多级脉冲深穿透射孔技术

目前国内较先进的射孔工艺是增效射孔和三相流射孔,这2种射孔工艺均存在射孔深度和造缝深度浅的问题,尤其是对低渗油藏和纵向渗透率远大于横向渗透率的油藏,此造缝深度并不能满足油田生产的需要.介绍了一种新型的射孔技术,它是一种能进行深度射孔造缝的多级射孔技术,利用三级推进剂燃爆时产生峰值不连续的高温、高压气流,形成多级脉冲,多次冲击射孔孔眼前沿的裂缝,使其有效延伸至地层深处,从而较单独的射孔更能有效地增加油气产量.通过地面水泥靶的试验,证明了该射孔器的延缝功能和安全性;通过塘32等井的现场试验,证明该射孔技术对污染地层解堵有显著效果,可明显地降低地层破裂压力.     

A Novel Athermal 40-Channel DWDM Multi/Demultiplexer Based on the Combination of AWGs and Interleaver

An athermal 40-channel dense wavelength-division-multiplexing multi/demultiplexer using a novel combination technology is proposed. It consists of one 1times4 100- to 400-GHz spacing interleaver filter and four sub-arrayed-waveguide gratings (AWGs). The temperature-dependent wavelength shift of the combined device is successfully suppressed to 0.058 nm in the -20degC to 70degC temperature range. Moreover, the combined device's adjacent crosstalk (typically -35 dB) is much better than conventional AWGs (typically -25 dB).     

Reliability Analysis on the δ-Shock Model of Complex Systems

We investigate the delta-shock model of complex systems consisting of n i.i.d. components. We first obtain a general lifetime distribution for the delta-shock model of a general complex system by reducing the system to a linear combination of parallel systems. We then consider coherent system structures including series, parallel, and k-out-of-n, then derive some useful results including reliability bounds, bounds on the mean lifetime, limiting distributions, and Laplace-Stieltes transforms     

中压变频器在宣钢炼钢厂除尘风机中的应用

本文介绍了SIMOVERT MV中压变频器在宣钢炼钢厂一次除尘风机中的应用情况。变频器现场运行表明，采用中压变频器对转炉除尘风机进行调速节能获得了成功，节能效果明显。     

房屋建筑结构无损检测方法的分析与展望

通过对现有的结构无损检测方法的总结和分析,讨论了各种方法的优缺点.并结合现场测试的要求,展望结构检测技术的发展方向与趋势.     

企业经营理念的思考

在经营实践中,企业的灵魂是经营理念,成功的企业必有科学、合理的经营理念做指导,经营理念是企业生存发展的决定因素.     

一种制备磁性粉末的新技术--均匀颗粒成型法

采用均匀颗粒成型法（Uniform Dropler Spray-UDS）制备Fe基合金粉末，该方法制备的颗粒粒度分布均匀，性能一致，大大优于传统的粉末制备方法（如破碎法、气雾化），具有广阔的应用前景。本文分析了粉末制备过程中颗粒尺寸的影响因素，结果表明：颗粒的大小主要取决于坩埚底部小孔、坩埚内外气体压强差以及振荡频率三个独立变量。     

Impact of temperature cycle profile on fatigue life of solder joints

In this paper the influence of the temperature cycle time history profile on the fatigue life of ball grid array (BGA) solder joints is studied. Temperature time history in a Pentium processor laptop computer was measured for a three-month period by means of thermocouples placed inside the computer. In addition, Pentium BGA packages were subjected to industry standard temperature cycles and also to in-situ measured temperature cycle profiles. Inelastic strain accumulation in each solder joint during thermal cycling was measured by high sensitivity Moire interferometry technique. Results indicate that fatigue life of the solder joint is not independent of the temperature cycle profile used. Industry standard temperature cycle profile leads to conservative fatigue life observations by underestimating the actual number of cycles to failure.