Kinetics of AuSn4 migration in lead-free solders

The relatively fast diffusion of Au atoms in eutectic PbSn matrix is considered one of the contributing factors to the Au embrittlement problem. In this study, we further investigated the Au embrittlement problem in high-Sn solders. Experimentally, Sn3.5Ag (wt.%) spheres with 500-μm diameter were soldered over the Au/Ni soldering pads. It was found that some of the AuSn₄ needles that formed after reflow inside the solder migrated back to the solder/pad interface during thermal aging. However, the migration kinetics in high-Sn solders was slower compared to that in eutectic PbSn. The difference in migration kinetics of AuSn₄ in eutectic PbSn and SnAg was ascribed to the difference in the magnitudes of the Au flux and the Ni flux. In eutectic PbSn, the Au flux was much greater than that of the Ni flux, and the Au and Ni flux were in the same order of magnitude in eutectic SnAg. The relative magnitude of the Au and Ni flux changed in eutectic PbSn and SnAg because the homologous temperatures of PbSn and SnAg were different.     

Process and design analysis for ultrafine-pitched wiresweep elimination in advanced copper heat spreader BGA package

The semiconductor device trend for increasing functionalities and performances yet with smaller overall feature sizes presents escalating obstacles to the decreasing form factor along with demanding thermal carrying capability required at the package level. To confront this compounding issue, ultrafine-pitch wirebond interconnect coupled with thermally enhanced copper heat spreader attached to the package are introduced. However, the additional copper heat spreader thickness introduced within the package challenges the design of the package's wire, its loop height, and the molding process control to prevent wire sweeping occurrences. This study investigates the impact of different ultrafine pitched wire types, wire loop designs, copper heat spreader structures, and mold material types on eliminating device short from occurring due to the wire sweeping phenomena. A full factorial experiment is performed using an active silicon device packaged in a thermally enhanced ball grid array (BGA) test vehicle. In addition, test characterization is carried out using x-ray and multiinsertions hot/cold continuity tests. Then, a detailed failure analysis is performed by package decapsulation and scanning electron microscopy/energy-dispersive x-ray (SEM/EDX) to confirm the experimental findings. In conclusion, the study finds that for an ultrafine-pitched thermally enhanced BGA package, wire type is insignificant to reduce wire shorting occurrences. However, mold material and copper heat spreader structure using an optimized wire loop design are significant factors in eliminating wiresweep shorting phenomena. This study concludes with a wirebond interconnect and heat slug design recommended along with an improved process parameters and assembly material sets found from the experiment.     

Crystallite growth characteristics in superfine zirconia powders and compacts

Crystallite growth characteristics of coprecipitated superfine zirconia powders have been investigated. It was found that the crystallite growth in powders follows a cubic law at 800 and 1000°C; however, the crystallite size data for compacts of both Y-TZP and YSZ cannot be fitted with a traditional parabolic or cubic law, but with a linear relation between crystallite size and the logarithm of time. In addition, it was also found that the degree of agglomeration of the powders can affect the crystallite growth.     

《石油沥青纸胎油毡》国家标准的修订

《石油沥青纸胎油毡》国家标准进行了第三次修订。本文介绍了修订的理由、修订的内容与依据，并与国内外同类产品标准进行了比较。     

Windows XP操作系统的应用技巧

介绍了Windows XP操作系统中一些应用技巧,对提高计算机的整体运行速度和工作稳定性有很大帮助.     

Hydrothermal Synthesis of Magnesium Aluminate Platelets

Magnesium aluminate (MgAl₂O₄) platelets were first synthesized by hydrothermal treatment of γ-AlO(OH) in a magnesium nitrate aqueous solution at 400°C. The platelets are 100–200 nm in width and 25 nm in thickness. The influence of temperature, the anions of the magnesium salt, the amount of magnesium salt, and precursor pH on the formation of such structure was investigated. The experimental results indicated that the anions of the magnesium salt and precursor pH could have a significant influence on the growth of MgAl₂O₄. MgAl₂O₄ formation followed the in situ transformation mechanism, which was the reason why the MgAl₂O₄ crystallites had a platelet morphology.