采用双相码高速传输水下声数据的一种方法

本文说明了利用单芯同轴电缆高速传输水下声数据的必要性,并给出了一种采用双相码的水下声数据基带传输方法,实验结果表明了该方案的优越性。     

试论摄像构图的实际运用

试论摄像构图的实际运用浙江电视台顾俊杰构图，是画面语言表达的基础。当我们端起摄像机，对准我们想拍摄的任何物体与空间进行拍摄时，构图──就已经产生。只是这样的构图是否合理，是否到位而已。自然景物之浩繁，生活范畴之广大，为我们的拍摄提供了广阔的天地。同时...     

“火”爆债务纠纷 铸成大祸坐牢

处理债务纠纷，本应清醒理智，通过正当的法律途径来解决，而犯罪嫌疑人朱某却走向极端。日前，涉嫌纵火的朱某已被许昌市魏都公安分局依法刑事拘留。     

应用焊道长度控制线能量

运用ＨｅｒｂｓｔＦＷ公式原理对国产碱性条件进行了大量试验，建立了焊接线能量（Ｅ），焊条熔化长度（ｌＥ），焊道长度（ｌＲ）的关系式：Ｅ＝８０８Ｄ１．８ｌＥ／ｌＲ。并应用线算图和ＳＨ－ＣＣＴ图对该式施焊结果验证，热影响区的金相组织，硬度基本一致。因此，可以应用焊道长度校核与控制线能量。     

SERT结晶器液位控制系统

介绍一种梅山冶金公司板坯连同上应用的新型的结晶器液位控制系统，它由浮式式液位检测装置，ＲＳＥ１０００控制器和电动塞棒执行机构所组成，由法国ＳＥＲＴ公司成套制造。     

Mensuration and simulation of mold filling process in semi-solid die-cast of aluminum alloy

To understand the flow trace of semi-solid slurry in mold cavity, some thermocouples were inserted in mold cavity, and the reaction timing of thermocouples showed the arrival of fluid. The filling time and rate were estimated by comparison between the experiment and calculation. The introduction of computer simulation technique based on ADSTEFAN was to predict injectionforming process and to prevent defects during trial manufacture of various parts. By comparing the formed appearance of parts in experiment and in simulation, and observing the relationship between internal defects inspected by X-ray or microscope and the flow field obtained in simulation, it was indicated that both have quite good agreement in simulation and experiment. Right predictions for cast defects resulted from mold filling can be carried out and proper direction was also proposed. The realization of numerical visualization for filling process during semi-solid die-cast process will play an important role in optimizing technology plan.     

黄铜中纳米级微裂纹的形核与钝化

黄铜薄膜试样在透射电镜中原位拉伸观察表明，在平衡条件下加载裂发出的位错纯化成无位错区，它是一个应变很高的异常弹性区。当缺口足够锐，外加载荷足够大时，这个非线弹性区中的应力有可能达到原子键合力，从而使纳米级微裂纹在无位错区中不连续形核，或从钝化的原裂纹顶端形核。这个微裂纹一昊形核，即使保持恒位移，也将钝化成空洞或缺口。     

热处理对A356/6082复合板界面组织及力学性能的影响

采用液-固轧制复合技术制备A356/6082复合板,研究热处理温度对A356/6082复合板界面组织及力学性能的影响。结果表明,随着热处理温度的升高,A356铝合金一侧共晶Si组织发生颈缩、溶断、球化,并且球化现象首先在界面处发生,界面区剪切强度逐渐增大。当热处理温度为550℃时,复合界面处组织分布均匀,Si颗粒细小圆整,界面区元素得到充分扩散,元素扩散宽度约为136μm,复合板剪切强度最大值约为145MPa,复合界面在受到均匀塑性变形时,其剪切断裂方式为脆性断裂。