高速钢W6Mo5Cr4V2的脱磷试验

在３０ｋｇ感应炉上用ＣａＯ－Ｎａ２ＣＯ３－ＣａＦ２－ＦｅｘＯ（ＭｏＯ３）渣、ＭｏＣｌ６粉剂和Ａｌ－Ｃａ合金作脱磷剂对高速钢Ｗ６Ｍｏ５Ｃｒ４Ｖ２进行脱磷试验。结果表明，ＣａＯ－Ｎａ２ＣＯ３－ＣａＦ２－ＦｅｘＯ渣的脱磷效果最好，一般脱磷率可达２６％￣５６％。     

Prenatal diagnosis of partial monosomy 13q associated with occipital encephalocoele in a fetus

The pre- and postnatal findings of a fetus with a de novo del(13)(pter-->q21:) and an occipital encephalocoele are described. Maternal serum alpha-fetoprotein (AFP) screening at 19 weeks' gestation demonstrated a high level of 2.5 multiples of the median (MOM) and ultrasonography at 27 weeks' gestation showed severe intrauterine growth retardation, cardiomegaly, an occipital encephalocoele, and a calvarial defect. Genetic amniocentesis revealed a karyotype of 46,XX,del(13)(pter-->q21:). The proband postnatally displayed additional abnormalities such as microphthalmia, hypertelorism, large low-set ears, and micrognathia. We discuss the association of central nervous system (CNS) malformations with 13q deletions and emphasize that pregnancies with neural tube defects warrant cytogenetic analysis, especially when additional fetal abnormalities and neonatal dysmorphism are observed.     

B－ISDN与现有网络互连的研究

本文主要围绕Ｂ－ＩＳＤＮ与现有各种网络（如ＰＳＰＤＮ、ＰＳＴＮ、ＬＡＮ等）的互连问题展开讨论，并针对不同的应用场合提出了相应的互连解决方案。     

基于CF的全集成MOSFET—C六阶低通滤波器的仿真分析

本文提出了以电流跟随器ＣＦ为基本电路元件的全集成ＭＯＳＦＥＴ－Ｃ精确连续时间六阶低通滤波器电路，并应用ＰＳＰＩＣＥ－Ⅱ通用模拟电路程序，对其幅频特性和相频特性进行了计算机仿真分析，得出了实用的结论。     

NUMERICAL SIMULATIONS OF WHOLE FIELD BEHAVIOR FOR ROUND BUOYANT JET

ＮＵＭＥＲＩＣＡＬＳＩＭＵＬＡＴＩＯＮＳＯＦＷＨＯＬＥＦＩＥＬＤＢＥＨＡＶＩＯＲＦＯＲＲＯＵＮＤＢＵＯＹＡＮＴＪＥＴＬｉＷｅｉ，ＨｕａｉＷｅｎ－ｘｉｎ（ＷｕｈａｎＵｎｉｖｅｒｓｉｔｙｏｆＨｙｄｒａｕｌｉｃａｎｄＥｌｅｃｔｒｉｃＥｎｇｉｎｅｅｒｉｎｇ，...     

钢中非金属夹杂物显微评级方法的定量化探讨

应用ＩＢＡＳ系列图像分析系统，对建立一套与国家标准ＧＢ１０５６１─８９兼容的钢中非金属夹杂物显微评级方法的自动化和定量化标准作了可行性分析，结果表明建立这套标准是切实可行的。     

Dynamic lithium-ion battery model for system simulation

Presents here a complete dynamic model of a lithium ion battery that is suitable for virtual-prototyping of portable battery-powered systems. The model accounts for nonlinear equilibrium potentials, rate- and temperature-dependencies, thermal effects and response to transient power demand. The model is based on publicly available data such as the manufacturers' data sheets. The Sony US18650 is used as an example. The model output agrees both with manufacturer's data and with experimental results. The model can be easily modified to fit data from different batteries and can be extended for wide dynamic ranges of different temperatures and current rates.     

Process development and adhesion behavior of electroless copper on liquid crystal polymer (LCP) for electronic packaging application

Liquid crystal polymer (LCP) has potentially a very wide application as substrate material in electronic packaging applications because of its unique advantages. The work in this paper was performed to realize the metallization of LCP for the purpose of board fabrication, and to study the adhesion between deposited copper and LCP. A homogenous electroless plated copper layer on LCP with 4 to 5 /spl mu/m thickness was achieved, while it increased up to 40 /spl mu/m with the subsequent electroplating. The timescale of etching, deposit ion rate, and pH value were gradually changing during the plating process and the influences on copper layer quality were investigated. The adhesion force of the copper-LCP layer system was measured by a shear-off-method. Scanning electron microscopy (SEM) was used to check the surface morphology after etching and the interface after shearing on both the backside of the copper layer and the LCP side. The relationship between the shear-off adhesion of copper and the time of chemical etching before plating was examined, and the optimal etching time is discussed. Heat treatment after plating was used, and it was shown that this significantly improved the adhesion strength.