Additive Manufacturing of Titanium Alloys by Electron Beam Melting: A Review

Electron beam melting (EBM), as one of metal additive manufacturing technologies, is considered to be an innovative industrial production technology. Based on the layer‐wise manufacturing technique, as‐produced parts can be fabricated on a powder bed using the 3D computational design method. Because the melting process takes place in a vacuum environment, EBM technology can produce parts with higher densities compared to selective laser melting (SLM), particularly when titanium alloy is used. The ability to produce higher quality parts using EBM technology is making EBM more competitive. After briefly introducing the EBM process and the processing factors involved, this paper reviews recent progress in the processing, microstructure, and properties of titanium alloys and their composites manufactured by EBM. The paper describes significant positive progress in EBM of all types of titanium in terms of solid bulk and porous structures including Ti–6Al–4V and Ti–24Nb–4Zr–8Sn, with a focus on manufacturing using EBM and the resultant unique microstructure and service properties (mechanical properties, fatigue behaviors, and corrosion resistance properties) of EBM‐produced titanium alloys.

     

Graphene Caging Silicon Particles for High‐Performance Lithium‐Ion Batteries

Silicon holds great promise as an anode material for lithium‐ion batteries with higher energy density; its implication, however, is limited by rapid capacity fading. A catalytic growth of graphene cages on composite particles of magnesium oxide and silicon, which are made by magnesiothermic reduction reaction of silica particles, is reported herein. Catalyzed by the magnesium oxide, graphene cages can be conformally grown onto the composite particles, leading to the formation of hollow graphene‐encapsulated Si particles. Such materials exhibit excellent lithium storage properties in terms of high specific capacity, remarkable rate capability (890 mAh g^?1 at 5 A g^?1), and good cycling retention over 200 cycles with consistently high coulombic efficiency at a current density of 1 A g^?1. A full battery test using LiCoO₂ as the cathode demonstrates a high energy density of 329 Wh kg^?1.     

Monitoring the Dynamic Process of Formation of Plasmonic Molecular Junctions during Single Nanoparticle Collisions

The capability to study the dynamic formation of plasmonic molecular junction is of fundamental importance, and it will provide new insights into molecular electronics/plasmonics, single‐entity electrochemistry, and nanooptoelectronics. Here, a facile method to form plasmonic molecular junctions is reported by utilizing single gold nanoparticle (NP) collision events at a highly curved gold nanoelectrode modified with a self‐assembled monolayer. By using time‐resolved electrochemical current measurement and surface‐enhanced Raman scattering spectroscopy, the current changes and the evolution of interfacial chemical bonding are successfully observed in the newly formed molecular tunnel junctions during and after the gold NP “hit‐n‐stay” and “hit‐n‐run” collision events. The results lead to an in‐depth understanding of the single NP motion and the associated molecular level changes during the formation of the plasmonic molecular junctions in a single NP collision event. This method also provides a new platform to study molecular changes at the single molecule level during electron transport in a dynamic molecular tunnel junction.     

Highly Uniform Resistive Switching Properties of Solution‐Processed Silver‐Embedded Gelatin Thin Film

The silver‐embedded gelatin (AgG) thin film produced by the solution method of metal salts dissolved in gelatin is presented. Its simple fabrication method ensures the uniform distribution of Ag dots. Memory devices based on AgG exhibit good device performance, such as the ON/OFF ratio in excess of 10⁵ and the coefficient of variation in less of 50%. To further investigate the position of filament formation and the role of each element, current sensing atomic force microscopy (CSAFM) analysis as well as elemental line profiles across the two different conditions in the LRS and HRS are analyzed. The conductive and nonconductive regions in the current map of the CSAFM image show that the conductive filaments occur in the AgG layer around Ag dots. The migration of oxygen ions and the redox reaction of carbon are demonstrated to be the driving mechanism for the resistive switching of AgG memory devices. The results show that dissolving metal salts in gelatin is an effective way to achieve high‐performance organic–electronic applications.     

Ultraviolet Photoluminescence of Carbon Nanospheres and its Surface Plasmon‐Induced Enhancement

Ultraviolet (UV) light can be used in versatile applications ranging from photoelectronic devices to biomedical imaging. In the development of new UV light sources, in this study, stable UV emission at ≈350 nm is unprecedentedly obtained from carbon nanospheres (CNSs). The origin of the UV fluorescence is comprehensively investigated via various characterization methods, including Raman and Fourier transform infrared analyses, with comparison to the visible emission of carbon nanodots. Based on the density functional calculations, the UV fluorescence is assigned to the carbon nanostructures bonded to bridging O atoms and dangling –OH groups. Moreover, a twofold enhancement in the UV emission is acquired for Au‐carbon core‐shell nanospheres (Au‐CNSs). This remarkable modification of the UV emission is primarily ascribed to charge transfer between the CNSs and the Au surface.     

Reproducible Enhancement of Fluorescence by Bimetal Mediated Surface Plasmon Coupled Emission for Highly Sensitive Quantitative Diagnosis of Double‐Stranded DNA

Plasmonic enhancement of fluorescence from SYBR Green I conjugated with a double‐stranded DNA (dsDNA) amplicon is demonstrated on polymerase chain reaction (PCR) products. Theoretical computation leads to use of the bimetallic (Au 2 nm–Ag 50 nm) surface plasmons due to larger local fields (higher quality factors) than monometallic (Ag or Au) ones at both dye excitation and emission wavelengths simultaneously, optimizing fluorescence enhancement with surface plasmon coupled emission (SPCE). Two kinds of reverse Kretschmann configurations are used, which favor, in signal‐to‐noise ratio, a fluorescence assay that uses optically dense buffer such as blood plasma. The fluorescence enhancement (12.9 fold at maximum) with remarkably high reproducibility (coefficient of variation (CV) < 1%) is experimentally demonstrated. This facilitates credible quantitation of enhanced fluorescence, however unlikely to obtain by localized surface plasmons. The plasmon‐induced optical gain of 46 dB due to SPCE‐active dye molecules is also estimated. The fluorescence enhancement technologies with PCR enables LOD of the dsDNA template concentration of ≈400 fg µL^?1 (CV < 1%), the lowest ever reported in DNA fluorescence assay to date. SPCE also reduces photobleaching significantly. These technologies can be extended for a highly reproducible and sufficiently sensitive fluorescence assay with small volumes of analytes in multiplexed diagnostics.     

Laser‐Assisted Large‐Scale Fabrication of All‐Solid‐State Asymmetrical Micro‐Supercapacitor Array

The micro‐supercapacitors are of great value for portable, flexible, and integrated electronic equipments. Here, the large‐scale and integrated asymmetrical micro‐supercapacitor (AMSC) array is fabricated in virtue of the laser direct writing and electrodeposition technology. The AMSC shows the ideal flexibility, high areal specific capacitance (21.8 mF cm^?2), and good rate capability. Moreover, its energy density reaches 12.16 µW h cm^?2, outperforming most micro‐supercapacitors reported previously. Meanwhile, large‐scale series‐connected AMSCs are integrated on the flexible substrates (e.g., indium tin oxide‐polyethylene terephthalate film), which can power a veriety of the commercial electronics. The combination of AMSCs array, solar cell, and electronic device proves the feasibility for practical application in the portable, flexible, and integrated electronic equipments.