全文获取类型
收费全文 | 23598篇 |
免费 | 458篇 |
国内免费 | 739篇 |
专业分类
电工技术 | 462篇 |
综合类 | 65篇 |
化学工业 | 2587篇 |
金属工艺 | 2250篇 |
机械仪表 | 959篇 |
建筑科学 | 482篇 |
矿业工程 | 56篇 |
能源动力 | 881篇 |
轻工业 | 1160篇 |
水利工程 | 159篇 |
石油天然气 | 368篇 |
武器工业 | 5篇 |
无线电 | 2773篇 |
一般工业技术 | 6653篇 |
冶金工业 | 3869篇 |
原子能技术 | 310篇 |
自动化技术 | 1756篇 |
出版年
2023年 | 51篇 |
2022年 | 129篇 |
2021年 | 196篇 |
2020年 | 141篇 |
2019年 | 255篇 |
2018年 | 417篇 |
2017年 | 397篇 |
2016年 | 452篇 |
2015年 | 356篇 |
2014年 | 567篇 |
2013年 | 1539篇 |
2012年 | 910篇 |
2011年 | 1404篇 |
2010年 | 1099篇 |
2009年 | 1288篇 |
2008年 | 1296篇 |
2007年 | 1305篇 |
2006年 | 1146篇 |
2005年 | 1049篇 |
2004年 | 871篇 |
2003年 | 798篇 |
2002年 | 759篇 |
2001年 | 736篇 |
2000年 | 701篇 |
1999年 | 734篇 |
1998年 | 1471篇 |
1997年 | 1047篇 |
1996年 | 908篇 |
1995年 | 564篇 |
1994年 | 456篇 |
1993年 | 373篇 |
1992年 | 239篇 |
1991年 | 245篇 |
1990年 | 156篇 |
1989年 | 170篇 |
1988年 | 120篇 |
1987年 | 86篇 |
1986年 | 58篇 |
1985年 | 59篇 |
1984年 | 37篇 |
1983年 | 31篇 |
1982年 | 26篇 |
1981年 | 29篇 |
1980年 | 16篇 |
1979年 | 8篇 |
1978年 | 8篇 |
1977年 | 8篇 |
1976年 | 19篇 |
1975年 | 11篇 |
1973年 | 10篇 |
排序方式: 共有10000条查询结果,搜索用时 15 毫秒
991.
992.
993.
X. H. Zeng D. Wang D. R. Ni B. L. Xiao 《Science & Technology of Welding & Joining》2018,23(6):478-486
Two millimetres thick Al–Mg–Si (6061Al-T6) alloy plates were friction stir welded at various welding conditions. Under a low rotation rate of 400?rev?min–1 with rapid water cooling, the softening zone in the joint disappeared and a nanostructure with an average grain size of 80?nm was obtained in the stir zone (SZ). Therefore, a weld with equal strength to the parent metal (PM) was successfully achieved with the fracture occurring in the PM. Further, the average microhardness and ultimate tensile strength (UTS) of the SZs increased with the decreasing rotation rate and increasing cooling speed. The average microhardness and UTS of the SZ with nanostructure reached up to 134?HV and 505?MPa, respectively; though the initial strengthened precipitates disappeared. This work provides an effective strategy of achieving high property joints and enhancing the mechanical properties of precipitation-hardened Al alloys. 相似文献
994.
C. P. Wang H. Liu M. J. Yang H. X. Jiang H. Y. Zhang X. J. Liu 《Journal of Phase Equilibria and Diffusion》2018,39(1):35-43
Phase equilibria of the Cu–Mo–Ti ternary system at 800 and 900 °C have been experimentally investigated using electron probe microanalysis and x-ray diffraction analysis. A ternary intermetallic compound (τ phase) was newly found, exhibiting a homogeneity range at both 800 and 900 °C. Furthermore, the nominal as-cast alloys Cu50Mo10Ti40, Cu30Mo30Ti40, Cu15Mo50Ti35, Cu40Mo30Ti30, Cu15Mo20Ti65, Cu15Mo30Ti55, Cu15Mo25Ti60, Cu40Mo10Ti50, and Cu60Mo5Ti35 presented a common separated microscopic morphology because of the ternary extent of the Cu–Mo binary liquid phase separation. The newly determined phase equilibria may provide essential information to support thermodynamic assessment and development of Cu–Mo-based alloys. 相似文献
995.
基于密度泛函理论的第一性原理方法,研究了点缺陷和Nb原子掺杂对α-Zr力学性质的影响。结果表明,单空位引入使得α-Zr的剪切模量增大,Nb原子掺杂使得α-Zr的剪切模量下降。通过计算含不同点缺陷的α-Zr三维杨氏模量,得到点缺陷引入和Nb掺杂均会使α-Zr结构的各向异性减弱,从而可以在一定程度上缓解因各向异性导致的锆合金辐照效应。 相似文献
996.
