Dependability analysis for characterizing Google cluster reliability

Cloud solutions are emerging as a new suitable way of transforming traditional IT data centers to highly available and reliable computing resources for hosting critical applications and data. However, software and hardware failures are a common problem in cloud datacenters that can lead to harmful damages. In this paper, we analyze the physical server failures in the Google cloud datacenter. We study the Google cluster properties to investigate the relationship among physical servers' failure rate and jobs failure events. The failure rate of Google cluster executed jobs and servers is taken into consideration during a 29‐day period. We present a reliability model for Google cluster physical machines using the continuous time Markov chains according to this observation. We attempt to analyze the obtained model through SHARPE software packages to improve the understanding of failure events in the Google cloud cluster. We also explore the cluster availability based on parameters like steady‐state availability, steady‐state unavailability, mean time to failure, and mean time to repair in the Google cluster.     

Low-Power Symmetrical Rectifier for Passive UHF RFID Transponder

Rectifier design is one of the challenging issues in passive radio-frequency identification (RFID) systems. Differential structures are good candidates as rectifiers to their high conversion efficiencies. In this paper, a novel structure is proposed to produce symmetrical power-supply utilizing differential circuit configuration simulated in 130nm CMOS technology. The proposed rectifier can provide 1.34 V DC power with 382% voltage conversion efficiency, thus demonstrated its higher performance over existing designs.     

CCGA packages for space applications

Commercial-off-the-shelf (COTS) area array packaging technologies in high reliability versions are now being considered for applications, including use in a number of NASA electronic systems being utilized for both the Space Shuttle and Mars Rover missions. Indeed, recently a ceramic package version specifically tailored for high reliability applications was used to provide the processing power required for the Spirit and Opportunity Mars Rovers built by NASA-JPL. Both Rovers successfully completed their 3-months mission requirements and continued exploring the Martian surface for many more moths, providing amazing new information on previous environmental conditions of Mars and strong evidence that water exists on Mars.Understanding process, reliability, and quality assurance (QA) indicators for reliability are important for low risk insertion of these newly available packages in high reliability applications. In a previous investigation, thermal cycle test results for a non-functional daisy-chained peripheral ceramic column grid array (CCGA) and its plastic ball grid array (PBGA) version, both having 560 I/Os, were gathered and are presented here. Test results included environmental data for three different thermal cycle regimes (−55/125 °C, −55/100 °C, and −50/75 °C). Detailed information on these—especially failure type for assemblies with high and low solder volumes—are presented. The thermal cycle test procedure followed those recommended by IPC-9701 for tin–lead solder joint assemblies. Its revision A covers guideline thermal cycle requirements for Pb-free solder joints. Key points on this specification are also discussed.In a recent investigation a fully populated CCGA with 717 I/Os was considered for assembly reliability evaluation. The functional package is a field-programmable gate array that has much higher processing power than its previous version. This new package is smaller in dimension, has no interposer, and has a thinner column wrapped with copper for reliability improvement. This paper will also present thermal cycle test results for assemblies of this and its plastic package version with 728 I/Os, both of which were exposed to four different cycle regimes. Two of these cycle profiles are specified by IPC-9701A for tin–lead, namely, −55 to 100 °C and −55 to 125 °C. One is a cycle profile specified by Mil-Std-883, namely, −65/150 °C, generally used for ceramic hybrid packages screening and qualification. The last cycle is in the range of −120 to 85 °C, a representative of electronic systems directly exposed to the Martian environment without use in a thermal control enclosure. Per IPC-9701A, test vehicles were built using daisy chain packages and were continuously monitored and/or manually checked for opens at intervals. The effects of many process and assembly variables—including corner staking commonly used for improving resistance to mechanical loading such as drop and vibration loads—were also considered as part of the test matrix. Optical photomicrographs were taken at various thermal cycle intervals to document damage progress and behavior. Representative samples of these are presented along with cross-sectional photomicrographs at higher magnification taken by scanning electron microscopy (SEM) to determine crack propagation and failure analyses for packages.     

