The nuclear actin-related protein Act3p/Arp4p is involved in the dynamics of chromatin-modulating complexes

Chromatin remodelling and histone-modifying complexes govern the modulation of chromatin structure. While components of these complexes are diverse, nuclear actin-related proteins (Arps) have been repeatedly found in these complexes from yeast to mammals. In most cases, Arps are required for functioning of the complexes, but the molecular mechanisms of nuclear Arps have as yet been largely unknown. The Arps and actin, sharing a common ancestor, are supposed to be highly similar in the three-dimensional structure of their core regions, including the ATP-binding pocket. The Arp Act3p/Arp4p of Saccharomyces cerevisiae exists within the nucleus, partly as a component of several high molecular mass complexes, including the NuA4 histone acetyltransferase (HAT) complex, and partly as uncomplexed molecules. We observed that mutations in the putative ATP-binding pocket of Act3p/Arp4p increased its concentration in the high molecular mass complexes and, conversely, that an excess of ATP or ATPgammaS led to the release of wild-type Act3p/Arp4p from the complexes. These results suggest a requirement of ATP binding by Act3p/Arp4p for its dissociation from the complexes. In accordance, a mutation in the putative ATP binding site of Act3p/Arp4p inhibited the conversion of the NuA4 complex into the smaller piccoloNuA4, which does not contain Act3p/Arp4p and exhibits HAT activity distinct from that of NuA4. Although the in vitro binding activity of ATP by recombinant Act3p/Arp4p was found to be rather weak, our observations, taken together, suggest that the ATP-binding pocket of Act3p/Arp4p is involved in the function of chromatin modulating complexes by regulating their dynamics.     

Filling behavior of UV nanoimprint resin observed by using a midair structure mold

The filling behavior of resin during UV nanoimprint lithography (UV-NIL) was observed by using a “midair structure mold” and by changing the imprint pressure. The midair structure molds were fabricated by electron beam lithography (EBL) using hydrogen silsesquioxane (HSQ) as a negative tone resist. After the fabrication of midair structure mold, two types of surface treatment molds, which were with or without release coating, were prepared. Using these molds, the filling behavior of a UV curable resin was investigated at various pressures. The results indicate that a pressure of approximately 1.2 MPa is necessary for complete filling in the case of molds treated with a release agent. This method demonstrates effect of a release coating for UV-NIL.     

Isotopic evidence in tree rings for historical changes in atmospheric sulfur sources

Little is understood about the usefulness of sulfur isotopic ratios (sigma 34S) in tree rings because the sulfur content in rings is generally insufficient for analysis using conventional methods. We present sigma 34S values of the water-soluble and the organically bound sulfur fractions in rings of coniferous trees grown in Japan, analyzed using a large-volume oxygen bomb. Comparing the sigma 34S values of the organically bound fraction in tree rings with past atmospheric sulfur concentrations and with those of their sources, we find clear evidence that the sigma 34S values of the organically bound fraction in the rings are dependent upon the values of the atmospheric sulfur sources. The evidence suggests that the sigma 34S values in tree rings are a useful chronological proxy for evaluating possible causes of past atmospheric sulfur pollution.     

In-process measurement of topography change of grinding wheel by using hydrodynamic pressure

This paper deals with an in-process measurement method for topography change of a grinding wheel, which can apply to wet grinding. A pressure sensor is set beside a grinding wheel with a small gap. When grinding fluid is dragged into the gap, hydrodynamic pressure, which corresponds to the gap length and the topography, can be measured. This method is applied to a cylindrical grinding machine. No electromagnetic properties of a workpiece and a grinding wheel affect measured results. The pressure is decreased with the increase of the gap length when the grinding fluid is supplied in the tangential direction of the grinding wheel. Spectra of the pressure are measured with an FFT analyzer. Higher frequency components are increased with the progress of grinding because of turbulent flow. Loading and dulling of a grinding wheel can be detected by the proposed method as well as its wear.     

An Improved Thin Wire Representation for FDTD Computations

We have shown that finite-difference time-domain (FDTD) electromagnetic computations for a conductor system having a radius smaller than 0.15Deltar or larger than 0.65 Deltar (Deltar is the lateral side length of cells employed), modeled using arbitrary-radius-wire representations proposed so far with a time increment determined from the upper limit of Courant's stability condition, result in numerical instability. A primary factor causing this numerical instability is that the speed of waves propagating in the radial direction from the wire in the immediate vicinity of the wire exceeds the speed of light, and therefore, Courant's condition is not satisfied there. It is further shown that for these cases, the arbitrary-radius-wire representation can be improved by modifying the material parameters for the axial field components closest to the wire as well as those for the radial electric and circulating magnetic field components. The improved wire representation is effective in representing a wire whose radius ranges from 0.0001Deltar to 0.9Deltar.     

Residual stress evaluation in resin-molded IC chips using finite element analysis and piezoresistive gauges

The high residual stress in a resin-molded electronic package sometimes makes the electronic functions unstable. Therefore the residual stress in electronic packages, especially on the top surfaces of semiconductor chips, should be evaluated. The objective of this study is to present a simple method for evaluating residual stress in resin-molded semiconductor chips using a combination of experimental and numerical methods. The actual residual stress of the packaging process was measured by using test chips that included piezoresistive gauges. A linear thermoelastic finite element analysis was then carried out using a three-dimensional model. The finite element analysis was performed under a stress-free temperature determined by the temperature dependence of the residual stress, which was experimentally measured by using the piezoresistive test chips. The measured residual stress using the test chips agreed well with the results of the finite element analysis. It was therefore confirmed that the present evaluation method, combining experimental and numerical methods, is reliable and reasonable.