本文对近年来钎焊铜铝异种材料的相关研究进行回顾,分析了在接头形成与服役时,焊缝中金属间化合物(IMCs)的形成与生长。结果表明,金属间化合物的形成与生长在接头形成与服役过程中是不可避免的。金属间化合物的形成和生长取决于铜铝之间以及与钎料之间的原子相互扩散。金属间化合物的形核和生长必须同时满足热力学与动力学条件。脆硬性金属间化合物容易引起应力集中,且其形成与生长会加剧扩散原子的消耗,因此金属间化合物的形成与生长是导致接头缺陷(如孔洞、空洞和裂纹)的主要原因之一。当界面处金属间化合物层的厚度超过2~5μm时,接头性能会急剧下降。影响金属间化合物生长与扩散和接头缺陷的主要因素有温度,导热性,接头设计,热输入和钎料成分等。以上因素主要通过改变原子扩散过程影响金属间化合物的形成与生长。目前,控制金属间化合物形成与生长的主要方法有控制接头热输入、优化接头设计和在钎料中添加第三元素等。 相似文献
997.
Timely context awareness is key to improving operation efficiency and safety in human-robot collaboration (HRC) for intelligent manufacturing. Visual observation of human workers’ motion provides informative clues about the specific tasks to be performed, thus can be explored for establishing accurate and reliable context awareness. Towards this goal, this paper investigates deep learning as a data driven technique for continuous human motion analysis and future HRC needs prediction, leading to improved robot planning and control in accomplishing a shared task. A case study in engine assembly is carried out to validate the feasibility of the proposed method. 相似文献
998.
Y. B. Li Q. X. Zhang L. Qi S. A. David 《Science & Technology of Welding & Joining》2018,23(7):619-627
A ring-shaped permanent magnet is applied in resistance spot welding to improve the weld quality of austenitic stainless steel. Under the action of an external magnetic field, the profile of the weld nugget became peanut-shaped instead of ellipsoidal. The crystal orientation near the faying surface was less directional, and equiaxed grains were formed in weld nugget centre. Moreover, the shrinkage cavities tendency in traditional resistance spot welds was reduced. The relatively slow cooling speed could cause element segregation and thus change solidification mode and significantly affect weld microstructures. The mechanical performance of the welds was finally improved by the applied external magnetic field in terms of microhardness and lap-shear strength. 相似文献
999.
采用Ti-28Ni(wt.%)共晶钎料在1100℃实现了高铌TiAl合金(Ti-45Al-8.5Nb-(W, B, Y) (at.%), 简称TAN)的真空钎焊连接。钎焊接头的典型界面结构为TAN/τ3-Al3Ti2Ni + B2/α2-Ti3Al layer/α2-Ti3Al + δ-Ti2Ni/α2-Ti3Al layer/τ3-Al3Ti2Ni + B2/TAN。深入研究了保温时间对钎焊接头界面组织和连接性能的影响。结果表明:Ni元素从熔融钎料向TAN母材的扩散决定了界面组织的演化,随着保温时间的延长促进了扩散层的增厚,同时导致钎缝宽度逐渐减小。接头剪切强度测试结果显示当保温时间为15分钟时,获得的最大接头室温剪切强度和高温(600℃)剪切强度分别是248.6MPa和166.4MPa。接头断口分析表明在剪切实验中裂纹主要沿着连续的金属间化合物层产生和扩展。 相似文献
1000.
X. J. Liu C. Wu M. J. Yang J. H. Zhu S. Y. Yang Z. Shi Y. Lu J. J. Han C. P. Wang 《Journal of Phase Equilibria and Diffusion》2018,39(6):820-831
The phase equilibria in the Cu-Sn-Sb ternary system were investigated by means of electron-probe microanalysis and x-ray diffraction. Firstly, ternary solubilities of η-Cu6Sn5, δ-Cu41Sn11, Cu11Sb3, ε-Cu3Sb and η-Cu2Sb, were less than 7 at.% Sb or Sn at 400 °C. Besides, an re-stabilized ternary solubility, Cu6(Sn,Sb)5, was detected with a homogeneity range of Cu: 52.9-53.3 at.%, Sn: 28.4-30.9 at.%, and Sb: 15.8-18.7 at.%. Its origin was traced back to high-temperature stabilization of the binary η-Cu6Sn5 phase. Thirdly, the metastable phase, Cu11Sb3, was observed at 400 °C in the Cu-Sn-Sb ternary system; On raising the temperature to 500 °C, the ε-Cu3Sn phase still retained a large solubility for Sb, at?~?16 at.%, while the ε-Cu3Sb was replaced by β-Cu3Sb with a dual-cornered large homogeneity range. Similarly, a ternary homogeneity range of Cu: 83.8-84.9 at.%, Sn: 2.6-6.2 at.%, and Sb: 9-12.5 at.%, was found and deduced to be the high temperature stabilization phase of γ-Cu11(Sb,Sn)2 at 500 °C. 相似文献