全文获取类型
收费全文 | 73995篇 |
免费 | 5640篇 |
国内免费 | 2800篇 |
专业分类
电工技术 | 3924篇 |
技术理论 | 6篇 |
综合类 | 4473篇 |
化学工业 | 12823篇 |
金属工艺 | 3980篇 |
机械仪表 | 4852篇 |
建筑科学 | 5272篇 |
矿业工程 | 2435篇 |
能源动力 | 2255篇 |
轻工业 | 4799篇 |
水利工程 | 1014篇 |
石油天然气 | 5367篇 |
武器工业 | 462篇 |
无线电 | 7703篇 |
一般工业技术 | 9512篇 |
冶金工业 | 3955篇 |
原子能技术 | 759篇 |
自动化技术 | 8844篇 |
出版年
2024年 | 305篇 |
2023年 | 1278篇 |
2022年 | 2141篇 |
2021年 | 2933篇 |
2020年 | 2226篇 |
2019年 | 1981篇 |
2018年 | 2326篇 |
2017年 | 2531篇 |
2016年 | 2101篇 |
2015年 | 2725篇 |
2014年 | 3466篇 |
2013年 | 4252篇 |
2012年 | 4396篇 |
2011年 | 4897篇 |
2010年 | 4224篇 |
2009年 | 3989篇 |
2008年 | 3888篇 |
2007年 | 3758篇 |
2006年 | 3848篇 |
2005年 | 3463篇 |
2004年 | 2308篇 |
2003年 | 2099篇 |
2002年 | 1883篇 |
2001年 | 1645篇 |
2000年 | 1805篇 |
1999年 | 2062篇 |
1998年 | 1774篇 |
1997年 | 1429篇 |
1996年 | 1414篇 |
1995年 | 1192篇 |
1994年 | 961篇 |
1993年 | 720篇 |
1992年 | 548篇 |
1991年 | 428篇 |
1990年 | 329篇 |
1989年 | 255篇 |
1988年 | 226篇 |
1987年 | 142篇 |
1986年 | 120篇 |
1985年 | 96篇 |
1984年 | 66篇 |
1983年 | 40篇 |
1982年 | 42篇 |
1981年 | 30篇 |
1980年 | 25篇 |
1979年 | 13篇 |
1977年 | 7篇 |
1976年 | 8篇 |
1975年 | 5篇 |
1945年 | 4篇 |
排序方式: 共有10000条查询结果,搜索用时 0 毫秒
61.
Chong D. Y. R. Lim B. K. Rebibis K. J. Pan S. J. Sivalingam K. Kapoor R. Sun A. Y. S. Tan H. B. 《Advanced Packaging, IEEE Transactions on》2006,29(4):674-682
The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported 相似文献
62.
Feng-Wen Sun Yimin Jiang Baras J.S. 《IEEE transactions on information theory / Professional Technical Group on Information Theory》2003,49(1):180-190
Many issues in signal processing involve the inverses of Toeplitz matrices. One widely used technique is to replace Toeplitz matrices with their associated circulant matrices, based on the well-known fact that Toeplitz matrices asymptotically converge to their associated circulant matrices in the weak sense. This often leads to considerable simplification. However, it is well known that such a weak convergence cannot be strengthened into strong convergence. It is this fact that severely limits the usefulness of the close relation between Toeplitz matrices and circulant matrices. Observing that communication receiver design often needs to seek optimality in regard to a data sequence transmitted within finite duration, we define the finite-term strong convergence regarding two families of matrices. We present a condition under which the inverses of a Toeplitz matrix converges in the strong sense to a circulant matrix for finite-term quadratic forms. This builds a critical link in the application of the convergence theorems for the inverses of Toeplitz matrices since the weak convergence generally finds its usefulness in issues associated with minimum mean squared error and the finite-term strong convergence is useful in issues associated with the maximum-likelihood or maximum a posteriori principles. 相似文献
63.
64.
珠光体球化的分形研究 总被引:7,自引:2,他引:5
珠光体球化反映到金相上,是一种不规则图像的变化,并且具有分形的特征,可望用分形几何的方法来进行描述。以Cr-Mo钢的珠光体球化为例,用分形维数来描述珠光体球化程度;用小岛法对15CrMo钢的珠光体球化图谱进行了测量。实验表明,珠光体球化从1级到6级,其相应的分形维数范围为1.3156-1.9282。从电厂运行了10^5h的15CrMo钢管上取样,实测了该试样的珠光体球化等级,结果表明,以分形维数表示的球化程度与按图谱评定的球化等级完全吻合。 相似文献
65.
对海底输油管道内智能引导装置研究的必要性进行了分析;介绍了国内外在该领域的技术发展状况。针对智能引导装置的作业对象和环境,提出了技术要求和指标,对智能引导装置进行了总体设计,分析了其作业机理,建立了力学模型并进行了计算。对智能引导装置的控制系统进行了设计,提出了设计过程中应注意的问题。所研制的管内轮式智能引导装置具有质量轻、输出牵引力大、体积小、结构紧凑等特点,对较小管内空间类似系统的设计有一定参考价值。 相似文献
66.
67.
本文介绍了薄膜隧道发光结的基本结构、发光机理,阐述了其I-V特性中的负阻现象。简单介绍了MIM结构负阻的几种解释,根据热像仪照片和低温测试结果分析,再结合Dearmaley导电模型,我们提出了MIM负阻的物理模型,理论与实验符合较好,最后分析了负阻现象的应用前景。 相似文献
68.
Laparoscopic retroperitoneal lymph node dissection is a new surgical procedure used to enhance staging in men with clinical stage I nonseminomatous germ cell tumors of the testis. The procedure has been performed in a limited number of patients at several centers with extensive laparoscopic experience. Laparoscopic retroperitoneal lymphadenectomy is a technically demanding procedure which can be successfully completed in the majority of patients. However, the risk of complications is greater than in patients who undergo standard open retroperitoneal lymph node dissection. The primary advantage of a laparoscopic approach is shortened hospitalization and rapid return to normal activity. The role of laparoscopy in the management of patients with testis malignancy has not been defined. The use of this staging procedure may help minimize the need for surveillance studies following surgery and may be best utilized in men with a lower likelihood of nodal metastases. Ultimately, prospective study in large groups of patients will be necessary to determine the role of laparoscopic retroperitoneal lymph node dissection in patients with testis cancer. 相似文献
69.
本文提出一个同温冶炼过程中预测非金属夹杂物沉淀的计算机程序。本研究中,多元硅酸盐溶体的Gibbs自由能由基于统计热力学的晶胞模型来计算,该晶胞模型按照氧与周围的阳离子构成的对称和非对称晶胞来描述硅酸盐熔体结构,假定高温冶炼时认与非金属夹杂物平衡,钢液中氧化物元素的活度由Wagner交互作用系数来计算,利用本程序可以估计炼钢时沉淀的非金属氧化物的成分,为调整冶炼工艺和提高产品质量提供指导,进一步可计 相似文献
70.
以网格曲线为连续条件的光滑曲面 总被引:3,自引:1,他引:2
本文提出一种以网格边界曲线定义曲面的方法。曲面的计算式唯一地由网格的四条边界线的参数而定,各网格间连接的光滑度完全由网格间的边界线的光滑度来决定。当网格间的边界线具有C~1连续以上的光滑度时,网络曲面间将自动保证是C~1连续的,否则将是C~0连续。利用这个方法,可以方便地从线框模型(wire-framemodel)建立面模型(surfacemodel)。 相似文献