Modeling low-frequency electrode-type resistivity tools in invadedthin beds

The authors formulate and implement a numerical mode-matching (NMM) method to model electrode-type resistivity tools in invaded thin beds. The authors derive the low-frequency approximation of the Maxwell's equations to obtain the partial differential equation for the potential field. The new NMM program is validated by comparing the numerical results with those obtained from other dc programs. It is found that this new program is much faster than the program using the finite-element method (FEM), and hence is useful for routine interpretation of resistivity logs and for inversion     

Tests of assumptions about the joint receipt of gambles in rank- and sign-dependent utility theory.

A rank- and sign-dependent utility theory is based on an operation of joint receipt of 2 independent gambles and 3 assumptions regarding the operation (R. D. Luce, 1992). The authors tested these 3 assumptions (i.e., segregation, duplex decomposition, and the additivity of certainty equivalents over joint receipt) using both judged and choice certainty equivalents (CEs). Median choice CEs provided support for both segregation and duplex decomposition but little support for additivity in gains or in losses, whereas median judged CEs also failed to support segregation. The latter failure appears to result from some Ss misunderstanding the instructions. (PsycINFO Database Record (c) 2010 APA, all rights reserved)     

Controller for digital audio power amplifier with bit stream input

A new controller for a digital audio amplifier with bit stream input is proposed. The proposed controller has excellent features such as wide error correction range and no limitation on the modulation index. The controller is implemented in the half-bridge class-D amplifier and performance is verified through experiments.     

Analysis and design of synchronous permanent-magnet planar motors

The force equation of a synchronous permanent-magnet planar motor (SPMPM) was investigated. The flux density distribution of a two-dimensional (2-D) magnet array for a SPMPM was obtained by solving the equations of the scalar magnetic potential. The expressions of the force and back-EMF constant were derived and examined. Using these expressions, the conditions for normal operation of the SPMPM were found and the optimal design was determined in order to maximize the force of the SPMPM.     

Low-power high-slew-rate CMOS buffer amplifier for flat panel display drivers

A new high-slew-rate CMOS buffer amplifier consuming a very small quiescent current is proposed. This buffer amplifier recursively copies the output driving current and increases the tail current of the input differential pair during slewing. Since the proposed buffer has a possible slew rate higher than 10 V//spl mu/s for a load capacitance of 1 nF almost independently of static currents as low as 1 /spl mu/A, this buffer amplifier is promising for column driver ICs of flat panel displays that require low static power consumption, high current driving capabilities, and small silicon areas.     

The law of mixtures applied to the plastic deformation of two- phase alloys of coarse microstructures

The theory of the mechanical law of mixtures is reviewed and applied to the partition of stress and of strain in two-phase alloys. It is shown that the modified law of mixtures, based on averagein situ stress and strain, is valid for small deformations and is compatible with strengthening theories based on continuum and dislocation mechanics. The plastic deformation behavior of two representative two-phase alloys,i.e., a spheroidized high carbon steel and a duplex stainless steel, was studied by taking into account the mutual interactions between phases. The law of mixtures and dispersion strengthening theory were used to evaluate the strength contribution of each phase.     

Computational Implementation of Asymmetric Integral Imaging by Use of Two Crossed Lenticular Sheets

We propose an asymmetric integral imaging method to adjust the resolution and depth of a three‐dimensional image. Our method is obtained by use of two lenticular sheets with different pitches fabricated under the same F/#. The asymmetric integral imaging is the generalized version of integral imaging, including both conventional integral imaging and one‐dimensional integral imaging. We present experimental results to test and verify the performance of our method computationally.     

Experimental investigation of natural convection from a horizontal ice surface melting in pure water

A study on natural convection from a horizontal ice surface melting in pure water was conducted experimentally for the ambient water temperature from 2▿C to 10°C. Natural convection flow around upward-or downward-facing horizontal ice plate was divided into three regions according to the temperature variation of ambient water. The flow patterns of three regions were no flow, two-dimensional steady laminar flow and unsteady flow. Mean Nusselt number for the upward-facing surface had its maximum value at about 3°C of ambient water temperature. However, in the case of the downward-facing surface it increased as the ambient water temperature increased.     

Numerical analysis of the warpage problem in TSOP

The reliability and the solderability of thin small outline package (TSOP) are significantly affected by the warpage that is generated after epoxy molding compound (EMC) molding process. This warpage problem mainly results from the mismatch of material properties such as Young's modulus, Poisson's ratio and coefficient of thermal expansion (CTE) and the geometric structure of each component for TSOP. The optimization of both material properties and geometric structures using the numerical analysis is necessary to reduce the warpage of TSOP. However, there are still some limitations for the numerical analysis to obtain proper results consistent with the practical warpage values. In this paper, the numerical analysis is performed under the assumption of elastic behavior for EMC. Furthermore, to solve the limitations, the material properties at the molding temperature and the degree of reaction rate at the end of the molding process of EMC are considered together for the analysis. This numerical analysis gives the higher warpage values than the measured ones, and is applicable to the practical design of the reliable electronic package.