Characterization of Fluxing and Hybrid Underfills with Micro‐encapsulated Catalyst for Long Pot Life

For the fine‐pitch application of flip‐chip bonding with semiconductor packaging, fluxing and hybrid underfills were developed. A micro‐encapsulated catalyst was adopted to control the chemical reaction at room and processing temperatures. From the experiments with a differential scanning calorimetry and viscometer, the chemical reaction and viscosity changes were quantitatively characterized, and the optimum type and amount of micro‐encapsulated catalyst were determined to obtain the best pot life from a commercial viewpoint. It is expected that fluxing and hybrid underfills will be applied to fine‐pitch flip‐chip bonding processes and be highly reliable.     

A distributed fixed-step power control algorithm with quantizationand active link quality protection

A distributed fixed-step power control algorithm is presented. It is a simple feedback adjustment algorithm using only local information. In the ideal case where there is no power constraint, it is guaranteed that existing users will not be dropped due to admission of new users. If it is infeasible to accommodate all of them, the new user will be blocked. When the constraint on the maximum power is imposed, it is shown by simulation that blocking a new call is more probable than dropping any existing calls, if the capacity is exceeded. Besides, its convergence property is demonstrated. The convergence rate, which depends on the step size, is studied through simulation. In addition, the issue of power quantization is addressed     

An InGaAs-InP HBT differential transimpedance amplifier with 47-GHz bandwidth

Return-to-zero differential phase-shift keying applications require a differential amplifier with high bandwidth, high gain, low noise, and good input impedance match. In this paper, we describe an InGaAs-InP heterostructure bipolar transistor differential transimpedance amplifier with high bandwidth of 47 GHz and high gain of 56 dB-/spl Omega/. The input-referred current noise is less than 35 pA//spl radic/Hz over the measurement range up to 40 GHz.     

Highly Reliable Charge Trap-Type Organic Non-Volatile Memory Device Using Advanced Band-Engineered Organic-Inorganic Hybrid Dielectric Stacks

With the recent interest in data storage in flexible electronics, highly reliable charge trap-type organic-based non-volatile memory (CT-ONVM) has attracted much attention. CT-ONVM should have a wide memory window, good endurance, and long-term retention characteristics, as well as mechanical flexibility. This paper proposed CT-ONVM devices consisting of band-engineered organic–inorganic hybrid films synthesized via an initiated chemical vapor deposition process. The synthesized poly(1,3,5-trimethyl-1,3,5,-trivinyl cyclotrisiloxane) and Al hybrid films are used as a tunneling dielectric layer and a blocking dielectric layer, respectively. For the charge trapping layer, different Hf, Zr, and Ti hybrids are examined, and their memory performances are systematically compared. The best combination of hybrid dielectric stacks showed a wide memory window of 6.77 V, good endurance of up to 10⁴ cycles, and charge retention of up to 71% after 10⁸ s even under the 2% strained condition. The CT-ONVM device using the hybrid dielectric stacks outperforms other organic-based charge trap memory devices and is even comparable in performance to conventional inorganic-based poly-silicon/oxide/nitride/oxide/silicon structures devices. The CT-ONVM using hybrid dielectrics can overcome the inherent low reliability and process complexity limitations of organic electronics and expedite the realization of wearable organic electronics.     

3D Printed Stem‐Cell Derived Neural Progenitors Generate Spinal Cord Scaffolds

A bioengineered spinal cord is fabricated via extrusion‐based multimaterial 3D bioprinting, in which clusters of induced pluripotent stem cell (iPSC)‐derived spinal neuronal progenitor cells (sNPCs) and oligodendrocyte progenitor cells (OPCs) are placed in precise positions within 3D printed biocompatible scaffolds during assembly. The location of a cluster of cells, of a single type or multiple types, is controlled using a point‐dispensing printing method with a 200 µm center‐to‐center spacing within 150 µm wide channels. The bioprinted sNPCs differentiate and extend axons throughout microscale scaffold channels, and the activity of these neuronal networks is confirmed by physiological spontaneous calcium flux studies. Successful bioprinting of OPCs in combination with sNPCs demonstrates a multicellular neural tissue engineering approach, where the ability to direct the patterning and combination of transplanted neuronal and glial cells can be beneficial in rebuilding functional axonal connections across areas of central nervous system (CNS) tissue damage. This platform can be used to prepare novel biomimetic, hydrogel‐based scaffolds modeling complex CNS tissue architecture in vitro and harnessed to develop new clinical approaches to treat neurological diseases, including spinal cord injury.     

