ZnGa2O4纳米晶的制备和结构表征

采用喷射共沉淀法制备了ZnGa2O4 纳米晶，XRD、SEM和TEM结构分析结果表明，喷射共沉淀法制备的ZnGa2O4的纳米晶颗粒细小均匀，形状完整，与化学共沉淀法相比，粒子尺寸明显减小，小于10nm，同时ZnO杂相峰消失，分析了喷射共沉淀法的机理，并对实验结果进行了解释。     

模糊数学识别火山岩岩性

针对火岩地层岩性识别成功率低的状况，应用模糊数学原理，建立模糊数学识别火山岩岩性模式，识别和划分火山岩地层岩性，以便进一步深入研究火山岩油气藏储层，选择8个反映火山岩岩性测井参数，确定阈值；利用所建立的火山岩岩性识别模式，对火山岩岩性进行分类；依据最大隶属原则，识别火山岩岩性，应用实地研究资料，识别10种火山岩岩性，并与岩心鉴定统计分析结果对比，一致性达85％。表明该方法识别火山岩岩性精度较高，在地质上具有很好的应用前景。     

钨合金圆筒爆破试验破片分布的统计分析

采用圆筒爆破试验方法研究了易碎型钨合金的破片分布特征,并与93W合金的结果进行了对比.对破片的数量和质量分布特征进行了统计分析,发现易碎型钨合金的破片率明显高于93W合金,而且破片的均匀性也明显好于93W合金,但易碎钨合金的破片回收率低于93W合金,而且受装药量的影响较大.     

高温预析出对Al-Zn-Mg系铝合金时效硬化和应力腐蚀的影响

研究了高温固溶后降温处理工艺对中强可使预析出LC52和7039铝合金的组织、时效硬化和应力腐蚀的影响。金相观察发现,高温预析出可优先在晶界处产生,并提高随后时效状态下晶界析出相的不连续分布程度,温度降低到一定程度晶内和晶界产生大量析出。合金拉伸性能和应力腐蚀结果表明,预析出在保持强度和塑性的同时,可提高抗应力腐蚀性能。而预析出温度降低,合金强度呈下降趋势。     

在不断创新中开创新的百年——水口山有色金属集团有限公司110年创新发展历程和展望

回顾了水口山有色金属集团有限公司的发展历程，概述了取得的技术进步和主要成就．提出了企业今后的发展方向。     

A Distributed State Estimator Utilizing Synchronized Phasor Measurements

With the creation of balancing authorities by the North American Reliability Council that span large portions of the North American interconnection, and stringent requirements for real time monitoring of power system evolution, faster and more accurate state estimation algorithms that can efficiently handle systems of very large sizes are needed in the present environment. This paper presents a distributed state estimation algorithm suitable for large-scale power systems. Synchronized phasor measurements are applied to aggregate the voltage phase angles of each decomposed subsystem in the distributed state estimation solution. The aggregated state estimation solution is obtained from the distributed solution using a sensitivity analysis based update at chosen boundary buses. Placement of synchronized phasor measurements in the decomposed subsystems is also investigated in this paper. Test results on the IEEE 118-bus test bed are provided     

JOINING MECHANISMS OF β''''-Al2O3 CERAMIC AND PYREX GLASS TO Al MATRIX COMPOSITE

The bonding of β'-Al2O3 and pyrex glass to Al matrix composites by anodic bonding process is achieved. The microstructure of the bonded interface and the joining mechanisms are analyzed with scanning electron microscope (SEM), energy dispersive X-ray fluorescence spectrometer (EDX). It is observed that the bonding region across the interface consists of the metal layer, oxide transitional layer and the ceramic layer, with the transitional layer composed of surface region and sub-surface region. The bonding process can mainly be categorized into anodic bonding process and solid state diffusing process. The pile-up of the ions and its drift in the interface area are the main reasons for anode oxidation and joining of the interface. The temperature, voltage and the drift ions in the ceramic or glass during the bonding process are the essential conditions to solid state diffusing and oxide bonding at the interface. The voltages, temperature, pressure as well as the surface state are the main factors that influence the anodic bonding.