Demosaicing algorithms for area- and line-scan cameras in print inspection

Most color image sensors use color filter arrays (CFA). With this sensor design the captured information at each sensor pixel position is restricted to a specific spectral portion (typically red, green and blue bands). To obtain the missing color responses at each pixel position, so-called CFA demosaicing algorithms are commonly used. We propose two new CFA demosaicing algorithms, which are well suited for industrial print inspection with respect to the requirements in accuracy and speed. As a main contribution, we introduce novel demosaicing algorithms for specific high-speed color digital time delay and integration (DTDI) CFA line-scan cameras. We compare the suggested CFA demosaicing algorithms to state-of-the art algorithms for area and line-scan camera operation modes. We show that the two new algorithms perform superior to conventional algorithms as indicated by reconstruction error.     

Efficient polymer solar cell modules

Polymer solar cell modules based on the standard polymer–fullerene system of to-date, P3HT–PCBM, have been prepared and characterized. We have observed a loss of only 20% when up-scaling the active area of the solar cell by a factor somewhat larger than 10. An average solar cell efficiency of 3% and a module efficiency of 1.9% for three serially interconnected solar cells of 5.4 cm² each are reported. The route for further optimization of module performance is discussed based on analyzing the existing loss factors within this design.     

Pressure dependence of the electric conductance of aqueous solutions of LiCl,KCl and (CH3)4NCl. Correlation of kinetic parameters

The electrical conductivity and the compression of solutions of LiCl, KCl, and (CH₃)₄NCl have been measured as a function of pressure up to 2 kbar at the temperatures 25°, 35° and 45°C in the concentration range 0·1–1 molal. The results are discussed in terms of the transition state theory in relation to kinetic parameters for viscous flow and partial molal volume.     

XRF-analysis of fine and ultrafine particles emitted from laser printing devices

In this work, the elemental composition of fine and ultrafine particles emitted by ten different laser printing devices (LPD) is examined. The particle number concentration time series was measured as well as the particle size distributions. In parallel, emitted particles were size-selectively sampled with a cascade impactor and subsequently analyzed by the means of XRF. In order to identify potential sources for the aerosol's elemental composition, materials involved in the printing process such as toner, paper, and structural components of the printer were also analyzed. While the majority of particle emissions from laser printers are known to consist of recondensated semi volatile organic compounds, elemental analysis identifies Si, S, Cl, Ca, Ti, Cr, and Fe as well as traces of Ni and Zn in different size fractions of the aerosols. These elements can mainly be assigned to contributions from toner and paper. The detection of elements that are likely to be present in inorganic compounds is in good agreement with the measurement of nonvolatile particles. Quantitative measurements of solid particles at 400 °C resulted in residues of 1.6 × 10(9) and 1.5 × 10(10) particles per print job, representing fractions of 0.2% and 1.9% of the total number of emitted particles at room temperature. In combination with the XRF results it is concluded that solid inorganic particles contribute to LPD emissions in measurable quantities. Furthermore, for the first time Br was detected in significant concentrations in the aerosol emitted from two LPD. The analysis of several possible sources identified the plastic housings of the fuser units as main sources due to substantial Br concentrations related to brominated flame retardants.     

Comparison of analysis methods for package-induced stresses on moulded Hall sensors

Due to the piezoresistive and the piezo-Hall effect in semiconductor materials, Hall sensors show a strong temperature dependency and also a drift when subjected to temperature cycles Manic et al. (2000). Four factors mainly influence the mechanical stress in the sensitive layer. These are the geometry of the device, the differences of the coefficients of thermal expansion of the package materials, the temperature-dependent material properties and the time-dependent, viscous material properties. The objective of this investigation was to determine the mechanical stress in a moulded Hall sensor during the packaging process by finite-element simulation in comparison to experimental methods. It is shown that after each process-step the mechanical stress in the sensitive layer changes over time depending on the absolute value and the rate of the temperature change. Measurements of the inverse bending radius of glued and moulded chips show good agreement to the simulations.