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101.
102.
This paper presents a 0.13 μm CMOS 3‐level envelope delta‐sigma modulation (EDSM) RF signal generator, which synthesizes a 2.6 GHz‐centered fully symmetrical 3‐level EDSM signal for high‐efficiency power amplifier architectures. It consists of an I‐Q phase modulator, a Class B wideband buffer, an up‐conversion mixer, a D2S, and a Class AB wideband drive amplifier. To preserve fast phase transition in the 3‐state envelope level, the wideband buffer has an RLC load and the driver amplifier uses a second‐order BPF as its load to provide enough bandwidth. To achieve an accurate 3‐state envelope level in the up‐mixer output, the LO bias level is optimized. The I‐Q phase modulator adopts a modified quadrature passive mixer topology and mitigates the I‐Q crosstalk problem using a 50% duty cycle in LO clocks. The fabricated chip provides an average output power of –1.5 dBm and an error vector magnitude (EVM) of 3.89% for 3GPP LTE 64 QAM input signals with a channel bandwidth of 10/20 MHz, as well as consuming 60 mW for both channels from a 1.2 V/2.5 V supply voltage.  相似文献   
103.
Recently, wireless multimedia sensor networks (WMSNs) have emerged as one of the most important technologies, driven by the development of powerful multimedia device such as CMOS. WMSNs require several factors such as resource constraints, specific QoS, high bandwidth and so on. In this paper, we propose a hierarchical heterogeneous network model based routing protocol for WMSNs. In our proposal, proposed network model is classified into monitoring class, delivery class and aggregation class. Also we define two kinds of the routing path in order to ensure bandwidth and QoS. In simulation results, we illustrate the performance of our proposal.  相似文献   
104.
This paper proposes a new joint channel coding algorithm based on principal component analysis. A conventional joint channel coder using passive downmixing undergoes a reduction of both the primary‐to‐ambient energy ratio (PAR) of the downmix signal and the panning gain ratio of the primary source. The proposed system preserves the PAR of the downmix signal by using active downmixing which reflects spatial characteristic. The proposed system also improves the accuracy of the panning gain ratio estimation. Computer simulations and subjective listening tests verify the performance of the proposed system.  相似文献   
105.
Well-crystallized Ca9ZnLi(PO4)7 ceramics were prepared by reactive pressureless sintering at atmospheric pressure. The single-phase Ca9ZnLi(PO4)7 ceramics were confirmed by x-ray diffraction (XRD). The dielectric and electrical properties were investigated over a wide frequency range (1 Hz to 1 MHz) by complex impedance spectroscopy at different temperatures between 25°C and 600°C. A dielectric anomaly was observed at 440°C, which might be related to the phase transition. The impedance Cole–Cole plot was used to analyze the results of complex impedance measurements, revealing that the electrical properties depend strongly on frequency and temperature. Two relaxation dispersions of the electrical parameters were found and analyzed in terms of bulk and grain-boundary ionic transfer processes. The slope of the alternating-current (AC) conductivity over a wide range of temperatures provides activation energies from 0.48 eV to 1.69 eV. These results suggest that the conduction process is of the mixed type.  相似文献   
106.
In the electronic packaging field, the Sn-Zn alloy system has been recommended as a high-temperature Pb-free solder. There is a need for thermodynamic data on the Sn-Ni-Zn ternary system. Such data would serve as a basis for understanding the interfacial reaction between Sn-Zn high-temperature solder and Ni substrates and for thermodynamically evaluating the proper composition level of Ni and Zn in Sn-based solder. This study has investigated the phase equilibria of the Sn-Ni-Zn ternary system at 800°C, 500°C, and 200°C (for Ni composition of less than 60 at.%). Scanning electron microscopy (SEM), x-ray diffraction (XRD), and electron probe microanalysis (EPMA) were used to identify the equilibrium phases. On the basis of the experimental data and thermodynamic parameters, the isothermal sections of the Sn-Ni-Zn ternary system have been described, considering the ternary solubility in the binary phases and newfound ternary phases τ1 (Sn3Ni4Zn3) and τ2 (Sn4Ni4Zn2).  相似文献   
107.
108.
Herein, the exploration of natural plant‐based “spores” for the encapsulation of macromolecules as a drug delivery platform is reported. Benefits of encapsulation with natural “spores” include highly uniform size distribution and materials encapsulation by relatively economical and simple versatile methods. The natural spores possess unique micromeritic properties and an inner cavity for significant macromolecule loading with retention of therapeutic spore constituents. In addition, these natural spores can be used as advanced materials to encapsulate a wide variety of pharmaceutical drugs, chemicals, cosmetics, and food supplements. Here, for the first time a strategy to utilize natural spores as advanced materials is developed to encapsulate macromolecules by three different microencapsulation techniques including passive, compression, and vacuum loading. The natural spore formulations developed by these techniques are extensively characterized with respect to size uniformity, shape, encapsulation efficiency, and localization of macromolecules in the spores. In vitro release profiles of developed spore formulations in simulated gastric and intestinal fluids have also been studied, and alginate coatings to tune the release profile using vacuum‐loaded spores have been explored. These results provide the basis for further exploration into the encapsulation of a wide range of therapeutic molecules in natural plant spores.  相似文献   
109.
The microstructure and microhardness of Sn-xAg and Sn-xCu solders were investigated as functions of alloy composition and cooling rate. The Ag compositions examined varied from 0.5 wt.% to 3.5 wt.%, while Cu varied from 0.5 wt.% to 2.0 wt.%. Three cooling rates were employed during solidification: 0.02°C/s (furnace cooling), about 10°C/s (air cooling), and 100°C/s or higher (rapid solidification). Sn grain size and orientation were observed by cross-polarization light microscopy and electron-backscattering diffraction (EBSD) techniques. The microhardness was measured to correlate the mechanical properties with alloy compositions and cooling rates. From this study, it was found that both alloy composition and cooling rate can significantly affect the Sn grain size and hardness in Sn-rich solders. The critical factors that affect the microstructure–property relationships of Sn-rich solders are discussed, including grain size, crystal orientation, dendrite cells, twin boundaries, and intermetallic compounds (IMC).  相似文献   
110.

This study reports on the analysis of vehicle deformation due to rollover using multi-body dynamics which enables estimating motions of rigid bodies subjected to external forces. For the vehicle rollover analysis using the ADAMS, we have developed a FEA-based numerical vehicle model consisting of a rigid lower body and a deformable upper body. Here, comprehensive analysis of the static and dynamic roof strength resistance of a vehicle using our prediction model is described. We obtain the displacement of A-pillar top-end of a vehicle for each of the static and dynamic tests according to the FMVSS 216 protocol and the Controlled rollover impact system (CRIS) condition, respectively. The displacement of A-pillar top-end represents the roof intrusion causing injuries for passengers in the front seats, thereby evaluating the Strength to weight ratio (SWR) of a vehicle.

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