Wearable cognitive assistants in a factory setting: a critical review of a promising way of enhancing cognitive performance and well-being

Cognition, Technology & Work - Rapid technological innovations are constantly influencing the complexification and automatization of the work lines pushing human operators to use diverse...     

Study on TSV isolation liners for a Via Last approach with the use in 3D-WLP for MEMS

This paper discusses approaches for the isolation of deep high aspect ratio through silicon vias (TSV) with respect to a Via Last approach for micro-electro-mechanical systems (MEMS). Selected TSV samples have depths in the range of 170…270 µm and a diameter of 50 µm. The investigations comprise the deposition of different layer stacks by means of subatmospheric and plasma enhanced chemical vapour deposition (PECVD) of tetraethyl orthosilicate; Si(OC₂H₅)₄ (TEOS). Moreover, an etch-back approach and the selective deposition on SiN were also included in the investigations. With respect to the Via Last approach, the contact opening at the TSV bottom by means of a specific spacer-etching method have been addressed within this paper. Step coverage values of up to 74 % were achieved for the best of those approaches. As an alternative to the SiO₂-isolation liners a polymer coating based on the CVD of Parylene F was investigated, which yields even higher step coverage in the range of 80 % at the lower TSV sidewall for a surface film thickness of about 1000 nm. Leakage current measurements were performed and values below 0.1 nA/cm² at 10 kV/cm were determined for the Parylene F films which represents a promising result for the aspired application to Via Last MEMS-TSV.     

From monolithic to component-based performance evaluation of software architectures

Model-based performance evaluation methods for software architectures can help architects to assess design alternatives and save costs for late life-cycle performance fixes. A recent trend is component-based performance modelling, which aims at creating reusable performance models; a number of such methods have been proposed during the last decade. Their accuracy and the needed effort for modelling are heavily influenced by human factors, which are so far hardly understood empirically. Do component-based methods allow to make performance predictions with a comparable accuracy while saving effort in a reuse scenario? We examined three monolithic methods (SPE, umlPSI, Capacity Planning (CP)) and one component-based performance evaluation method (PCM) with regard to their accuracy and effort from the viewpoint of method users. We conducted a series of three experiments (with different levels of control) involving 47 computer science students. In the first experiment, we compared the applicability of the monolithic methods in order to choose one of them for comparison. In the second experiment, we compared the accuracy and effort of this monolithic and the component-based method for the model creation case. In the third, we studied the effort reduction from reusing component-based models. Data were collected based on the resulting artefacts, questionnaires and screen recording. They were analysed using hypothesis testing, linear models, and analysis of variance. For the monolithic methods, we found that using SPE and CP resulted in accurate predictions, while umlPSI produced over-estimates. Comparing the component-based method PCM with SPE, we found that creating reusable models using PCM takes more (but not drastically more) time than using SPE and that participants can create accurate models with both techniques. Finally, we found that reusing PCM models can save time, because effort to reuse can be explained by a model that is independent of the inner complexity of a component. The tasks performed in our experiments reflect only a subset of the actual activities when applying model-based performance evaluation methods in a software development process. Our results indicate that sufficient prediction accuracy can be achieved with both monolithic and component-based methods, and that the higher effort for component-based performance modelling will indeed pay off when the component models incorporate and hide a sufficient amount of complexity.     

Restricted arc-connectivity of digraphs

Since interconnection networks are often modeled by graphs or digraphs, the edge-connectivity of a graph or arc-connectivity of a digraph are important measurements for fault tolerance of networks.The restricted edge-connectivity λ^′(G) of a graph G is the minimum cardinality over all edge-cuts S in a graph G such that there are no isolated vertices in G−S. A connected graph G is called λ^′-connected, if λ^′(G) exists.In 1988, Esfahanian and Hakimi [A.H. Esfahanian, S.L. Hakimi, On computing a conditional edge-connectivity of a graph, Inform. Process. Lett. 27 (1988), 195-199] have shown that each connected graph G of order n?4, except a star, is λ^′-connected and satisfies λ^′(G)?ξ(G), where ξ(G) is the minimum edge-degree of G.If D is a strongly connected digraph, then we call in this paper an arc set S a restricted arc-cut of D if D−S has a non-trivial strong component D₁ such that D−V(D₁) contains an arc. The restricted arc-connectivity λ^′(D) is the minimum cardinality over all restricted arc-cuts S.We observe that the recognition problem, whether λ^′(D) exists for a strongly connected digraph D is solvable in polynomial time. Furthermore, we present some analogous results to the above mentioned theorem of Esfahanian and Hakimi for digraphs, and we show that this theorem follows easily from one of our results.     

Modular architecture of the microfactories for automatic micro-assembly

The construction of a new generation of MEMS which includes micro-assembly steps in the current microfabrication process is a big challenge. It is necessary to develop new production means named micromanufacturing systems in order to perform these new assembly steps. The classical approach called “top-down” which consists in a functional analysis and a definition of the tasks sequences is insufficient for micromanufacturing systems. Indeed, the technical and physical constraints of the microworld (e.g. the adhesion phenomenon) must be taken into account in order to design reliable micromanufacturing systems. A new method of designing micromanufacturing systems is presented in this paper. Our approach combines the general “top-down” approach with a “bottom-up” approach which takes into account technical constraints. The method enables to build a modular architecture for micromanufacturing systems. In order to obtain this modular architecture, we have devised an original identification technique of modules and an association technique of modules. This work has been used to design the controller of an experimental robotic micro-assembly station.     

Enabling simulation interoperability

Over the past years a series of architectures have addressed the need to link multiple simulations. These efforts have been driven primarily by the desire to reuse existing "best of breed" simulations in new combinations to avoid developing any single, monolithic architecture with the impossible goal of meeting all simulation needs. The US Department of Defense began developing the high level architecture (HLA) for distributed computer simulation systems. The high level architecture addresses the need to link multiple computer simulation systems. HLA separates the data model from the architecture's functions for exchanging information.     

Encapsulated submillimeter piezoresistive accelerometers

While micromachined accelerometers are widely available and used in various applications, some biomedical applications require extremely small dimensions (相似文献   

Experiences using lightweight formal methods for requirementsmodeling

The paper describes three case studies in the lightweight application of formal methods to requirements modeling for spacecraft fault protection systems. The case studies differ from previously reported applications of formal methods in that formal methods were applied very early in the requirements engineering process to validate the evolving requirements. The results were fed back into the projects to improve the informal specifications. For each case study, we describe what methods were applied, how they were applied, how much effort was involved, and what the findings were. In all three cases, formal methods enhanced the existing verification and validation processes by testing key properties of the evolving requirements and helping to identify weaknesses. We conclude that the benefits gained from early modeling of unstable requirements more than outweigh the effort needed to maintain multiple representations