基于击键动力学和口令的双因素用户验证

提出基于击键动力学和口令的一种新的身份验证方法，该方法监视用户在输入口令时的用户击键特征的有关数据，通过采用监视键盘输入时一种新的三键持续时间的击键特征表示，用一种表示用户节奏的相对击键速度的距离衡量方式，在正常样本上建立用户模式，然后用新样本与用户模式的距离匹配情况来验证用户身份的合法性。实验表明该方法简单实用，识别效率高。     

Tri-axial sensors and actuators made of a single piezoelectric cylindrical shell

Electromechanical transducers for sensing and actuating disturbances or vibrations have been used in many fields of applications. There have been transducers of different configuration developed for the unidirectional transduction. This paper demonstrates a single element transducer for tri-axial components made of a piezoelectric cylindrical shell. The separation of the tri-axial transductions is achieved by devising a proper electrode arrangement. The structure and the fundamental idea are first presented, and then the numerical analysis by means of the finite element modeling follows, and their characteristics and behaviors are then experimentally verified.     

构建高扩展性的县级广电宽带数据网络

提出在县市级广电宽带数据网络的建设过程中,要着眼业务发展,突出高扩展性,构建基于标准、扩展灵活的主干网,实现网络建设的可持续性发展,并结合实际,从核心设备、端口、中继带宽、网络业务4个方面对扩展能力进行了阐述.     

Finite element analysis of advanced multilayer capacitors

We establish a systematic methodology to design and analyse electromagnetic components such as advanced multilayer ceramic capacitors (MLCCs) using the finite element (FE) method. We employ a coupled formulation to compute the interaction between the electric and magnetic fields. Unlike a linear distribution of current assumed in the circuit model, an accurate electrostatic solution to model the entire advanced MLCCs (4 × 4 × 27 = 432 cells) is presented. The FE solution is used to compute the lumped parameters for a range of frequencies. These lumped parameters are then used to compute the parasitic elements of the MLCCs. We introduce two algorithms to efficiently analyse the behaviour of a capacitor with changing frequency. The lower frequency (much below the self‐resonant frequency of the capacitor) algorithm separates the effect of the electric and magnetic fields and reduces the computational effort required to solve the FE problem, whereas, the high‐frequency algorithm couples the effect between the electric and the magnetic fields. We use these algorithms in conjunction with a new multiple scale technique to effectively determine the small values of R, L and C in MLCCs. The formulation, the implementation, and the numerical results demonstrate the efficacy of the present FE formulation and establish a systematic methodology to design and analyse advanced electromagnetic components. Copyright © 2003 John Wiley & Sons, Ltd.     

龙潭水电站励磁装置可控硅易损原因及改进措施

通过龙潭水电站对励磁装置可控硅元件实施过电压保护改进前后实际效果的分析,介绍了一种有效的过压保护方式.     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

On the effect of spatial variances in historical rainfall time series to CSO performance evaluation.

Historical, high-resolution rain series are the backbone of modern combined sewer overflow (CSO) structure design. These rain series are the input to the computational estimation of the performance of the measures with respect to CSO pollution abatement. However, those historical precipitation measurements are available at only a few locations. Frequently rain series have to be used from gauging stations at a significant distance. In order to judge and to compensate for this influence an estimate between rain characteristics and combined sewer outflow (CSO) performance indicators would be useful. In this paper such correlations have been sought for a collection of 37 rain series covering large areas of Europe. It was found that the mean annual rain volume can explain most of the variances for the performance indicators Number of overflows and CSO volume. For explaining the spatial differences in the efficiency of the CSO structure another rain characteristic, i.e. the maximum event with a return period of one year, is to be used.     

不锈钢管道坡口加工的新方法

对于不锈钢管及合金钢管坡口的加工,采用以往的加工方法切割出来的坡口一般参差不平、比较粗糙,难于打磨平整。使用LGK空气等离子切割机和磁力管道切割机的组合加上一定的辅助手段,改善了不锈钢管及合金钢管的坡口加工效果,使加工出来的坡口像碳钢管一样平整,更加容易打磨组焊。文章介绍了这一新方法所用的设备、材料、切割原理以及操作过程。