The effects of ferritic transformation on hot ductility of medium carbon steel

The hot ductilities of Nb-bearing and Nb-free medium carbon steel have been investigated by the hot tensile tests. A high carbon steel (0.4%) was also tested as a reference to determine the relationship between transformation temperature and hot ductility. C and Nb are very effective in delaying the ferrite transformation so that the ductility trough extended to a lower temperature compared to Nb-free medium carbon steel. Decreasing the strain rate promotes the formation of grain boundary ferrite films at higher temperatures and, on the low temperature side, the intergranular failure could still occur even when the amount of ferrite reached 40% or more. The short time temperature oscillation accelerated the precipitation of grain boundary films at higher temperatures, extending the ductility trough to higher temperatures. The samples tested on different machines (direct heating and induction heating) exhibited different hot ductility behavior.     

Virtual tree‐based multicast routing with a distributed numbering algorithm for WM‐ATM handover

The flexibility offered by the ATM transport mechanism and its potential capabilities, together with its compatibility with the B‐ISDN, makes ATM the prime candidate for the support of multimedia services over the wireless medium. However, technical issues remain to be resolved in relation to the feasibility of ATM for the support of mobility over the radio interface. This paper examines network issues in supporting handover in a wireless ATM network. In particular, analysis has been performed for a virtual tree-based network architecture. Results have shown that by using multicast transmission and by using a distributed numbering algorithm, the potential problems of cell-loss and cell-duplication have been eliminated. This revised version was published online in June 2006 with corrections to the Cover Date.     

Reduced thermal strain in flip chip assembly on organic substrateusing low CTE anisotropic conductive film

Flip chip assembly directly on organic boards offers miniaturization of package size as well as reduction in interconnection distances, resulting in a high performance and cost-competitive packaging method. This paper describes the usefulness of low cost flip-chip assembly using electroless Ni/Au bump and anisotropic conductive films on organic boards such as FR-4. As bumps for flip chip, electroless Ni/Au plating was performed as a low cost bumping method. Effect of annealing on Ni bump characteristics informed that the formation of crystalline nickel with Ni₃P precipitation above 300°C causes an increase of hardness and an increase of the intrinsic stress. As interconnection material, modified ACFs composed of nickel conductive fillers for conductive fillers, and nonconductive fillers for modification of film properties, such as coefficient of thermal expansion (CTE), were formulated for improved electrical and mechanical properties of ACF interconnection. Three ACF materials with different CTE values were prepared and bonded between Si chips and FR-4 boards for the thermal strain measurement using moire interferometry. The thermal strain of the ACF interconnection layer, induced by temperature excursion of 80°C, was decreased according to the decreasing CTEs of ACF materials. This result indicates that the thermal fatigue life of ACF flip chip assembly on organic boards, limited by the thermal expansion mismatch between the chip and the board, could be increased by low CTE ACF     

Coordinate-independent dyadic formulation of the dispersionrelation for bianisotropic media

This paper presents a coordinate-independent dyadic formulation of the dispersion relation for general bianisotropic media. The dispersion equation is expanded with the aid of dyadic operators including double-dot, double-cross and dot-cross or cross-dot products. From the dispersion relation, the Booker quartic equation is derived in a form well-suited for studying multilayered structures. Several deductions are made in conjunction with the bianisotropic media satisfying reciprocity and losslessness conditions. In particular, for reciprocal bianisotropic media, the dispersion equation is biquadratic in wave vector while for lossless bianisotropic media, all dispersion coefficients are of real values. As an application example, the dispersion equation for gyrotropic bianisotropic media is considered in detail     

A damping analysis of composite laminates using the closed form expression for the basic damping of Poisson's ratio

Various methods have been presented to obtain the effective damping of a symmetric laminated composite. In this paper, modified classical lamination theory based upon the elastic–viscoelastic correspondence principle was utilized by developing the basic damping of Poisson's ratio for accurately predicting the damping of laminated composite beams. The analysis involves an extension of the elastic–viscoelastic approach. Futhermore, Ni and Adams' theory was used for verifying the modified classical lamination theory. Six typical laminated composites with [±θ]_s,[0/θ]_s,[0/±θ/90]_s,[90/±θ/0]_s,[0/90/±θ]_s and [90/0/±θ]_s, stacking sequences were employed for this study. Numerical results have shown that damping values were in some difference among prediction methods over the particular range of fiber orientation.     

