Estimation of failure probability from a bivariate normal stress-strength distribution

Probability (P) of equipment failure consequent upon stress exceeding built-in strength has been estimated assuming a bivariate normal stress-strength distribution. The UMVUE of P when parameters other than the means are known has been derived. An alternative estimator based on maximum likelihood estimates has been proposed in the case when all the five parameters are unknown. Asymptotic variances of both these estimators have been worked out. Some relevant numerical computations have also been reported.     

Integrating design and measurement

At the 2004 International Instrumentation and Measurement Conference in Italy, a number of us were discussing the growing importance of system-level design and the implications for simulation and measurement technologies. It was puzzling to us that technology continues to increase in complexity, yet the last two decades have seen the design world of simulation and modeling diverge from the world of measurement and testing. Today's systems, whether they are commercial products or scientific experiments, require a convergence of technologies that makes performance measurement and validation not only more critical but also more prone to error. In the discussions a point that came up repeatedly was the value of bringing the design and test communities closer together, and it was suggested that it was timely to highlight this issue. With that in mind, this note aims to stimulate community discussion by first examining some benefits and challenges of integration and then outlining possible directions for collaboration between the simulation and measurement communities.     

Nanolayered lightweight flexible shields with multidirectional optical transparency

New nanolayered coatings are designed and deposited on flexible plastic substrate having the thickness of 100 /spl mu/m, in order to realize lightweight ultrathin transparent shielding foils. The structure of the coating is optimized considering three figures of merit: the average transmittance in the visible range for normal incidence, the normalized average transmittance for oblique incidence at 550 nm, and the transmittance quality factor. The nanotechnology exploited for the deposition of the transparent metals is the dual ion beam sputtering. Tests of durability, optical transmission, and shielding effectiveness demonstrate that the film has a high adhesion under mechanical solicitation, high resistance against aging, peak transmittance in the visible range higher than 70%, omnidirectional properties in the range 0/spl deg/-60/spl deg/, and shielding effectiveness of 40 dB up to 6 GHz.     

Minimizing power dissipation in optical interconnects at low voltage using optimal modulator design

A strong motivation for insertion of optical interconnects in short-distance applications such as chip-to-chip or back-plane communication, apart from high bit rates, is their potential to achieve these bit rates at low power compared to the currently prevalent copper based interconnects. Thus, it is imperative to construct design methodologies which minimize the total optical link power dissipation. We present one such methodology, where we optimize the quantum-well modulators to minimize the power dissipation in modulator-based optical interconnects. In the first part of the paper, the focus is on obtaining the optimal modulator metrics [contrast ration (CR) and insertion loss], which yield the lowest total power (receiver and the modulator). The trends are studied as a function of the input laser power and bit rate. Having obtained the desirable modulator metrics and the corresponding power dissipation, in the second part, the focus is on the feasibility of these metrics in the light of voltage swing constraints. The biggest concern with the modulator based optical link is the low CR, especially at low voltage swing. While studying these concerns, we also provide insight into the physical design of the modulator including, its intrinsic region thickness, pre-bias voltage, and the size and the number of quantum-wells. Specifically, we outline the method to obtain the design parameters, which allows minimum power dissipation with the least laser power. This ultimately yields higher aggregate I/O bandwidth for chip to chip communication in power limited chips.     

Measurement of the working parameters of an air-post vertical-cavity surface-emitting laser

We present a complete experimental evaluation of the effective parameters necessary to describe the dynamical behavior of an air-post vertical-cavity surface-emitting lasers, on the basis of theoretical equations which are also derived in this paper. The experimental investigation is composed of several steps, including power versus current measurement, noise spectrum analysis, linewidth evaluation. The complete set of parameters derived, in particular the linewidth-enhancement factor and the spontaneous emission factor, is particularly important for accurate comparisons of theoretical models on the laser dynamics with experiments.     

A 300-MHz 25-/spl mu/A/Mb-leakage on-chip SRAM module featuring process-variation immunity and low-leakage-active mode for mobile-phone application processor

An on-chip 1-Mb SRAM suitable for embedding in the application processor used in mobile cellular phones was developed. This SRAM supports three operating modes - high-speed active mode, low-leakage low-speed active mode, and standby mode - and uses a subdivisional power-line control (SPC) scheme. The combination of three operating modes and the SPC scheme realizes low-power operation under actual usage conditions. It operates at 300 MHz, with leakage of 25 /spl mu/A/Mb in standby mode, and 50 /spl mu/A/Mb at the low-leakage active mode. This SRAM also uses a self-bias write scheme that decreases of minimum operating voltage by about 100 mV.     

Self-Adapting Linear Algebra Algorithms and Software

One of the main obstacles to the efficient solution of scientific problems is the problem of tuning software, both to the available architecture and to the user problem at hand. We describe approaches for obtaining tuned high-performance kernels and for automatically choosing suitable algorithms. Specifically, we describe the generation of dense and sparse Basic Linear Algebra Subprograms (BLAS) kernels, and the selection of linear solver algorithms. However, the ideas presented here extend beyond these areas, which can be considered proof of concept.     

Effect of temperature and cyclic heating on the structure and strength of glass textolite

The article established the regularities of change of the physicomechanical characteristics and strength of glass textolites in single and repeated thermal loading. It shows that under multiple loading the intense loss of strength of the investigated materials is due to increased porosity on account of the large number of microcracks appearing in the structure. A correlation is obtained between the elastic and strength characteristics and porosity in dependence on the temperature of multiple heating which in the first approximation is described by a polynomial of second degree with respect to temperature, multiplied by the reciprocal of porosity.Translated from Problemy Prochnosti, No. 6, pp. 53–58, June, 1991.