Influence of Bulky Organo‐Ammonium Halide Additive Choice on the Flexibility and Efficiency of Perovskite Light‐Emitting Devices

Perovskite light‐emitting diodes (LEDs) require small grain sizes to spatially confine charge carriers for efficient radiative recombination. As grain size decreases, passivation of surface defects becomes increasingly important. Additionally, polycrystalline perovskite films are highly brittle and mechanically fragile, limiting their practical applications in flexible electronics. In this work, the introduction of properly chosen bulky organo‐ammonium halide additives is shown to be able to improve both optoelectronic and mechanical properties of perovskites, yielding highly efficient, robust, and flexible perovskite LEDs with external quantum efficiency of up to 13% and no degradation after bending for 10 000 cycles at a radius of 2 mm. Furthermore, insight of the improvements regarding molecular structure, size, and polarity at the atomic level is obtained with first‐principles calculations, and design principles are provided to overcome trade‐offs between optoelectronic and mechanical properties, thus increasing the scope for future highly efficient, robust, and flexible perovskite electronic device development.     

Power splitting–based energy‐harvesting protocol for wireless‐powered communication networks with a bidirectional relay

In this paper, we apply the power splitting–based energy‐harvesting protocol to enhance the transmission between a wireless access point and a mobile user via a helping relay. The mobile user exploits the energy supplied by the access point and forwarded by the relay to transmit its own data back to the access point, again with the helping of the relay. Here, the effect of various system parameters, including power‐splitting factor and the power‐to‐noise ratio on the system performance, is rigorously studied, with closed‐form expressions for the outage probability and system throughput as the results. Furthermore, we figure out the optimal power‐splitting ratio at which the information throughput from the user to the AP is maximized, subject to the constraint on the transmitting power at the access point. All above analytical results are also supported by Monte Carlo simulation.     

Optimal block boundary pre/postfiltering for wavelet-based image and video compression.

This paper presents a pre/postfiltering framework to reduce the reconstruction errors near block boundaries in wavelet-based image and video compression. Two algorithms are developed to obtain the optimal filter, based on boundary filter bank and polyphase structure, respectively. A low-complexity structure is employed to approximate the optimal solution. Performances of the proposed method in the removal of JPEG 2000 tiling artifact and the jittering artifact of three-dimensional wavelet video coding are reported. Comparisons with other methods demonstrate the advantages of our pre/postfiltering framework.     

固态继电器为电动汽车电池监测提供便利

电动汽车常被喻作“归来的孩子”，因为这项技术在多年前进入市场后便一直沉寂，直至最近才再次活跃起来。其实，电动汽车早于1835年首次于美国出现，到1899年，纽约市接近90％的出租车都是由电力驱动。然而，当电力启动器和内燃机变得完善时，电动汽车的使用就迅速衰退。随着如今对环境保护的关注，由燃烧碳氢化合物造成的污染，加之汽油成本高升的影响，再次     

A New Sidelobe Correction Algorithm for Microwave Radiometers: Application to the Envisat Instrument

The antenna temperature measured by a microwave radiometer is converted in brightness temperature (TB) by removing the different contributions that do not come from the main lobe of the antenna. Among them, the Earth contribution in the sidelobes may be significant as for the Environmental Satellite mission due to the antenna position on the platform. In such a case, simple corrections commonly applied on previous altimetry missions are inadequate, and a more accurate correction should be determined. We propose in this paper a new method based on global seasonal tables of contamination. This allows application of an accurate sidelobe correction in space and time in the retrieved TB computation     

High Performance Three‐Dimensional Chemical Sensor Platform Using Reduced Graphene Oxide Formed on High Aspect‐Ratio Micro‐Pillars

The sensing performance of chemical sensors can be achieved not only by modification or hybridization of sensing materials but also through new design in device geometry. The performance of a chemical sensing device can be enhenced from a simple three‐dimensional (3D) chemiresistor‐based gas sensor platform with an increased surface area by forming networked, self‐assembled reduced graphene oxide (R‐GO) nanosheets on 3D SU8 micro‐pillar arrays. The 3D R‐GO sensor is highly responsive to low concentration of ammonia (NH₃) and nitrogen dioxide (NO₂) diluted in dry air at room temperature. Compared to the two‐dimensional planar R‐GO sensor structure, as the result of the increase in sensing area and interaction cross‐section of R‐GO on the same device area, the 3D R‐GO gas sensors show improved sensing performance with faster response (about 2%/s exposure), higher sensitivity, and even a possibly lower limit of detection towards NH₃ at room temperature.     

All-active monolithic InP-based HBT VCO with tunable HEMT inductor

A novel HEMT-HBT VCO is presented; it is the first all-active analogue VCO demonstrated using InP HEMT-HBT integrated MMIC technology. The MMIC monolithically integrates an InP common-collector HBT oscillator with a tunable InP HEMT active inductor using selective MBE. The novel HEMT-HBT VCO can provide performance advantages over analogue VCOs such as the multi-vibrator, and has direct implications for high speed clock recovery circuits needed in InP based optoelectronic IC applications     

Evolution of a unique flip-chip MCM-L package

Flip-chip (FC) packaging is gaining acceptance in the electronics packaging arena. More sources of bumped die and high density printed wiring boards (PWBs) laminates become available every day. Also, known good die (KGD) issues are being resolved by several companies, and design tools to perform FC packaging designs are becoming more available. This is the infrastructure FC packaging requires to become the packaging method of choice, particularly for >200 I/O applications. FC packages come in a variety of styles: FC plastic ball grid arrays (FC/PBGAs), FC plastic quad flat packs (PC/PQFPs), etc. Presently, the industry's drive is toward single chip packages on low cost laminates; i.e., organic substrates. Work is starting to occur in the area of multichip FC packages, due to the need to increase memory to microprocessor speed communication. In this article, a unique FC/MCM-L package is discussed. Part I will concentrate on the development and reliability testing of a one to four chip leadless FC/MCM-L package. Unlike traditional surface mount (SM) components that are attached to printed wiring boards (PWBs) with leads, the SM pads within the body of the package are used for attachment to a PWB. Collapsible eutectic solder domes are deposited on the SM pads by traditional screen printing. After reflow, these domes are used to connect the FC/MCM-L to the PWB. Challenges encountered during package design, PWB fabrication and first and second level assembly will be discussed. Part II of this article will focus on the extension of this FC/MCM-L package to a BGA second level interconnect. Change of FC attachment method, design enhancements, assembly, and reliability testing results will be presented     

Performance Analysis of Full-Duplex Vehicle-to-Vehicle Relay System over Double-Rayleigh Fading Channels

Mobile Networks and Applications - In this paper, we study the performance of a full-duplex (FD) relay system in vehicle-to-vehicle (V2V) communication. In this relay communication system, the...     

Hybrid film of chemically modified graphene and vapor-phase-polymerized PEDOT for electronic nose applications

A hybrid of graphene and conducting polymer holds great potential as the active materials for high performance chemical sensor application. In this work, a thin hybrid film of reduced graphene oxide (RG-O) and poly(3,4-ethylenedioxythiophene) (PEDOT) was fabricated by means of vapor phase polymerization and explored as active material for chemical sensors. The chemical sensors based on hybrid film of RG-O and PEDOT are capable of detecting electrical signals caused by the absorption of trace levels of different analyte vapors with high sensitivity, selectivity and fast response.