Estimation of failure probability from a bivariate normal stress-strength distribution

Probability (P) of equipment failure consequent upon stress exceeding built-in strength has been estimated assuming a bivariate normal stress-strength distribution. The UMVUE of P when parameters other than the means are known has been derived. An alternative estimator based on maximum likelihood estimates has been proposed in the case when all the five parameters are unknown. Asymptotic variances of both these estimators have been worked out. Some relevant numerical computations have also been reported.     

Integrating design and measurement

At the 2004 International Instrumentation and Measurement Conference in Italy, a number of us were discussing the growing importance of system-level design and the implications for simulation and measurement technologies. It was puzzling to us that technology continues to increase in complexity, yet the last two decades have seen the design world of simulation and modeling diverge from the world of measurement and testing. Today's systems, whether they are commercial products or scientific experiments, require a convergence of technologies that makes performance measurement and validation not only more critical but also more prone to error. In the discussions a point that came up repeatedly was the value of bringing the design and test communities closer together, and it was suggested that it was timely to highlight this issue. With that in mind, this note aims to stimulate community discussion by first examining some benefits and challenges of integration and then outlining possible directions for collaboration between the simulation and measurement communities.     

Minimizing power dissipation in optical interconnects at low voltage using optimal modulator design

A strong motivation for insertion of optical interconnects in short-distance applications such as chip-to-chip or back-plane communication, apart from high bit rates, is their potential to achieve these bit rates at low power compared to the currently prevalent copper based interconnects. Thus, it is imperative to construct design methodologies which minimize the total optical link power dissipation. We present one such methodology, where we optimize the quantum-well modulators to minimize the power dissipation in modulator-based optical interconnects. In the first part of the paper, the focus is on obtaining the optimal modulator metrics [contrast ration (CR) and insertion loss], which yield the lowest total power (receiver and the modulator). The trends are studied as a function of the input laser power and bit rate. Having obtained the desirable modulator metrics and the corresponding power dissipation, in the second part, the focus is on the feasibility of these metrics in the light of voltage swing constraints. The biggest concern with the modulator based optical link is the low CR, especially at low voltage swing. While studying these concerns, we also provide insight into the physical design of the modulator including, its intrinsic region thickness, pre-bias voltage, and the size and the number of quantum-wells. Specifically, we outline the method to obtain the design parameters, which allows minimum power dissipation with the least laser power. This ultimately yields higher aggregate I/O bandwidth for chip to chip communication in power limited chips.     

A 300-MHz 25-/spl mu/A/Mb-leakage on-chip SRAM module featuring process-variation immunity and low-leakage-active mode for mobile-phone application processor

An on-chip 1-Mb SRAM suitable for embedding in the application processor used in mobile cellular phones was developed. This SRAM supports three operating modes - high-speed active mode, low-leakage low-speed active mode, and standby mode - and uses a subdivisional power-line control (SPC) scheme. The combination of three operating modes and the SPC scheme realizes low-power operation under actual usage conditions. It operates at 300 MHz, with leakage of 25 /spl mu/A/Mb in standby mode, and 50 /spl mu/A/Mb at the low-leakage active mode. This SRAM also uses a self-bias write scheme that decreases of minimum operating voltage by about 100 mV.     

Self-Adapting Linear Algebra Algorithms and Software

One of the main obstacles to the efficient solution of scientific problems is the problem of tuning software, both to the available architecture and to the user problem at hand. We describe approaches for obtaining tuned high-performance kernels and for automatically choosing suitable algorithms. Specifically, we describe the generation of dense and sparse Basic Linear Algebra Subprograms (BLAS) kernels, and the selection of linear solver algorithms. However, the ideas presented here extend beyond these areas, which can be considered proof of concept.     

Effect of temperature and cyclic heating on the structure and strength of glass textolite

The article established the regularities of change of the physicomechanical characteristics and strength of glass textolites in single and repeated thermal loading. It shows that under multiple loading the intense loss of strength of the investigated materials is due to increased porosity on account of the large number of microcracks appearing in the structure. A correlation is obtained between the elastic and strength characteristics and porosity in dependence on the temperature of multiple heating which in the first approximation is described by a polynomial of second degree with respect to temperature, multiplied by the reciprocal of porosity.Translated from Problemy Prochnosti, No. 6, pp. 53–58, June, 1991.     

Comfort limits for asymmetric thermal radiation

Groups of 32 and 16 subjects of both sexes were exposed in an environmental chamber to radiant asymmetry caused by a cool wall, a warm wall, and a cool ceiling. Each subject was tested individually while seated and clothed at 0.6 clo. During each 3.5-hour experiment the subject was exposed to six radiant temperature asymmetries. He was asked whether and where he experienced any local cool or warm sensation, and whether it was felt to be uncomfortable. During the entire experiment he was kept thermally neutral by changing the air temperature according to his wishes.For cool walls, warm walls, and cool ceilings curves have been established showing the percentage of dissatisfied subjects as a function of the radiant asymmetry. Radiant asymmetry at a warm wall caused less discomfort than a cool wall. A cool ceiling caused less discomfort than a warm ceiling. Accepting that 5% of the subjects may feel uncomfortable. a radiant temperature asymmetry of 10°C is allowable at a cool wall, 23°C at a warm wall, and 14°C under a cool ceiling. A previous study showed that 4°C is allowable under a warm ceiling. Radiant asymmetry had no significant impact on the operative temperatures preferred by the subjects. No significant differences were observed between the responses of men and women exposed to radiant asymmetry.     

Use of colloidal ruthenium particles in the electrochemical reduction of benzene by solvated electrons

Ruthenium colloidal particles prepared by the decomposition of a ruthenium acid sulfite complex increased the electrochemical reduction of benzene from 45% to 60% at room temperature and 10 psig of hydrogen. The reduction was carried out in a 21 mole % ethanol - 79 mole % hexamethylphosporamide. The significant increase in the percent of benzene reduced was accompanied by an apparent current efficiency of 98%. Comparison with analogous experiments employing colloidal platinum particles indicates that the above increase in benzene reduction can be attributed to direct catalytic hydrogenation by the ruthenium.     

Whisker reinforcement of glass-ceramics

Silicon carbide whisker reinforcement of anorthite and cordierite glass ceramics has been studied. At 25 vol% whisker loading the flexural strengths increased from 65–103 MPa to 380–410 MPa, the fracture toughnesses increased from 1.0–1.5 MPa m^1/2 to 5.2–5.5 MPa m^1/2. The strengths decline to 240–276 MPa at 1200 °C. The reasons for the decrease in strength with temperature are discussed. Whiskers from two different sources with differences in diameters and aspect ratios were evaluated and the effect of the whisker morphology on the composite properties was studied. It was found that larger diameter, higher aspect ratio whiskers result in improved composite performance. The composites were also characterized in terms of their thermal properties, i.e. thermal expansions and thermal conductivities. The thermal expansion coefficient from 25–1000 °C for anorthite-based composite was 4.6×10^–6 °C^–1 and that for the cordierite-based composite was 3.62×10^–6 °C^–1. The thermal conductivities at 1000 °C were 3.75 and 4.1 Wm^–1 K^–1 for cordierite and anorthite composites, respectively.