1.5 V Sub‐mW CMOS Interface Circuit for Capacitive Sensor Applications in Ubiquitous Sensor Networks

In this paper, a low‐power CMOS interface circuit is designed and demonstrated for capacitive sensor applications, which is implemented using a standard 0.35‐μm CMOS logic technology. To achieve low‐power performance, the low‐voltage capacitance‐to‐pulse‐width converter based on a self‐reset operation at a supply voltage of 1.5 V is designed and incorporated into a new interface circuit. Moreover, the external pulse signal for the reset operation is made unnecessary by the employment of the self‐reset operation. At a low supply voltage of 1.5 V, the new circuit requires a total power consumption of 0.47 mW with ultra‐low power dissipation of 157 μW of the interface‐circuit core. These results demonstrate that the new interface circuit with self‐reset operation successfully reduces power consumption. In addition, a prototype wireless sensor‐module with the proposed circuit is successfully implemented for practical applications. Consequently, the new CMOS interface circuit can be used for the sensor applications in ubiquitous sensor networks, where low‐power performance is essential.     

In2O3纳米线制备及其特性

使用管式加热炉成功地制备出In2O3纳米线.通过扫描电子显微镜可以看到样品为In2O3纳米线;X射线衍射分析证实该材料是立方结构的In2O3;X射线光电子谱分析发现该In2O3中存在大量氧缺陷;光致发光谱研究显示制得的In2O3纳米线有比较强的发光现象,主要集中在紫外光谱区.同时对反应的气相-固相(V-S)生长机理和In2O3的光致发光机理进行了详细分析.     

MEMS Inductor Consisting of Suspended Thick Crystalline Silicon Spiral with Copper Surface Coating

报道了一种由悬浮在玻璃衬底上的表面镀铜平面单晶硅螺线构成的新型MEMS电感,可消除衬底损耗及减小电阻损耗.采用一种硅玻璃键合-深刻蚀成型释放工艺并结合无电镀技术制作该电感,形成厚约40μm的硅螺线,在硅螺线表面镀有高保形厚铜镀层,在铜镀层表面镀有起钝化保护作用的薄镍镀层.该电感的自谐振频率超过15GHz,在11.3GHz下,品质因子达到约40,电感值超过5nH.基于该电感的简化等效电路模型,采用一种特征函数法进行了参数提取,模拟结果与测量结果符合得很好.     

CSP封装Sn-3.5Ag焊点的热疲劳寿命预测

对芯片尺寸封装(CSP)中Sn-3.5Ag无铅焊点在热循环加速载荷下的热疲劳寿命进行了预测.首先利用ANSYS软件建立CSP封装的三维有限元对称模型,运用Anand本构模型描述Sn-3.5Ag无铅焊点的粘塑性材料特性;通过有限元模拟的方法分析了封装结构在热循环载荷下的变形及焊点的应力应变行为,并结合Darveaux疲劳寿命模型预测了无铅焊点的热疲劳寿命.     

基于统计线性回归的粒子滤波方法

针对非线性、非高斯系统的状态估计问题,该文提出了一种基于统计线性回归的粒子滤波算法。在该算法中,首先对非线性函数基于统计线性回归展开,并利用高斯积分估计回归系数,依此产生重要性密度函数。该密度函数融入了最新的观测信息,扩大了与系统真实后验密度的重叠区域。理论分析和实验结果表明,该算法具有较高的估计精度,与一般的粒子滤波算法相比,有较好的稳定性和较低的计算量。     

High Mobility 3D Dirac Semimetal (Cd3As2) for Ultrafast Photoactive Terahertz Photonics

The Dirac semimetal cadmium arsenide (Cd₃As₂), a 3D electronic analog of graphene, has sparked renewed research interests for its novel topological phases and excellent optoelectronic properties. The gapless nature of its 3D electronic band facilitates strong optical nonlinearity and supports Dirac plasmons that are of particular interest to realize high-performance electronic and photonic devices at terahertz (1 THz = 4.1 meV) frequencies, where the performance of most dynamic materials are limited by the tradeoff between power-efficiency and switching speed. Here, all-optical, low-power, ultrafast broadband modulation of terahertz waves using an ultrathin film (100 nm, λ/3000) of Cd₃As₂ are experimentally demonstrated through active tailoring of the photoconductivity. The measurements reveal the photosensitive metallic behavior of Cd₃As₂ with high terahertz electron mobility of 7200 cm² (Vs)⁻¹. In addition, optical fluence dependent ultrafast charge carrier relaxation (15.5 ps), terahertz mobility, and long momentum scattering time (157 fs) comparable to superconductors that invoke kinetic inductance at terahertz frequencies are demonstrated. These remarkable properties of 3D Dirac topological semimetal envision a new class of power-efficient, high speed, compact, tunable electronic, and photonic devices.     

Interlamellar Lithium-Ion Conductor Reformed Interface for High Performance Lithium Metal Anode

Lithium metal anodes are promising for application in new-type secondary batteries. Unfortunately, low cycle life and safety peril induced by uncontrollable dendrites growth and weak solid electrolyte interface (SEI) have blocked their utilization. In this work, an interlamellar lithium-ion conductor of lithium-montmorillonite (Li-MMT) is applied to enhance the SEI properties, inhibit dendrites-germination, and thus significantly enhance electrochemical performance. Such a well-designed Li-MMT SEI not only possesses inherent fast lithium-ion channels, but also works as a reservoir to supply adequate lithium-ions in the interlaminations and periphery of Li-MMT nanosheets, offering fast lithium-ion transfer in interlaminations and sheet-to-sheet. Furthermore, the strong trend of lithium-ion absorption of Li-MMT is confirmed by density functional theory calculations and stable lithium deposition under Li-MMT SEI layer at 10 mA cm⁻² is verified via finite element modeling. As a result, a steady lithium deposition process without dendrites is achieved. Coulombic efficiency of the half-cell accomplishes a mean value of 99.1% over 400 cycles at 1 mA cm⁻², while Li-LiFePO₄ full cells show a stable capacity up to 120 mAh g⁻¹ and steady circulation over 400 loops at 1C. This work offers a novel strategy to design a high-performance SEI layer and suppress dendrite growth.     

氧化后退火技术对SiO2/4H-SiC界面态密度的影响

采用等离子体增强化学气相沉积(PECVD)低温处理和高温快速退火的技术,研究了退火条件对SiO2/4H-SiC界面态密度的影响.在n型4H-SiC外延片上高温干氧氧化50 nm厚的SiO2层并经N2原位退火,随后在PECVD炉中对样品进行350℃退火气氛为PH3,N2O,H2和N2的后退火处理,之后进行高温快速退火,最后制备Al电极4H-SiC MOS电容.I-V和C-V测试结果表明,各样品的氧化层击穿场强均大于9 MV/cm,PH3处理可以降低界面有效负电荷和近界面氧化层陷阱电荷,但PH3处理样品的界面态密度比N2O处理的结果要高.经N2O氛围PECVD后退火样品在距离导带0.2和0.4 eV处的界面态密度分别约为1.7× 1012和4×1011eV-1·cm-2,有望用于SiC MOSFET器件的栅氧处理.