Walking pattern generation employing DAE integration method

A stable walking pattern generation method for a biped robot is presented in this paper In general, the ZMP (zero moment point) equations, which are expressed as differential equations, are solved to obtain a stable walking pattern However, the number of differential equations is less than that of unknown coordinates in the ZMP equations It is impossible to integrate the ZMP equations directly since one or more constraint equations are involved in the ZMP equations To overcome this difficulty, DAE (differential and algebraic equation) solution method is employed The proposed method has enough flexibility for various kinematic structures Walking simulation for a virtual biped robot is performed to demonstrate the effectiveness and validity of the proposed method The method can be applied to the biped robot for stable walking pattern generation     

A kinetic study of novel bimetallic titanocene catalyst for syndiospecific styrene polymerization

A kinetic study of a syndiospecific polymerization was performed with two kinds of catalysts: Cp*Ti(O(C₆H₄)CMe₂(C₆H₄)O)TiCp* [bimetallic system] and Cp*Ti(OMe)₃ [monometallic system]. The purpose of this study was to determine the reasons behind the high activity of a bimetallic catalyst system. The active site structures of the two kinds of catalysts appears to be similar to the cationic Ti [III] species having η⁵‐pentamethylcyclopentadienyl ligand, while the rate of the activation process of the bimetallic catalyst was found to be higher than that of the monometallic catalyst. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Nitric Oxide Generation and Endothelial Progenitor Cells Recruitment for Improving Hemocompatibility and Accelerating Endothelialization of Tissue Engineering Heart Valve

Tissue engineering heart valve (TEHV) offers great potential to overcome the limitations of commercial artificial valves used in clinical practice as a permanent prosthetic valve. Currently, decellularized heart valve (DHV) is the most widely used scaffold for TEHV, but showed suboptimal performance due to difficulty of endothelialization. Facilitating endothelialization of DHV is indispensable for better valve performance, and excellent hemocompatibility guarantees enough time windows for endothelialization process. Herein, a dual-functional TEHV scaffold with improving hemocompatibility and accelerating endothelialization is constructed by modifying DHV with copper ions (Cu) and growth differentiation factor 11 (GDF11). Results show the newly-constructed scaffold successfully generates endogenous nitric oxide (NO) through catalysis of Cu, and possesses improved hemocompatibility by down-regulating platelets activation and adhesion. Furthermore, GDF11 immobilization significantly accelerates scaffold endothelialization through facilitating recruitment, supporting growth, and alleviating apoptosis of endothelial progenitor cells . This TEHV scaffold shows favorable performance under in vivo hemodynamic environment with intact endothelial coverage and adaptive ECM remodeling, and without thrombus or calcification formation. This newly-constructed TEHV scaffold is expected to make up for the shortcomings of currently available prosthetic valves in clinical practice and has the potential possibility of rapid translation to the clinic as a better prosthetic valve.     

Effects of interlaminar stresses on damping of 0-degree unidirectional laminated composites

The principal aim of this paper is to formulate a general model for predicting damping in composites on the basis of the concept of strain energy-weighted dissipation. In this model, the effects of interlaminar stresses on damping have been included in addition to the effects of in-plane extension/compression and in-plane shear. Validation of the model was confirmed by performing damping measurements on 0° unidirectional composite beams with varying length and thickness. The results of theoretical predictions of damping in laminated composites were found to compare favorably with experimental data. The transverse shear (σ_xz) reveals to have a considerable effect on the damping mechanisms in 0° unidirectional polymer composites. However, the other interlaminar stresses (σ_yz, σ_z) were shown to have little influence on damping in composite beam.