Bias-error reduction in nanometer resolution microscopic motion tracking vision systems

Microscopic Motion Tracking Systems utilize sub-pixel algorithms to achieve close to nanometer precision motion measurement. This paper characterizes the bias-error of template matching image registration techniques which are commonly used to achieve this level of sub-pixel accuracy. An accurate functional expression for such bias error is derived, which shows how the error depends on image content. Furthermore, this expression is directly utilized in a bias reduction scheme that is shown to significantly reduce the bias error. The newly derived expressions and reduction schemes for bias are applied to a Microscopic Vision System that measures micro-object motion with close to nanometer resolution.     

Structural dynamic displacement vision system using digital image processing

This study introduces dynamic displacement vision system (DDVS), which is applicable for imaging unapproachable structures using a hand-held digital video camcorder and is more economical than the existing contact and contactless measurement methods of dynamic displacement and deformation. This proposed DDVS method is applied to the Region of Interest (ROI) resizing and coefficient updating at each time step to improve the accuracy of the measurement from the digital image. Thus, after evaluating the algorithms conducted in this study by the static and dynamic verification, the measurement's usability by calculating the dynamic displacement of the masonry specimen, and the two-story steel frame specimen is evaluated under uniaxial seismic loading. The algorithm of the proposed method in this study, despite the relatively low resolution during frozen, slow, and seismic motions, has precision and usability that can replace the existing displacement transducer. Moreover, the method can be effectively applied to even fast behavior for multi-measurement positions like the seismic simulation test using large scale specimen. DDVS, using the consecutive images of the structures with an economic, hand-held digital video camcorder is a more economical displacement sensing concept than the existing contact and contactless measurement methods.     

Electrochemical characterization of alternate conducting carbazole-bisthiophene units

An electrochemical and theoretical character of alternate copolymer of carbazole and bithiophene units was investigated. Polymerization is processed as two steps bielectronic oxidation of molecule. With monoelectronic oxidation is connected stable radical cation with spin located mainly on carbazole. The electrochemical properties of polymer are dependent on thickness of film deposited on electrode. In case of the thin layers one it is observed characteristic redox couple of carbazole oxidation to radical cation. Analysis of polymer behavior and results of spectrochemical measurements indicate on mixed type of electroconductivity.Molecular structures, HOMO-LUMO gaps and nature of highest occupied and lowest unoccupied molecular orbitals were also studied in presented work for oligomers ranging from monomer to octamer. The studies applied density functional theory (DFT).     

Fabrication of Al matrix composite reinforced with submicrometer-sized Al<Subscript>2</Subscript>O<Subscript>3</Subscript> particles formed by combustion reaction between HEMM Al and V<Subscript>2</Subscript>O<Subscript>5</Subscript> composite particles during sintering

To fabricate an Al-V matrix composite reinforced with submicron-sized Al₂O₃ and Al_xV_y (Al₃V, Al₁₀V) phases, high energy mechanical milling (HEMM) and sintering were employed. By increasing the milling time, the size of mechanically milled powder was significantly reduced. In this study, the average powder size of 59 μm for Al, and 178 μm for V₂O₅ decreased with the formation of a new product, Al-Al₂O₃-Al_xV_y, with a size range from 1.3 μm to 2.6 μm formed by the in-situ combustion reaction during sintering of HEM milled Al and V₂O₅ composite powders. The in-situ reaction between Al and V₂O₅ during the HEMM and sintering transformed the Al₂O₃ and Al_xV_y (Al₃V, Al₁₀V) phases. Most of the reduced V reacted with excess the Al to form Al_xV_y (Al₃V, Al₁₀V) with very little V dissolved into Al matrix. By increasing the milling time and weight percentage of V₂O₅, the hardness of the Al-Al₂O₃-Al_xV_y composite sintered at 1173 K increased. The composite fabricated with the HEMM Al-20wt.%V₂O₅ composite powder and sintering at 1173 K for 2 h had the highest hardness.     

The pH effect for rare earth metals Nd, Pr and Y in aqueous solution dissolved Mg, Zn and Al

The pH variations of Mg, Zn and Al solutions to which had been added the rare earth metals Nd, Pr and Y were observed in 3.5 wt.% NaCl with respect to high energy mechanical ball milling effects. Mg was directly dissolved and exhibited a pH value of 10.5. On the other hand, Zn and Al needed to be saturated for a certain amount of time. The addition of rare earth metals played a role in increasing the pH with low reduction potentials. Additionally, mechanical ball milling provided high energy to Mg + x wt.% Zn + 0.5 wt.% Nd mixture by fracturing fragmentation of metals, which led to an increase in the pH when the mixture was immersed in 3.5 wt.% NaCl. The addition of Zn to Mg + 0.5 wt.% Nd caused a higher pH than when Mg + 0.5 wt.% Nd alone was added.     

