Reaction of Iradium with Metal Carbides in the Temperature Range of 1923 to 2400 K

The reactions of titanium carbide and hafnium carbide with iridium have been studied in thin film couples fabricated by vapor deposition processes. The reaction product layers after exposure in the temperature range of 1923 to 2400 K are dependent on the stoichiometry of the metal carbide layers and range from simple solid solutions to MIr_x compounds. The observed microstructures are predictable from available thermochemical data. The morphology of residual carbon in the reacted metal carbide-iridium product layer varies from interfacial deposits to uniform carbon dispersion and depends upon exposure temperature and metal carbide stoichiometry.     

Redundancy Removal during High-Level Synthesis Using Scheduling Don‘t-Cares

Previous work in automata theory has shown how to eliminate sequential redundancy from networks of FSMs by finding sequences of inputs and outputs which are never communicated between components of the network. This paper shows that behavior automata—finite-state machines whose inputs and outputs are incompletely scheduled—exhibit similar properties. Using the behavior FSM (BFSM) as a model for scheduling, we show how to identify and eliminate both input and output scheduling dont-cares. When a scheduling dont-care is eliminated from a network of BFSMs, the register-transfer implementation is guaranteed not to suffer from the corresponding dont-care sequence. A definition of scheduling dont-cares improves our understanding of the foundations of high-level synthesis and the relationship between high-level and sequential optimization. In practice, scheduling dont-care elimination is a powerful tool for eliminating redundancy early in the design process.     

Far-infrared microbolometer detectors

The bismuth microbolometer is a simple, easily made detector suitable for use throughout the far-infrared, which has been integrated with a variety of planar antennas. The general thermal properties of these devices and some of the constraints on bolometer materials are discussed. The fabrication and performance of several different types of microbolometers and microthermocouples are described.     

Microstructure and Electrical Properties of Low Temperature Processed Ohmic Contacts to p‐Type GaN

With Ni/Au and Pd/Au metal schemes and low temperature processing, we formed low resistance stable Ohmic contacts to p‐type GaN. Our investigation was preceded by conventional cleaning, followed by treatment in boiling HNO₃:HCl (1:3). Metallization was by thermally evaporating 30 nm Ni/15 nm Au or 25 nm Pd/15 nm Au. After heat treatment in O₂ + N₂ at various temperatures, the contacts were subsequently cooled in liquid nitrogen. Cryogenic cooling following heat treatment at 600 ·C decreased the specific contact resistance from 9.84·10^?4 Ωcm² to 2.65·10^?4 Ωcm² for the Ni/Au contacts, while this increased it from 1.80·10^?4 Ωcm² to 3.34·10^?4 Ωcm² for the Pd/Au contacts. The Ni/Au contacts showed slightly higher specific contact resistance than the Pd/Au contacts, although they were more stable than the Pd contacts. X‐ray photoelectron spectroscopy depth profiling showed the Ni contacts to be NiO followed by Au at the interface for the Ni/Au contacts, whereas the Pd/Au contacts exhibited a Pd:Au solid solution. The contacts quenched in liquid nitrogen following sintering were much more uniform under atomic force microscopy examination and gave a 3 times lower contact resistance with the Ni/Au design. Current‐voltage‐temperature analysis revealed that conduction was predominantly by thermionic field emission.     

Demonstration of an Analog IC Function Maintenance Strategy, Including Direct Calibration, Built-in Self-test, and Commutation of Redundant Functional Blocks

A new analog subsystem maintenance strategy is presented that can be used to improve the accuracy, reliability, yield, and testability of analog and mixed-signal ICs. This scheme is a generally applicable design approach that combines hybrid redundancy, direct subcircuit parameter adjustment (calibration), and on-chip analog function verification (built-in self-test). Improvements are realized in a system-transparent fashion through careful function block commutation. The cost is a moderate die area increase. This design strategy is applicable to a wide range of moderately complex analog functions. An example analog function is used here to illustrate this new maintenance approach. Experimental data demonstrate the capabilities of this new approach to analog IC design fortestability.     

A VLSI design methodology for distributed arithmetic

Real-time signal processing requires fast computation of inner products. Distributed arithmetic is a method of inner product computation that uses table-lookup and addition in place of multiplication. Distributed arithmetic has previously been shown to produce novel and seemingly efficient architectures for a variety of signal processing computations; however the methods of design, analysis and comparison have been ad hoc. We propose a systematic method for synthesizing optimal VLSI architectures using distributed arithmetic.A partition of the inner product computation at the word and bit level produces a computation consisting of lookups and additions. We study two classes of algorithms to implement this computation, regular iterative algorithms and tree algorithms, each of which can be expressed in the form of a dependency graph. We use linear and nonlinear maps to assign computations to processors in space and time. Expressions are developed for the area, latency, period and arithmetic error for a particular partition and space/time map of the dependecy graph. We use these expressions to formulate a constrained optimization problem over a large class of architectures. We compare distributed arithmetic with more conventional methods for inner product computation and show how area, latency and period may be traded off while maintaining constant error.This work was supported by Ball Aerospace, Boulder, CO and by the Office of Naval Research, Electronics Branch, Arlington, VA under contract ONR 89-J-1070.     

