青质在悬浮床加氢裂化反应中的缩合起到好的抑制作用。     

Study on Contamination Control for Yield Enhancement in the Manufacturing Line of Cellular Phone Modules

Practical studies on the method of contamination control for yield enhancement in the cellular phone modules production line were carried out. A contamination control method was proposed, consisting of data collection, data analysis, improvement action, verification, and implementation of control. The partition check method and the composition analysis for data collection and data analysis were respectively used in the cellular phone modules manufacturing process, and these methods were evaluated by the variation of yield loss before and after implementing the actions for improvement. In the partition check method, the critical process step was selected, and yield loss reduction through improvement actions was observed, whereas in the composition analysis, critical sources were selected, and yield loss reduction through improvement actions was investigated. From the results, it is concluded that the partition check and the composition analysis are effective solutions for contamination control in cleanroom production lines.