Tooling device design for vibration-assisted high speed shaping of PMMA

PMMA optical components that are used as one of the most important parts of high precision equipments and machines are increasingly replacing the glass due to the various advantages of PMMA. Especially in Light Guide Panels, the PMMA sheet that is used in Liquid Crystal Displays plays an important role in scattering the incident light and requires very fine machining as the sheet is directly related to the optical characteristics of the panels. The High Speed End milling and High Speed Shaping processes that are widely adopted and applied to the precise machining of Light Incident Plane still have quality problems, such as cracks, breakages, poor waviness, and straightness. This paper presents the tooling device design for machining a Light Incident Plane through vibration-assisted High Speed Shaping for increasing the optical quality by minimizing the above-mentioned problems. The cutting tool and the tool post presented in this paper are designed by the authors to increase the magnitude of the cutting stroke by adopting the resonant frequency without weakening the stiffness and to reduce vibrations during even high speed feeding. The dynamic characteristics of the cutting tool and the tool post are evaluated through simulation and experiment as well. The results reveal very appropriate dynamic characteristics for vibration-assisted High Speed Shaping.     

Stretchable,Transparent Zinc Oxide Thin Film Transistors

Stretchable and transparent thin film transistors (TFTs) with intrisically brittle oxide semiconductors are built using a wavy structural configuration that can provide high flexibility and stretchability. After device fabrication procedures including high temperature annealing, the oxide semiconductor‐based TFT arrays can be transferred directly to plastic or rubber substrates, without an additional device process, using transfer printing methods. This procedure can avoid some of the thermal degradation problems associated with plastic or rubber substrates by separating them from the annealing procedure needed to improve the device performance. These design and fabrication methods offer the possibility of developing a new format of stretchable electronics.     

Photonic Crystal Palette of Binary Block Copolymer Blends for Full Visible Structural Color Encryption

Structural color (SC) arising from a periodically ordered self-assembled block copolymer (BCP) photonic crystal (PC) is useful for reflective-mode sensing displays owing to its capability of stimuli-responsive structure alteration. However, a set of PC inks, each providing a precisely addressable SC in the full visible range, has rarely been demonstrated. Here, a strategy for developing BCP PC inks with tunable structures is presented. This involves solution-blending of two lamellar-forming BCPs with different molecular weights. By controlling the mixing ratio of the two BCPs, a thin 1D BCP PC film is developed with alternating in-plane lamellae whose periodicity varies linearly from ≈46 to ≈91 nm. Subsequent preferential swelling of one-type lamellae with either solvent or non-volatile ionic liquid causes the photonic band gap of the films to red-shift, giving rise to full-visible-range SC correlated with the pristine nanostructures of the blended films in both liquid and solid states. The BCP PC palette of solution-blended binary solutions is conveniently employed in various coating processes, allowing facile development of BCP SC on the targeted surface. Furthermore, full-color SC paintings are realized with their transparent PC inks, facilitating low-power pattern encryption.     

Enabling On-Demand Conformal Zn-Ion Batteries on Non-Developable Surfaces

Conventional power sources encounter difficulties in achieving structural unitization with complex-shaped electronic devices because of their fixed form factors. Here, it is realized that an on-demand conformal Zn-ion battery (ZIB) on non-developable surfaces uses direct ink writing (DIW)-based nonplanar 3D printing. First, ZIB component (manganese oxide-based cathode, Zn powder-based anode, and UV-curable gel composite electrolyte) inks are designed to regulate their colloidal interactions to fulfill the rheological requirements of nonplanar 3D printing, and establish bi-percolating ion/electron conduction pathways, thereby enabling geometrical synchronization with non-developable surfaces, and ensuring reliable electrochemical performance. The ZIB component inks are conformally printed on arbitrary curvilinear substrates to produce embodied ZIBs that can be seamlessly integrated with complicated 3D objects (including human ears). The conformal ZIB exhibits a high fill factor (i.e., areal coverage of cells on underlying substrates, ≈100%) that ensures high volumetric energy density (50.5 mWh cm_cell⁻³), which exceeds those of previously-reported shape-adaptable power sources.