Availability Analysis and Enhanced Availability Design in <Emphasis Type="Italic">p</Emphasis>-Cycle-Based Networks

p-Cycle protection is a fairly new survivability scheme that has the interesting properties of offering restoration speeds essentially the same as those offered by ring protection while requiring almost as little redundant capacity as adaptive mesh restoration [D. Stamatelakis, W.D. Grover, IEEE Transactions on Communications, vol. 48, no. 8, (August 2000), pp. 1262–1265]. This paper presents the first analytical consideration of the availability of paths in a network protected by p-cycles. Results confirm the importance that cycle sizes play in terms of availability and suggests principles or strategies for achieving high availability of paths in a network protected by p-cycles. Based on these insights, two new formulations for joint service path provisioning and capacity planning are proposed. The first one offers a way to improve the availability of selected service paths by using a different routing strategy for them than for regular service paths. The second formulation enables a new class of service paths that are offered two protection options instead of just one. That class of service paths is expected to see its availability improved in a quantum step way relative to the availability of paths having only one protection option.     

High-yield flip-chip bonding and packaging of low-threshold VCSEL arrays on sapphire substrates

Oxide-confined top-emitting 850 nm and bottom-emitting 980 nm vertical-cavity surface-emitting laser (VCSEL) 8/spl times/8 arrays were designed and fabricated for applications of optical interconnects. The arrays were flip-chip bonded onto sapphire substrates that contain complimentary metal-oxide-semiconductor (CMOS) driver and fan-out circuitries. The off-sited bonding contacts and minimized bonding force produced very high yield of the hybridization process without causing damage to the VCSEL mesas. The hybridized devices were further mounted either on printed circuit board (PCB) or in 68-pin pin-grid-array (PGA) packages. The transparent sapphire substrate allowed optical outputs from the top-emitting VCSEL arrays to transmit directly through without additional substrate removal procedure. Lasing thresholds below 250 /spl mu/A for 850 nm VCSELs and 800 /spl mu/A for 980 nm VCSEL were found at room temperature. The oxide confinement apertures of VCSELs were measured to be around 6 /spl mu/m in diameter. High-speed data transmission demonstrated a bandwidth of up to 1 Gbits/s per channel for these hybridized VCSEL transmitters.     

Inactivation of Shiga toxin-producing O157:H7 and non-O157:H7 Shiga toxin-producing Escherichia coli in brine-injected, gas-grilled steaks

We quantified translocation of Escherichia coli O157:H7 (ECOH) and non-O157:H7 verocytotoxigenic E. coli (STEC) into beef subprimals after brine injection and subsequently monitored their viability after cooking steaks cut therefrom. Beef subprimals were inoculated on the lean side with ca. 6.0 log CFU/g of a five-strain cocktail of rifampin-resistant ECOH or kanamycin-resistant STEC, and then passed once through an automatic brine-injector tenderizer, with the lean side facing upward. Brine solutions (9.9% ± 0.3% over fresh weight) consisted of 3.3% (wt/vol) of sodium tripolyphosphate and 3.3% (wt/vol) of sodium chloride, prepared both with (Lac(+), pH = 6.76) and without (Lac(-), pH = 8.02) a 25% (vol/vol) solution of a 60% potassium lactate-sodium diacetate syrup. For all samples injected with Lac(-) or Lac(+) brine, levels of ECOH or STEC recovered from the topmost 1 cm (i.e., segment 1) of a core sample obtained from tenderized subprimals ranged from ca. 4.7 to 6.3 log CFU/g; however, it was possible to recover ECOH or STEC from all six segments of all cores tested. Next, brine-injected steaks from tenderized subprimals were cooked on a commercial open-flame gas grill to internal endpoint temperatures of either 37.8 °C (100 °F), 48.8 °C (120 °F), 60 °C (140 °F), or 71.1 °C (160 °F). Regardless of brine formulation or temperature, cooking achieved reductions (expressed as log CFU per gram) of 0.3 to 4.1 of ECOH and 0.5 to 3.6 of STEC. However, fortuitous survivors were recovered even at 71.1 °C (160 °F) for ECOH and for STEC. Thus, ECOH and STEC behaved similarly, relative to translocation and thermal destruction: Tenderization via brine injection transferred both pathogens throughout subprimals and cooking highly contaminated, brine-injected steaks on a commercial gas grill at 71.1 °C (160 °F) did not kill all cells due, primarily, to nonuniform heating (i.e., cold spots) within the meat.     

Turnover, biographical data, and fair employment practice.

Used biographical data to predict the tenure of 160 randomly chosen minority and nonminority female clerical personnel in a medium-sized insurance company. A weighted combination of 10 application blank items yielded cross-validated rs of .58 (minorities) and .56 (nonminorities) on a holdout sample of 100 randomly chosen female clerical personnel hired during the same period. Although personal history items have frequently been used to forecast turnover, recent evidence together with civil rights requirements have questioned the validity and fairness of the method. Results of the present study indicate that even after satisfying the legal requirements for using such information, turnover can still be predicted quite accurately with custom-tailored, cross-validated scoring keys. (19 ref) (PsycINFO Database Record (c) 2010 APA, all rights reserved)