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81.
Kilchytska V. Neve A. Vancaillie L. Levacq D. Adriaensen S. van Meer H. De Meyer K. Raynaud C. Dehan M. Raskin J.-P. Flandre D. 《Electron Devices, IEEE Transactions on》2003,50(3):577-588
This work presents a systematic comparative study of the influence of various process options on the analog and RF properties of fully depleted (FD) silicon-on-insulator (SOI), partially depleted (PD) SOI, and bulk MOSFET's with gate lengths down to 0.08 /spl mu/m. We introduce the transconductance-over-drain current ratio and Early voltage as key figures of merits for the analog MOS performance and the gain and the transition and maximum frequencies for RF performances and link them to device engineering. Specifically, we investigate the effects of HALO implantation in FD, PD, and bulk devices, of film thickness in FD, of substrate doping in SOI, and of nonstandard channel engineering (i.e., asymmetric Graded-channel MOSFETs and gate-body contacted DTMOS). 相似文献
82.
2-D symmetry: theory and filter design applications 总被引:1,自引:0,他引:1
In this comprehensive review article, we present the theory of symmetry in two-dimensional (2-D) filter functions and in 2-D Fourier transforms. It is shown that when a filter frequency response possesses symmetry, the realization problem becomes relatively simple. Further, when the frequency response has no symmetry, there is a technique to decompose that frequency response into components each of which has the desired symmetry. This again reduces the complexity of two-dimensional filter design. A number of filter design examples are illustrated. 相似文献
83.
84.
K. N. Subramanian J. G. Lee 《Journal of Materials Science: Materials in Electronics》2004,15(4):235-240
Properties of body centered tetragonal tin are highly anisotropic. As a consequence large stresses can develop at the tin grain boundaries due to coefficient of thermal expansion mismatch during temperature excursions. A modeling approach to evaluate the 3D stress states that develop at grain boundaries during thermomechanical fatigue in tin-based solder is presented. Development of significant amounts of stresses in the plane of the grain boundary can cause grain-boundary sliding and surface-relief effects, while those normal to the grain boundary can cause grain-boundary decohesion and cracking. 相似文献
85.
Hambleton P.J. Ng B.K. Plimmer S.A. David J.P.R. Rees G.J. 《Electron Devices, IEEE Transactions on》2003,50(2):347-351
The nonlocal enhancement in the velocities of charge carriers to ionization is shown to outweigh the opposing effects of dead space, increasing the avalanche speed of short avalanche photodiodes (APDs) over the predictions of a conventional local model which ignores both of these effects. The trends in the measured gain-bandwidth product of two short InAlAs APDs reported in the literature support this result. Relatively large speed benefits are predicted to result from further small reductions in the lengths of short multiplication regions. 相似文献
86.
T. Choi J.‐H. Jang C.K. Ullal M.C. LeMieux V.V. Tsukruk E.L. Thomas 《Advanced functional materials》2006,16(10)
The probing of the micromechanical properties within a two‐dimensional polymer structure with sixfold symmetry fabricated via interference lithography reveals a nonuniform spatial distribution in the elastic modulus “imprinted” with an interference pattern in work reported by Tsukruk, Thomas, and co‐workers on p. 1324. The image prepared by M. Lemieux and T. Gorishnyy shows how the interference pattern is formed by three laser beams and is transferred to the solid polymer structure. The elastic and plastic properties within a two‐dimensional polymer (SU8) structure with sixfold symmetry fabricated via interference lithography are presented. There is a nonuniform spatial distribution in the elastic modulus, with a higher elastic modulus obtained for nodes (brightest regions in the laser interference pattern) and a lower elastic modulus for beams (darkest regions in the laser interference pattern) of the photopatterned films. We suggest that such a nonuniformity and unusual plastic behavior are related to the variable material properties “imprinted” by the interference pattern. 相似文献
87.
Suetsugu T. Kazimierczuk M.K. 《IEEE transactions on circuits and systems. I, Regular papers》2006,53(7):1468-1476
Design equations for satisfying the off-nominal operating condition [i.e., only the zero-voltage switching (ZVS) condition] of the Class-E amplifier with a linear shunt capacitance at a duty ratio D=0.5 are derived. A new parameter s (V/s), called the slope of switch voltage when the switch turns on is introduced to obtain an image of the distance from the nominal conditions. By examining off-nominal Class-E operation degree of the design freedom of the Class-E amplifier increases by one. In addition various amplifier parameters such as operating frequency, output power, and load resistance range can be set as design specifications. For example, the peak switch voltage and switch current can be taken into account in the design procedure. Examples of a design procedure of the Class-E amplifier for off-nominal operation are given. The theoretical results were verified with PSpice simulation and experiments. 相似文献
88.
Electronic structure and ferromagnetism in III–V compound-based diluted magnetic semiconductors (DMS) are investigated based on first-principles calculations by using the Korringa-Kohn-Rostoker method combined with the coherent-potential-approximation. The stability of the ferromagnetic phase in GaN-, GaAs-, GaP-, GaSb-based DMS is investigated systematically. The calculations show that 3d-impurities from the first-half of the transition metal series favor the ferromagnetic state, while impurities from the latter-half of the series exhibit spin-glass behavior. This chemical trend in the magnetism is explained by the double exchange mechanism taking the local symmetry at the impurity gap states into account. Curie temperatures of GaAs- and GaN-based DMS are estimated by using the Heisenberg model in a mean field approximation with the parameters calculated from first-principles. It is suggested that room-temperature ferromagnetism can be realized in these systems. 相似文献
89.
Takauchi H. Tamura H. Matsubara S. Kibune M. Doi Y. Chiba T. Anbutsu H. Yamaguchi H. Mori T. Takatsu M. Gotoh K. Sakai T. Yamamura T. 《Solid-State Circuits, IEEE Journal of》2003,38(12):2094-2100
We describe a CMOS multichannel transceiver that transmits and receives 10 Gb/s per channel over balanced copper media. The transceiver consists of two identical 10-Gb/s modules. Each module operates off a single 1.2-V supply and has a single 5-GHz phase-locked loop to supply a reference clock to two transmitter (Tx) channels and two receiver (Rx) channels. To track the input-signal phase, the Rx channel has a clock recovery unit (CRU), which uses a phase-interpolator-based timing generator and digital loop filter. The CRU can adjust the recovered clock phase with a resolution of 1.56 ps. Two sets of two-channel transceiver units were fabricated in 0.11-/spl mu/m CMOS on a single test chip. The transceiver unit size was 1.6 mm /spl times/ 2.6 mm. The Rx sensitivity was 120-mVp-p differential with a 70-ps phase margin for a common-mode voltage ranging from 0.6 to 1.0 V. The evaluated jitter tolerance curve met the OC-192 specification. 相似文献
90.
Web Services Architecture 总被引:1,自引:0,他引:1
K Mockford 《BT Technology Journal》2004,22(1):19-26
The underlying need for Web Services has been demonstrated by their early adoption and rapid evolution during the last few
years. This evolution has resulted in a number of specifications being proposed that at first glance seem independent of one
another. The current immaturity of the base technology and the growing number and diversity of specifications related to Web
Services is sometimes seen as a barrier to developers attempting to combine them to create a working piece of software. For
some, the apparent lack of stability and coherence in the specifications even raises the question of the real long-term viability
and value of the technology. This document puts those specifications into perspective by describing the set of interoperable
XML protocols that are the foundation of building interoperable systems, middleware, and applications.
This revised version was published online in July 2006 with corrections to the Cover Date. 相似文献