首页 | 本学科首页   官方微博 | 高级检索  
文章检索
  按 检索   检索词:      
出版年份:   被引次数:   他引次数: 提示:输入*表示无穷大
  收费全文   257112篇
  免费   2934篇
  国内免费   880篇
电工技术   4865篇
综合类   197篇
化学工业   36900篇
金属工艺   9643篇
机械仪表   7656篇
建筑科学   6161篇
矿业工程   886篇
能源动力   7529篇
轻工业   21504篇
水利工程   2243篇
石油天然气   3253篇
武器工业   17篇
无线电   34783篇
一般工业技术   50771篇
冶金工业   49196篇
原子能技术   5098篇
自动化技术   20224篇
  2022年   1618篇
  2021年   2373篇
  2020年   1739篇
  2019年   2071篇
  2018年   3493篇
  2017年   3494篇
  2016年   3553篇
  2015年   2337篇
  2014年   4107篇
  2013年   11757篇
  2012年   6397篇
  2011年   8761篇
  2010年   7060篇
  2009年   8027篇
  2008年   8542篇
  2007年   8406篇
  2006年   7469篇
  2005年   6568篇
  2004年   6333篇
  2003年   6622篇
  2002年   6084篇
  2001年   6544篇
  2000年   6018篇
  1999年   6450篇
  1998年   16645篇
  1997年   11536篇
  1996年   8881篇
  1995年   6671篇
  1994年   5955篇
  1993年   5897篇
  1992年   4168篇
  1991年   4056篇
  1990年   3880篇
  1989年   3678篇
  1988年   3586篇
  1987年   3048篇
  1986年   2970篇
  1985年   3244篇
  1984年   2938篇
  1983年   2856篇
  1982年   2666篇
  1981年   2575篇
  1980年   2489篇
  1979年   2332篇
  1978年   2122篇
  1977年   2631篇
  1976年   3599篇
  1975年   1776篇
  1974年   1745篇
  1973年   1683篇
排序方式: 共有10000条查询结果,搜索用时 0 毫秒
21.
A common computing-core representation of the discrete cosine transform and discrete sine transform is derived and a reduced-complexity algorithm is developed for computation of the proposed computing-core. A parallel architecture based on the principle of distributed arithmetic is designed further for the computation of these transforms using the common-core algorithm. The proposed scheme not only leads to a systolic-like regular and modular hardware for computing these transforms, but also offers significant improvement in area-time efficiency over the existing structures. The structure proposed here is devoid of complicated input/output mapping and does not involve any complex control. Unlike the convolution-based structures, it does not restrict the transform length to be a prime or multiple of prime and can be utilized as a reusable core for cost-effective, memory-efficient, high-throughput implementation of either of these transforms  相似文献   
22.
We propose an optically clocked transistor array optoelectronic integrated circuit (OEIC) for both serial-to-parallel and parallel-to-serial conversion (demux/mux), enabling an interface between high-speed asynchronous burst optical labels and CMOS circuitry for optical label swapping. Dual functionality of the OEIC reduces size, power, and cost of the optical label swapper. The capability for greater than 20-Gb/s conversion operation is demonstrated.  相似文献   
23.
 A cell vertex finite volume method for the solution of steady compressible turbulent flow problems on unstructured hybrid meshes of tetrahedra, prisms, pyramids and hexahedra is described. These hybrid meshes are constructed by firstly discretising the computational domain using tetrahedral elements and then by merging certain tetrahedra. A one equation turbulence model is employed and the solution of the steady flow equations is obtained by explicit relaxation. The solution process is accelerated by the addition of a multigrid method, in which the coarse meshes are generated by agglomeration, and by parallelisation. The approach is shown to be effective for the simulation of a number of 3D flows of current practical interest. Sponsored by The Research Council of Norway, project number 125676/410 Dedicated to the memory of Prof. Mike Crisfield, a respected colleague  相似文献   
24.
The catalytic activities of alumina prepared from an Al alkoxide-amine adduct monomer for the reaction of cyclopentene oxide with piperidine was determined after various pretreatments, including calcination and exposure to moisture. They were compared with the activity of alumina prepared by the conventional hydrolysis method. It was found that the as-prepared sample from the alkoxide-amine monomer preparation was five times more active than a conventional preparation, suggesting that it has a higher density of surface Lewis acid sites. However, its activity was much more severely suppressed by exposure to moisture.  相似文献   
25.
For pt.I see ibid., p.42-55 (2003). The development of a comprehensive decision support system, GMCR II, for the systematic study of real-world interactive decision problems is presented. The companion paper (Part I), discusses how GMCR II elicits, stores, and manages conflict models; here (Part II), the focus is on GMCR IIs analysis and output interpretation subsystems. Specifically, this paper describes the powerful and efficient analysis engine contained in GMCR II, its informative output presentation and interpretation facilities, and a number of follow-up analyses. Furthermore, an illustrative case study is used to demonstrate how GMCR II can be conveniently applied in practice.  相似文献   
26.
K. M. Granstr  m 《Drying Technology》2003,21(7):1197-1214
This paper describes a novel method to measure emission from dryers. The method resolves the known difficulties caused by diffuse emissions, and also solves the problems associated with high moisture content of the drying medium. The basic idea is to use water vapor to determine the exhaust flow, while a dry ice trap is used both to preconcentrate emitted VOCs and to determine the moisture content of the drying medium.  相似文献   
27.
28.
29.
The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported  相似文献   
30.
Routing Correlated Data with Fusion Cost in Wireless Sensor Networks   总被引:1,自引:0,他引:1  
In this paper, we propose a routing algorithm called minimum fusion Steiner tree (MFST) for energy efficient data gathering with aggregation (fusion) in wireless sensor networks. Different from existing schemes, MFST not only optimizes over the data transmission cost, but also incorporates the cost for data fusion, which can be significant for emerging sensor networks with vectorial data and/or security requirements. By employing a randomized algorithm that allows fusion points to be chosen according to the nodes' data amounts, MFST achieves an approximation ratio of 5/4log(k + 1), where k denotes the number of source nodes, to the optimal solution for extremely general system setups, provided that fusion cost and data aggregation are nondecreasing against the total input data. Consequently, in contrast to algorithms that only excel in full or nonaggregation scenarios without considering fusion cost, MFST can thrive in a wide range of applications  相似文献   
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号