The theory of bandpass sampling

The sampling of bandpass signals is discussed with respect to band position, noise considerations, and parameter sensitivity. For first-order sampling, the acceptable and unacceptable sample rates are presented, with specific discussion of the practical rates which are nonminimum. It is shown that the minimum sampling rate is pathological in that any imperfection in the implementation will cause aliasing. In applying bandpass sampling to relocate signals to a base-band position, the signal-to-noise ratio is not preserved owing to the out-of-band noise being aliased. The degradation in signal-to-noise ratio is quantified in terms of the position of the bandpass signal. For the construction of a bandpass signal from second-order samples, the cost of implementing the interpolant (dynamic range and length) depends on Kohlenberg's sampling factor (1953) k, the relative delay between the uniform sampling streams. An elaboration on the disallowed discrete values of k shows that some allowed values are better than others for implementation     

用于配线网的24芯光纤带的分析

４３２芯中心管式光缆设计采用标准的２４芯光纤带,提高了光纤的分布密度。该新光纤带可方便地在端部或中部撕裂为２个１２芯子光纤带,而这１２芯的子光纤带又完全能与现有标准光纤带熔接机相配。使用能持续干净地将２４芯光纤带分解为１２芯光纤带的新工具,不会使１２芯子光纤带散开。     

Two-channel enhancement of a multifunction control system

The enhancement of an existing myoelectric control system has been investigated. The original one-channel system used an artificial neural network to classify myoelectric patterns. This research shows that a two-channel control system can improve the classification accuracy of the pattern classifier significantly, thus improving the reliability of the prosthesis     

固态源输运系统推动铪基栅介质的应用

在生产中引入高介电常数绝缘材料/金属栅电极结构,需要采用全新的制造技术,前驱物和输运系统推动了铪基材料栅极绝缘层的应用。AID技术也促进了新一代栅电极材料的推广和应用。     

Evaluation of Thermal Resistance Matrix Method for an Embedded Power Electronic Module

Thermal characterization provides data on the thermal performance of electronic components under given cooling conditions. The most common thermal characterization parameter used to characterize the behavior of electronic components is the thermal resistance. In this work, experiments are conducted to obtain thermal characterization data for different chips in a multichip package. Using this data, it is shown that the assumption of a linear temperature rise with input power is valid within the expected range of operation of the electronic module. Secondly, the applicability of a resistance matrix superposition methodology to the packaging structure of an integrated power electronic module is evaluated. The temperatures and the associated uncertainties involved in using the resistance matrix superposition method are compared to those obtained directly by powering all chips. It is shown that for any arbitrary power losses from the chips, the resistance matrix superposition method can predict the temperatures of a multichip package with reasonable accuracy for temperature rise up to 50degC.     

Antenna pattern comparison between an outdoor cylindrical near-field test facility and an indoor spherical near-field antenna test facility

A new spherical near-field probe-positioning device has been designed and constructed, consisting of a large 5.0 meter fixed arc. This arc has been installed in a near-field test facility, located at Alenia Marconi Systems, on the Isle of Wight, UK. As part of the near-field qualification, testing was performed on a ground-based radar antenna. The resultant patterns were compared against measurements collected on the same antenna on a large outdoor cylindrical near-field test facility, also located on the Isle of Wight [F. Steiner et al., Jan. 1994]. These measurements included multiple-frequency measurements and multiple pattern comparisons. This paper summarizes the results obtained as part of the measurement program, and includes discussions on the error budgets for the two ranges, along with a discussion of the mutual error budget between the two ranges.     

Modelling methodology for thermal analysis of hot solder dip process

The shift of electronics industry towards the use of lead-free solders in components manufacturing brought also the challenge of addressing the problem of tin whiskers. Manufacturers of high reliability and safety critical equipment in sectors such as defence and aerospace rely increasingly on the use of commercial-of-the-shelf (COTS) electronic components for their products and systems. The use of COTS components with lead-free solder plated terminations comes with the risks for their long term reliability associated with tin whisker growth related failures. In the case of leaded type electronic components such as Quad Flat Package (QFP) and Small Outline Package (SOP), one of the promising solutions to this problem is to “re-finish” the package terminations by replacing the lead-free solder coatings on the leads with conventional tin–lead solder. This involves subjecting the electronic components to a post-manufacturing process known as Hot Solder Dip (HSD). One of the main concerns for adopting HSD (refinishing) as a strategy to the tin whisker problem is the potential risk for thermally induced damage in the components when subjected to this process.     

An X-ray Radiography Study of the Effect of Thermal Cycling on Damage Evolution in Large-Area Sn-3.5Ag Solder Joints

There is a need for next-generation, high-performance power electronic packages and systems utilizing wide-band-gap devices to operate at high temperatures in automotive and electricity transmission applications. Sn-3.5Ag solder is a candidate for use in such packages with potential maximum operating temperatures of about 200°C. However, there is a need to understand the thermal cycling reliability of Sn-3.5Ag solders subject to such high-temperature operating conditions. The results of a study on the damage evolution occurring in large-area Sn-3.5Ag solder joints between silicon dies and direct bonded copper substrates with Au/Ni-P metallization subject to thermal cycling between 200°C and 5°C are presented in this paper. Interface structure evolution and damage accumulation were followed using high-resolution X-ray radiography, cross-sectional optical and scanning electron microscopies, and X-ray microanalysis in these joints for up to 3000 thermal cycles. Optical and scanning electron microscopy results showed that the stresses introduced by the thermal cycling result in cracking and delamination at the copper–intermetallic compound interface. X-ray microanalysis showed that stresses due to thermal cycling resulted in physical cracking and breakdown of the Ni-P barrier layer, facilitating Cu-Sn interdiffusion. This interdiffusion resulted in the formation of Cu-Sn intermetallic compounds underneath the Ni-P layer, subsequently leading to delamination between the Ni-rich layer and Cu-Sn intermetallic compounds.     

Gradient Adaptive Paraunitary Filter Banks for Spatio-Temporal Subspace Analysis and Multichannel Blind Deconvolution

Paraunitary filter banks are important for several signal processing tasks, including coding, multichannel deconvolution and equalization, adaptive beamforming, and subspace processing. In this paper, we consider the task of adapting the impulse response of a multichannel paraunitary filter bank via gradient ascent or descent on a chosen cost function. Our methods are spatio-temporal generalizations of gradient techniques on the Grassmann and Stiefel manifolds, and we prove that they inherently maintain the paraunitariness of the multichannel adaptive system over time. We then discuss the necessary practical approximations, modifications, and simplifications of the methods for solving two relevant signal processing tasks: (i) spatio-temporal subspace analysis and (ii) multichannel blind deconvolution. Simulations indicate that our methods can provide simple, useful solutions to these important problems.