Mechanical stress evolution and the blech length: 2D simulation of early electromigration effects

Modeling of stress and electromigration at the microscopic level, in confined interconnect metallic lines with tungsten studs, can very well account for the resistance behaviour in time. The resistance change at saturation for a metallic line with blocking boundaries at both ends can be related, according to the model, to threshold product (jL)_c found by Blech [1].     

Vapor pressures of Y,Ba, Cu precursors for the growth of YBa2Cu3O7 by MOVPE

The vapor pressures of theβ-diketonates Y(THD), Ba(THD), and Cu(THD), commonly used as precursors for MOVPE of YBa₂Cu₃O₇, and Y(MCP) were measured at different temperatures. A time-resolved static method recording the pressure vs. time at constant temperature was used, permitting us to deduce the vapor pressure even if the materials tend to decompose. The values of the constants of the Clausius-Clapeyron equation log₁₀p(T)/p ₀=A-B/T are,A=11.7, 8.7, 8.27, 16.6 andB=4359, 2654, 3602, and 6453 K for Y(THD), Y(MCP), Ba(THD), and Cu(THD), respectively withp ₀= 1 Pa and temperatureT in K. The thermal stability of the sources was measured and are discussed.     

Development of maraging steel compositions intended for quenching from the liquid state

A. A. Baikov Institute of Metallurgy, Moscow. Ulyanovsk Polytechnic Institute. Translated from Metallovedenie i Termicheskaya Obrabotka Metallov, No. 4, pp. 22–25, April, 1992.     

Properties of titanium-containing sol-gel films modified with copper and vanadium oxides

Translated from Steklo i Keramika, No. 1, pp. 4–6, January, 1994.