Highly Efficient Video Codec for Entertainment‐Quality

We present a novel video codec for supporting entertainment‐quality video. It has new coding tools such as an intra prediction with offset, integer sine transform, and enhanced block‐based adaptive loop filter. These tools are used adaptively in the processing of intra prediction, transform, and loop filtering. In our experiments, the proposed codec achieved an average reduction of 13.35% in BD‐rate relative to H.264/AVC for 720p sequences.     

Mobile Learning

Works in progress from selected papers presented at the 2006 IADIS International Conference on Mobile Learning provide an overview of the diverse research being conducted in this field.     

Chip to Chip Bonding Using Cu Bumps Capped with Thin Sn Layers and the Effect of Microstructure on the Shear Strength of Joints

Chip to chip bonding techniques using Cu bumps capped with thin solder layers have been frequently applied to 3D chip stacking technology. We studied the effect of joint microstructure on shear strength. Joints were formed by joining Sn/Cu bumps on a Si die and Sn/Cu layers on another Si die at 245–330°C using a thermo-compression bonder. Three different types of microstructures were fabricated in the joints by controlling the bonding temperature and time, (1) a Sn-rich phase with a Cu₆Sn₅ phase at the Cu interfaces, (2) a Cu₆Sn₅ phase in the interior with a Cu₃Sn phase at the Cu interfaces, and (3) one single Cu₃Sn phase throughout the whole joint. The joint having a single Cu₃Sn phase had the highest shear strength. Specimens were aged up to 2000 h at 150°C and 180°C. During aging, the microstructures of all joints were transformed in a single Cu₃Sn phase. The shear strength of the joints was very sensitive to the formation of Cu₃Sn and microvoids. Microvoids formed in the solder joints with a Cu₆Sn₅ phase with and without a Sn-rich phase during aging and decreased the shear strength of the joints. Conversely, aging did not induce the formation of microvoids in the joints which originally had only a Cu₃Sn phase and the shear strength was not decreased.     

Near‐Optimum Blind Decision Feedback Equalization for ATSC Digital Television Receivers

This paper presents a near‐optimum blind decision feedback equalizer (DFE) for the receivers of Advanced Television Systems Committee (ATSC) digital television. By adopting a modified trellis decoder (MTD) with a trace‐ back depth of 1 for the decision device in the DFE, we obtain a hardware‐efficient, blind DFE approaching the performance of an optimum DFE which has no error propagation. In the MTD, the absolute distance is used rather than the squared Euclidean distance for the computation of the branch metrics. This results in a reduction of the computational complexity over the original trellis decoding scheme. Compared to the conventional slicer, the MTD shows an outstanding performance improvement in decision error probability and is comparable to the original trellis decoder using the Euclidean distance. Reducing error propagation by use of the MTD in the DFE leads to the improvement of convergence performance in terms of convergence speed and residual error. Simulation results show that the proposed blind DFE performs much better than the blind DFE with the slicer, and the difference is prominent at the trellis decoder following the blind DFE.     

Simple and Accurate Design of Low-Density Parity-Check Codes for Multi-Input Multi-Output Systems

In this paper we design an irregular low-density parity-check (LDPC) code for multiple-input multiple-output (MIMO) systems, using a simple extrinsic information transfer (EXIT) chart method. The MIMO systems considered are the optimal maximum a posteriori probability (MAP) detector and the suboptimal minimum mean square error soft-interference cancellation (MMSE-SIC) detector. The MIMO detector and the LDPC decoder exchange soft information and form a turbo iterative receiver. The EXIT charts are used to obtain the edge degree distribution of the irregular LDPC code which is optimized for the MIMO detector. It is shown that the performance of the designed LDPC code is better than that of conventional LDPC code which was optimized for either the Additive White Gaussian Noise (AWGN) channel or the MIMO channel without an explicit consideration of the given detector structure.