An Intra-domain Mobility Handling Scheme Across All-IP Wireless Networks

The rapid growth of wireless network technology such as HSDPA and WiMAX, has lead to greater demand for access to Internet via mobile hosts. Supporting mobile connection with fast and smooth roaming across heterogeneous wireless technologies has been an important challenge over past years. In this paper, a novel multilayer scheme for QoS-aware intra-domain mobility management is proposed. The mobility support capability is embedded in key components for the domain access network, namely, the Paging Access Routers and the Mobility-support Anchor Servers (MASs). The MASs are organized in three layers; starting from the top layer Superior-MASs, Middle-MASs and Inferior-MASs, respectively. The proposed scheme identified mobility support functionality, includes intra-domain anchor specification, route optimization algorithm, intra/inter-anchor mobility support, paging and authentication management. Simulation results of the proposed scheme show fair performance especially in the presence of QoS sensitive services.     

Deposition and characterization of molybdenum thin films using dc-plasma magnetron sputtering

Molebdenum (Mo) thin films were deposited on well-cleaned soda-lime glass substrates using DC-plasma magnetron sputtering. In the design of experiment deposition was optimized for maximum beneficial characteristics by monitoring effect of process variables such as deposition power (100–200 W). Their electrical, structural and morphological properties were analyzed to study the effect of these variables. The electrical resistivity of Mo thin films could be reduced by increasing deposition power. Within the range of analyzed deposition power, Mo thin films showed a mono crystalline nature and the crystallites were found to have an orientation along [110] direction. The surface morphology of thin films showed that a highly dense micro structure has been obtained. The surface roughness of films increased with deposition power. The adhesion of Mo thin films could be improved by increasing the deposition power. Atomic force microscopy was used for the topographical study of the films and to determine the roughness of the films. X-ray diffractrometer and scanning electron microscopy analysis were used to investigate the crystallinity and surface morphology of the films. Hall effect measurement system was used to find resistivity, carrier mobility and carrier density of deposited films. The adhesion test was performed using scotch hatch tape adhesion test. Mo thin films prepared at deposition power of 200 W, substrate temperature of 23°C and Ar pressure of 0.0123 mbar exhibited a mono crystalline structure with an orientation along (110) direction, thickness of ～550 nm and electrical resistivity value of 0.57 × 10^?4 Ω cm.     

Achieving Outstanding Mechanical Performance in Reinforced Elastomeric Composite Fibers Using Large Sheets of Graphene Oxide

A simple fiber spinning method used to fabricate elastomeric composite fibers with outstanding mechanical performance is demonstrated. By taking advantage of the large size of as‐prepared graphene oxide sheets (in the order of tens of micrometers) and their liquid crystalline behavior, elastomeric composite fibers with outstanding low strain properties have been fabricated without compromising their high strain properties. For example, the modulus and yield stress of the parent elastomer improved by 80‐ and 40‐fold, respectively, while maintaining the high extensibility of ～400% strain inherent to the parent elastomer. This outstanding mechanical performance was shown to be dependent upon the GO sheet size. Insights into how both the GO sheet size dimension and dispersion parameters influence the mechanical behavior at various applied strains are discussed.     

In Situ Liquid-Cell TEM Observation of Multiphase Classical and Nonclassical Nucleation of Calcium Oxalate

Calcium oxalate (CaOx) is the major phase in kidney stones and the primary calcium storage medium in plants. CaOx can form crystals with different lattice types, water contents, and crystal structures. However, the conditions and mechanisms leading to nucleation of particular CaOx crystals are unclear. Here, liquid-cell transmission electron microscopy and atomistic molecular dynamics simulations are used to study in situ CaOx nucleation at different conditions. The observations reveal that rhombohedral CaOx monohydrate (COM) can nucleate via a classical pathway, while square COM can nucleate via a non-classical multiphase pathway. Citrate, a kidney stone inhibitor, increases the solubility of calcium by forming calcium-citrate complexes and blocks oxalate ions from approaching calcium. The presence of multiple hydrated ionic species draws additional water molecules into nucleating CaOx dihydrate crystals. These findings reveal that by controlling the nucleation pathways one can determine the macroscale crystal structure, hydration state, and morphology of CaOx.     

Differential current conveyor based current comparator

A New differential current conveyor based current comparator is presented in this paper. Differential current conveyor II (DCCII) is designed, modified, and exploited as a comparator with reduced propagation delay and power consumption. New DCCII decreases propagation delay and increases comparator accuracy considerably. Simulation results using Hspice and 0.18 μm CMOS technology with 1.8V supply voltage confirms a less than 0.63 ns propagation delay at ±1 μA input current. Average power dissipation in ±1 μA input current has a value of 300 μW.