Micro-electro-discharge machining as microsensor fabrication technology

This paper presents the design and fabrication of three miniaturized mechanical sensors to demonstrate the three-dimensional machining capabilities of micro-electro-discharge machining (EDM). The first sensor is an inertial bi-axial inclination sensor. The displacement of an inertial mass is measured optically by means of a two-dimensional position sensitive device (PSD). The machining freedom of micro-EDM makes it possible to produce both sensor and housing in one monolithic structure. The second sensor is an inertial uni-axial inclination sensor, which demonstrates the compatibility of the micro-EDM technology with the conventional photolithographic micromachining technologies. The mechanical structure of the sensor is machined by micro-EDM and the capacitive sensing part is produced by lithography. The aim of the integration is to set up a hybrid technology, which inherits the benefits of both micro-EDM and photolithography. The third miniaturized sensor is a three-component force sensor. The mechanical structure of the force sensor converts forces into displacements, which are measured optically. The mechanical structure of the force sensor is produced by wire-EDM and micro-EDM.     

Multi‐layered flat‐surface micro‐optical components directly molded on an LCD panel

Abstract— We have developed a process to fabricate optical components, such as a lens, prism, or diffuser, directly on to a glass substrate. Processes include precision mastering by diamond cutting and multi‐layer photopolymer (2P) molding to realize flat surfaces and the integration of multiple components with an alignment within a few micrometers.     

Optical measurements of thermal diffusivity of a material

The measurement of thermal diffusivity of a material (in particular, a thin film) is important for various reasons, e.g., to predict the heat transfer in the solid subjected to a thermal process, to monitor surface composition or morphology, or to detect invisible subsurface defects like delaminations. This measurement can be done in a noncontact manner using various photothermal methods. Such methods typically involve pulsed heating of the surface by small amounts using a laser source; the decay of the surface temperature after this pulsed photothermal heating is then probed to provide the thermal diffusivity. Various probing methods have been developed in the literature, including the probing of reflection, refraction, and diffraction from the pulsed heated area, infrared thermal radiometry, and surface deformation. This paper provides an overview of such techniques and some examples of their applications.     

Degradation of junction leakage in devices subjected to gateoxidation in nitrous oxide [MOS transistors]

Nitrided gate oxides offer several electrical and reliability advantages over conventional oxides and also provide a good barrier against impurity diffusion. Oxidation in nitrous oxide (N₂O) has been very successful in overcoming some of the problems associated with nitridation in ammonia. The authors have observed that the extent of N₂O oxidation has a strong detrimental effect on the drain leakage current of MOS transistors in the off state. This phenomenon has been identified to be caused by an increase in the active area junction leakage current