SHS of shape memory CuZnAl alloys

Aiming at preparation of shape memory alloys (SMAs), we explored the SHS of Cu_{1 − x} Zn_{1 − y} Al_{1 − z} alloys (0.29 < x < 0.30, 0.74 < y < 0.75, and 0.83 < z < 0.96). The most pronounced shape memory effect was exhibited by the alloys of the following compositions (wt %): (1) Cu(70.6)Zn(25.4)Al(4.0), (2) Cu(70.1)Zn(25.9)Al(4.0), and (3) Cu(69.9)Zn(26.1)Al(4.0). The effect of process parameters on the synthesis of CuZnAl alloys was studied by XRD, optical microscopy, and scanning electron microscopy (SEM). The grain size of CuZnAl was found to depend on the relative amount of the primary CuZn and AlZn phases. Changes in the transformation temperature and heat of transformation are discussed in terms of ignition intensity and compaction. Mechanism of the process depends on the level of the temperature attained relative to the melting point of components. At the melting point of AlZn, the process is controlled by the solid-state diffusion of AlZn into a product layer. The ignition temperature for this system depends on the temperature of the austenite-martensite transformation in CuZnAl alloys. The composition and structure of the products was found to markedly depend on process parameters. The SHS technique has been successfully used to prepare a variety of SMAs.      

Choosing the technology of combined processing of titanium-rare-metal raw materials

The main rules and principles which govern the choice of new variants for chemical technology of combined processing of titanium-rare-metal raw materials are considered. The existing variants of the technology are characterized from the viewpoint of their technological, economical, and ecological efficiency and social importance for a given region. A realistic choice of a technology from a large number of available variants should take into account the entire combination of their advantages and disadvantages The implementation of a rational technological scheme will result in the creation of economically profitable and efficient domestic production satisfying the demands of Russian industry in rare-metal and titanium materials. Directions are noted in which it is expedient to continue studies on designing a rational technology of loparite concentrate or some other concentrate.     

Optimal management of logistic activities in multi-site environments

The new emerging area of Enterprise Wide Optimization (EWO) has focused the attention in effectively solving the combined production/distribution scheduling problem. The importance of logistic activities performed in multi-site environments comes from the relative magnitude of the associated transportation costs and the good chance of getting large savings on such expenses. This paper first develops an exact MILP mathematical formulation for the multiple vehicle time-window-constrained pickup and delivery (MVPDPTW) problem. The approach is able to account for many-to-many transportation requests, pure pickup and delivery tasks, heterogeneous vehicles and multiple depots. Optimal solutions for a variety of benchmark problems with cluster/random distributions of pickup and delivery locations and limited sizes in terms of customer requests and vehicles have been discovered. However, the computational cost exponentially grows with the number of requests. For large-scale m-PDPTW problems, a local search improvement algorithm steadily providing a better solution through two evolutionary steps is also presented. A neighborhood structure around the starting solution is generated by first allowing multiple request exchanges among nearby trips and then permitting the reordering of nodes on every individual route. If a better set of routes is found, both steps are repeated until no improved solution is discovered. Compact MILP mathematical formulations for both sub-problems have been developed and solved through an efficient branch-and-bound algorithm. A significant number of large-scale m-PDPTW benchmark problems, some of them including up to 100 transportation requests, were successfully solved in reasonable CPU times.     

Highly heat-resistant mullite-silicon carbide materials

Cross-linking additions of silicon carbide and waste material from ferroalloy production make it possible to increase the heat-resistance index for mullite-containing refractories. For briquette specimens based on a charge containing aluminum powder it reaches 45 thermal cycles (1300°C – water). Translated from Novye Ogneupory, No. 11, pp. 44–46, November 2008.     

Analysis of an algorithm for solution of conditional optimization problems with linear-fractional objective functions over permutations

A method is considered to solve a conditional optimization problem with a linear-fractional objective function over permutations. The performance of sub algorithms to solve this problem is evaluated. The practical efficiency of the algorithm is analyzed by conducting numerical experiments. __________ Translated from Kibernetika i Sistemnyi Analiz, No. 4, pp. 133–146, July–August 2007.     

Rehabilitation of the radioactively contaminated objects and territory of the Russian Science Center Kurchatov Institute

This article is devoted to work done in 2002–2006 as part of the unified project Reabilitatsiya to rehabilitate radiation hazardous objects and sections of the radioactively contaminated territory of the Russian Science Center Kurchatov Institute. The main objects of the rehabilitation work were old storage sites built for radioactive wastes on the territory of the Institute when military and civilian nuclear technologies were under development. The structural features of the storage sites, including the volumes and characteristics of the wastes stored, are presented. The salient aspects of the disposal sites, taken into account during the rehabilitation work, are discussed. The organization of the rehabilitation operations and the sequence in which they are performed, the special features of the technical design solutions used, the technological methods, and ways for conducting the work are described. __________ Translated from Atomnaya énergiya, Vol. 102, No. 5, pp. 300–306, May, 2007.     

Molecular weight effect on the obtainment of parallel and perpendicular orientation in thermotropic poly(diethylene glycol <Emphasis Type="Italic">p,p′</Emphasis>-bibenzoate)

Summary The effect of molecular weight on the uniaxial orientation process has been analyzed in two samples of thermotropic poly(diethylene glycol p,p′-bibenzoate), evaluating the influence of that parameter on the type of orientation obtained. Several strain rates and deformation temperatures have been tested in order to map out the conditions for obtaining the two different kinds of orientation. The results show that in the lower molecular weight PDEB sample (M_w=31200) it is rather easy to get exclusively perpendicular “anomalous” orientation, with the molecular axes aligned transversely to the stretching direction. However, it is extremely difficult to obtain 100% parallel “normal” orientation. On the contrary, either type of orientation or a mixture of them can be easily developed for the higher molecular weight PDEB sample (M_w=102900).     

Grouped Approach for the Design of H.264/AVC Motion Estimation Architectures

This letter presents a novel approach for organizing computational resources into groups within H.264/AVC motion estimation architectures, leading to reductions of up to 75% in the equivalent gate count with respect to state‐of‐the‐art designs.     

Development of Stretch Solder Interconnections for Wafer Level Packaging

A wafer level packaging technique has been developed with an inherent advantage of good solder joint co-planarity suitable for wafer level testing. A suitable weak metallization scheme has also been established for the detachment process. During the fabrication process, the compliancy of the solder joint is enhanced through stretching to achieve a small shape factor. Thermal cycling reliability of these hourglass-shaped, stretch solder interconnections has been found to be considerably better than that of the conventional spherical-shaped solder bumps.